Patents by Inventor Robert Kalman

Robert Kalman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
    Publication number: 20240137132
    Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
    Type: Application
    Filed: October 25, 2023
    Publication date: April 25, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • Bit-wise inverse multiplexing for optical channels utilizing microLEDs
    Patent number: 11949455
    Abstract: An optical communication system may include microLEDs for use in communicating data between chips or multi-chip modules. The number of microLEDs may be greater than a number of electrical data lines for carrying data to be communicated. Signals on the electrical data lines may be inverse multiplexed, for example to allow for operation of the microLEDs at a rate slower than operation of electrical circuitry generating signals on the electrical data lines.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: April 2, 2024
    Assignee: Avicena Tech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov
  • PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
    Publication number: 20240085622
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
    Publication number: 20240072895
    Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.
    Type: Application
    Filed: September 12, 2023
    Publication date: February 29, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Systems using fan-in and fan-out microLED-based interconnects
    Patent number: 11914200
    Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: February 27, 2024
    Assignee: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Parallel optical communication channels using microLEDs
    Patent number: 11916598
    Abstract: Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: February 27, 2024
    Assignee: AvicenaTech Corp.
    Inventors: Robert T. Weverka, Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • Embedding LEDs with waveguides
    Patent number: 11906779
    Abstract: A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: February 20, 2024
    Assignee: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • INTEGRATION OF OE DEVICES WITH ICS
    Publication number: 20240053558
    Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
  • MULTI-ARRAY PARALLEL OPTICAL LINKS
    Publication number: 20240045155
    Abstract: An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 8, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov
  • MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS
    Publication number: 20240036246
    Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 1, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshiki, Alexander Tselikov, Cameron Danesh
  • COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
    Publication number: 20240022330
    Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 18, 2024
    Applicant: AVICENATECH CORP.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
    Publication number: 20240012215
    Abstract: Light from one or more microLEDs may be coupled into multiple waveguide cores. Parabolic reflectors, truncated parabolic reflectors, and encapsulants may be used to increase fraction of emitted light coupled into the waveguide cores.
    Type: Application
    Filed: September 22, 2023
    Publication date: January 11, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OPTICAL FIBER
    Publication number: 20230412282
    Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Applicant: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
  • Packaging for microLEDs for chip to chip communication
    Patent number: 11835758
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: December 5, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Integration of OE devices with ICs
    Patent number: 11822138
    Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: November 21, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
  • Multi-array parallel optical links
    Patent number: 11822135
    Abstract: An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: November 21, 2023
    Assignee: Avicena Tech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov
  • Interconnect networks using microLED-based optical links
    Patent number: 11824590
    Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: November 21, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • Multi-layer planar waveguide interconnects
    Patent number: 11815712
    Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: November 14, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • OPTICALLY-ENHANCED MULTICHIP PACKAGING
    Publication number: 20230344518
    Abstract: Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Applicant: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • Coherent fiber bundle parallel optical links
    Patent number: 11791901
    Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: October 17, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh