Abstract: An optical interconnect may include an array of microLEDs driven to generate light based on data and/or clock signals, an array of photodetectors to receive the light and generate electrical signals corresponding to the data and/or clock signals, and optical fibers providing at least part of a pathway between the microLEDs and the photodetectors. A reflector structure for each of the microLEDs assists in coupling light from the microLEDs into the optical fibers. The reflector structure may be in the form of a compound parabolic concentrator (CPC).

Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.

Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.

Abstract: A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the optical transceiver die. The lid may protect the optical transceiver array of the optical transceiver die, and the frame may help in aligning optical coupling assembly with the optical transceiver array.

Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.

Abstract: A circular microLED with a p portion and an n portion both having circular cross-sections along a common axis. The p portion and the n portion may each have a cylindrical and/or frustoconical shapes. The n portion may have circular cross sections greater than the p portion. The n portion may also have an annular contact. The microLED may be a flip chip microLED, with a p contact within a shell defined by the annular n contact.

Abstract: A time of flight system may include one or more microLEDs and a photodetector monolithically integrated with integrated circuitry of the time of flight system. The microLEDs may be doped to provide increased speed of operation.

Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.

Abstract: A multi-chip package may include a system-on-chip (SoC) and an optical IO subassembly on a common substrate. The SoC and the optical IO subassembly may be linked by a die-to-die interface. The optical IO subassembly may include an optical IO IC with microLEDs and/or photodetectors bonded to a surface of the optical IO IC away from the common substrate. An optical window layer may shield optical elements of the optical IO subassembly from damage relating to molding compound related operations during assembly.

Abstract: An optical interconnect may include an optoelectronic IC mounted to a substrate. The optoelectronic IC may have optoelectronic devices, for example microLEDs and/or photodetectors, mounted to a surface of the optoelectronic IC away from the substrate. The optoelectronic IC may have circuitry for driving the microLEDs and/or processing electrical signals from the photodetectors. The optoelectronic IC may be interfaced to a D2D interface chip. The D2D interface chip may be mounted to the optoelectronic IC.

Abstract: A lateral photodetector may include a high e-field multiplication region. The high e-field multiplication region may be provided by lightly p doping areas adjacent to or near an n-finger of the photodetector. The high e-field multiplication region may also be provided by providing a slightly conducting horizontal plane between p-fingers and n-fingers of the photodetector. The photodetector may be grown on a silicon substrate, which is etched to form a gap to allow for light to reach the photodetector through the gap.

Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.

Abstract: Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.

Abstract: An optical communication system may include microLEDs for use in communicating data between chips or multi-chip modules. The number of microLEDs may be greater than a number of electrical data lines for carrying data to be communicated. Signals on the electrical data lines may be inverse multiplexed, for example to allow for operation of the microLEDs at a rate slower than operation of electrical circuitry generating signals on the electrical data lines.

Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.

Abstract: Optoelectronic subassemblies may be bonded to base integrated circuit chips (ICs). The optoelectronic subassemblies may be ICs themselves, with optical emitters and/or photodetectors bonded to those ICs. In some embodiments active sides of the OE ICs may be bonded to active sides of the base ICs. In some embodiments non-active sides of the OE ICs may be bonded to active sides of the base ICs. In some embodiments active sides of the OE ICs may be bonded to non-active sides of the base ICs. And in some embodiments non-active sides of the OE ICs may be bonded to non-active sides of the base ICs.

Abstract: MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Abstract: A time of flight system may include one or more microLEDs and a photodetector monolithically integrated with integrated circuitry of the time of flight system. The microLEDs may be doped to provide increased speed of operation.

Abstract: Parallel optical interconnects may be used to transmit signals produced by integrated circuits. A parallel optical interconnect may be in the form of a multicore optical fiber and one or more optical coupling assemblies optically connecting a first optical transceiver array and a second optical transceiver array. The multicore optical fiber may have multiple fiber elements with each having a core surrounded by cladding, and the one or more optical coupling assemblies may have refractive and/or reflective elements. In this way, light produced by one transceiver array may be transmitted through the multicore optical fiber and be received by the other transceiver array.

Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.