Patents by Inventor Robert Kalman

Robert Kalman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BIT-WISE INVERSE MULTIPLEXING FOR OPTICAL CHANNELS UTILIZING MICROLEDS
    Publication number: 20220393768
    Abstract: An optical communication system may include microLEDs for use in communicating data between chips or multi-chip modules. The number of microLEDs may be greater than a number of electrical data lines for carrying data to be communicated. Signals on the electrical data lines may be inverse multiplexed, for example to allow for operation of the microLEDs at a rate slower than operation of electrical circuitry generating signals on the electrical data lines.
    Type: Application
    Filed: June 3, 2022
    Publication date: December 8, 2022
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov
  • Packaging for microLEDs for chip to chip communication
    Patent number: 11513285
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: November 29, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Chip-scale optical interconnect using microLEDs
    Patent number: 11515356
    Abstract: In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: November 29, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman
  • MULTI-ARRAY PARALLEL OPTICAL LINKS
    Publication number: 20220357528
    Abstract: An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov
  • Optical transceiver design for short distance communication systems based on microLEDs
    Patent number: 11483182
    Abstract: MicroLEDs may be used for short-range optical communications. Signal equalization may be used to decrease distortion in transmitted and/or received information, including with the use of multi-level modulation formats.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: October 25, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Coherent fiber bundle parallel optical links
    Patent number: 11476942
    Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: October 18, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OPTICAL FIBER
    Publication number: 20220286211
    Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 8, 2022
    Inventors: Bardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
  • High speed and multi-contact LEDs for data communication
    Patent number: 11418257
    Abstract: An LED may include a third contact, for example to increase speed of operation of the LED. The LED with the third contact may be used in an optical communication system, for example a chip-to-chip optical interconnect.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: August 16, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • INTEGRATION OF OE DEVICES WITH ICS
    Publication number: 20220113483
    Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 14, 2022
    Inventors: Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
  • MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS
    Publication number: 20220107456
    Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 7, 2022
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS
    Publication number: 20220069914
    Abstract: For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 3, 2022
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • MICROLED BASED TIME OF FLIGHT SYSTEM
    Publication number: 20220050186
    Abstract: A time of flight system may include one or more microLEDs and a photodetector monolithically integrated with integrated circuitry of the time of flight system. The microLEDs may be doped to provide increased speed of operation.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 17, 2022
    Inventors: Bardia Pezeshki, Robert Kalman, Alexander Tselikov
  • ENHANCED MICROLEDS FOR INTER-CHIP COMMUNICATIONS
    Publication number: 20220045234
    Abstract: An LED may be optimized for high speed operation for optical communication systems in a variety of ways. The LED, which may be a microLED, may include dopants and dopant levels allowing for increased speed of operation, the LED may include interlayers, and the LED may include other features.
    Type: Application
    Filed: August 3, 2021
    Publication date: February 10, 2022
    Inventors: Bardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
  • CMOS-COMPATIBLE SHORT WAVELENGTH PHOTODETECTORS
    Publication number: 20220005845
    Abstract: A lateral p-i-n photodetector may be made using CMOS compatible processes. CMOS circuitry may be included on a die including the lateral p-i-n photodetector. The lateral p-i-n photodetector may be formed in a device layer of the die, with a buried oxide under the device layer. P-type implants may bound a region defined by the lateral p-i-n photodetector.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 6, 2022
    Inventors: Bardia Pezeshki, Robert Kalman, Cameron Danesh
  • COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
    Publication number: 20210376932
    Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.
    Type: Application
    Filed: June 1, 2021
    Publication date: December 2, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • EMBEDDING LEDS WITH WAVEGUIDES
    Publication number: 20210356662
    Abstract: A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 18, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • PARALLEL OPTICAL COMMUNICATION CHANNELS USING MICROLEDS
    Publication number: 20210320721
    Abstract: Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert T. Weverka, Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • OPTICALLY-ENHANCED MULTICHIP PACKAGING
    Publication number: 20210320718
    Abstract: Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
    Publication number: 20210318503
    Abstract: Light from one or more microLEDs may be coupled into multiple waveguide cores. Parabolic reflectors, truncated parabolic reflectors, and encapsulants may be used to increase fraction of emitted light coupled into the waveguide cores.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
    Publication number: 20210320726
    Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh