Abstract: An optical communication system may include microLEDs for use in communicating data between chips or multi-chip modules. The number of microLEDs may be greater than a number of electrical data lines for carrying data to be communicated. Signals on the electrical data lines may be inverse multiplexed, for example to allow for operation of the microLEDs at a rate slower than operation of electrical circuitry generating signals on the electrical data lines.

Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.

Abstract: MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Abstract: A time of flight system may include one or more microLEDs and a photodetector monolithically integrated with integrated circuitry of the time of flight system. The microLEDs may be doped to provide increased speed of operation.

Abstract: Parallel optical interconnects may be used to transmit signals produced by integrated circuits. A parallel optical interconnect may be in the form of a multicore optical fiber and one or more optical coupling assemblies optically connecting a first optical transceiver array and a second optical transceiver array. The multicore optical fiber may have multiple fiber elements with each having a core surrounded by cladding, and the one or more optical coupling assemblies may have refractive and/or reflective elements. In this way, light produced by one transceiver array may be transmitted through the multicore optical fiber and be received by the other transceiver array.

Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.

Abstract: A microLED-based optical interconnect may include an optical coupling assembly having a first optical coupling subassembly and a second optical coupling subassembly, which may be coupled together. The first optical coupling subassembly may interface to an IC having an array of optoelectronics devices on its surface. The second optical coupling assembly may receive an end of a fiber optic bundle. Both the first optical coupling subassembly and the second optical coupling subassembly may include optical elements in an optical path between the array of optoelectronic devices and the end of the fiber optic bundle. The optoelectronic devices may be microLEDs or photodetectors.

Abstract: In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.

Abstract: MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Abstract: Optically interconnected modules may include logic and/or memory blocks and optical transceiver subsystems. The optical transceiver subsystems may include arrays of microLEDs and arrays of photodetectors. The optical transceiver subsystems of each module may be optically coupled to optical transceiver subsystems of other modules. Each module may include a processor and/or memory chips and optical transceiver subsystem chips mounted on a common substrate, and the processor and/or memory chips and the optical transceiver chips may be coupled by die-to-die interfaces.

Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.

Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.

Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.

Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.

Abstract: A connector assembly for a fiber-optic bundle may provide for a ninety degree bend in the fiber-optic bundle. The connector assembly may be used in a microLED-based optical interconnect. The microLED-based optical interconnect may provide for data and/or clock communication from an array of microLEDs to an array of photodetectors, with a fiber-optic bundle providing an optical transmission medium coupling light between the microLEDs and the photodetectors. Fiber elements of the fiber-optic bundle may be bound together about ends of the fiber elements, but loose in an area of the bend.

Abstract: An optical communication system may include microLEDs for use in communicating data between chips or multi-chip modules. The number of microLEDs may be greater than a number of electrical data lines for carrying data to be communicated. Signals on the electrical data lines may be inverse multiplexed, for example to allow for operation of the microLEDs at a rate slower than operation of electrical circuitry generating signals on the electrical data lines.

Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.

Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.

Abstract: Structures to isolate optical coupling elements from contamination during certain steps in assembling a parallel microLED optical link are disclosed. The structures include a dam structure around a coupling optics block, for coupling light from and/or to microLEDs and/or photodetectors, respectively, that would sit flush to a ferrule or connector that holds an optical transmission medium. The ferrule may be, for example, a multi-fiber push on (MPO) connector or an MTP connector.

Abstract: A System-on-Chip (SoC) may be optically interconnected with memory. The SoC and a first electronic and photonic IC chip may be housed in a same semiconductor package. The first electronic and photonic IC chip may be in optical communication with a second electronic and photonic IC chip in electrical communication with memory. The first and second electronic and photonic IC chips may include microLEDs and photodetectors, for example bonded to surfaces of the first and second photonic IC chips. The optical communication may be through a transmission medium, which may be optical fibers. The optical fibers may be in one or more fiber bundles.