Patents by Inventor Robert L. Canella
Robert L. Canella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8690379Abstract: A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within a housing assembly. Linear, or rotational, switch actuation element movement may be employed. A holder for the personal light is also disclosed.Type: GrantFiled: March 30, 2011Date of Patent: April 8, 2014Inventor: Robert L. Canella
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Publication number: 20110235313Abstract: A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within a housing assembly. Linear, or rotational, switch actuation element movement may be employed. A holder for the personal light is also disclosed.Type: ApplicationFiled: March 30, 2011Publication date: September 29, 2011Inventor: Robert L. Canella
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Publication number: 20100315806Abstract: A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.Type: ApplicationFiled: April 16, 2010Publication date: December 16, 2010Inventor: Robert L. Canella
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Patent number: 7699493Abstract: A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.Type: GrantFiled: April 28, 2008Date of Patent: April 20, 2010Inventor: Robert L. Canella
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Publication number: 20080232095Abstract: A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.Type: ApplicationFiled: April 28, 2008Publication date: September 25, 2008Inventor: Robert L. Canella
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Patent number: 7364319Abstract: A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.Type: GrantFiled: October 6, 2005Date of Patent: April 29, 2008Inventor: Robert L. Canella
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Patent number: 7361862Abstract: A laser marking system for IC packages including a tray input shuttle assembly and a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a lift mechanism for raising and lowering the tray carrier relative to the transport so as to facilitate tray loading of the tray carrier from the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier to the output shuttle assembly.Type: GrantFiled: December 4, 2001Date of Patent: April 22, 2008Assignee: Micron Technology, Inc.Inventors: Robert L. Canella, Tony T. Ibarra
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Patent number: 7279788Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.Type: GrantFiled: November 18, 2004Date of Patent: October 9, 2007Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Patent number: 7192806Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.Type: GrantFiled: November 18, 2004Date of Patent: March 20, 2007Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Patent number: 7120999Abstract: A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.Type: GrantFiled: September 23, 2003Date of Patent: October 17, 2006Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Patent number: 7094065Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.Type: GrantFiled: November 18, 2004Date of Patent: August 22, 2006Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Patent number: 7049693Abstract: A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.Type: GrantFiled: August 29, 2001Date of Patent: May 23, 2006Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Patent number: 7045889Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.Type: GrantFiled: August 21, 2001Date of Patent: May 16, 2006Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Publication number: 20040058470Abstract: A substrate assembly including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.Type: ApplicationFiled: September 23, 2003Publication date: March 25, 2004Inventor: Robert L. Canella
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Patent number: 6695571Abstract: A method for dispensing, receiving, storing, testing or binning packaged integrated circuit devices using at least one vertically oriented, removable, tubular magazine disposed above a controllably driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.Type: GrantFiled: December 17, 1999Date of Patent: February 24, 2004Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Patent number: 6580957Abstract: A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.Type: GrantFiled: November 15, 1999Date of Patent: June 17, 2003Assignee: Micron Technology, Inc.Inventor: Robert L. Canella
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Publication number: 20030042595Abstract: A substrate assembly including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.Type: ApplicationFiled: August 29, 2001Publication date: March 6, 2003Inventor: Robert L. Canella
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Patent number: 6528760Abstract: An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively configured tray carrier. The input shuttle assembly is adapted to load a tray carrying unmarked IC packages onto the tray carrier from a stack of trays on the input shuttle assembly. A tray bearing unmarked IC packages may travel on the tray carrier borne by the tray transport to a laser marking station positioned above the transport actuator and having a single laser marking head traversing one mark field disposed within an enclosure. A first portion of the IC packages disposed in the tray that are positioned in the mark field may be laser marked after the tray is lifted into the enclosure by a rotational lift mechanism located proximate the laser marking station.Type: GrantFiled: July 14, 2000Date of Patent: March 4, 2003Assignee: Micron Technology, Inc.Inventors: Robert L. Canella, Tony T. Ibarra
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Publication number: 20030040139Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pinout of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.Type: ApplicationFiled: August 21, 2001Publication date: February 27, 2003Inventor: Robert L. Canella
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Publication number: 20020107603Abstract: A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.Type: ApplicationFiled: November 15, 1999Publication date: August 8, 2002Inventor: ROBERT L. CANELLA