Abstract: A laser marking system for IC packages including a tray input shuttle assembly, a tray transport borne by a transport actuator for moving a cooperatively configured tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a sliding wedge-type lift mechanism for raising and lowering the tray carrier vertically with respect to the transport so as to facilitate tray loading of the tray carrier from a stack of trays on the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier onto a stack of trays on the output shuttle assembly.

Abstract: A laser marking system for IC packages including a tray input shuttle assembly, a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith lift mechanism for raising and lowering the tray carrier relative to the transport so as to facilitate tray loading of the tray carrier from the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier to the output shuttle assembly.

Abstract: A self-aligning tray carrier for supporting a tray carrying a large group of ICs therein. The invention includes self-aligning, cooperative tray carrier and tray transport configurations to ensure precise, repeatable alignment of a tray carrier with an underlying tray transport through gravity alone when a tray carrier which has been raised off the transport is again lowered into supporting contact therewith. Another, optional, feature of the mutually cooperative configurations of the tray carrier and tray transport permits the tilting of the tray carrier while still supported on the transport so as to effect precise alignment of IC packages carried in rectangular recesses on a tray on the tray carrier with respect to common alignment points (i.e., the same corner of each tray recess) to facilitate repeatability of the IC package surface location being marked on each IC package borne by the tray. Such alignment may be further enhanced by vibration or tapping of the tray carrier while in a tilted orientation.

Abstract: A laser marking station housing a laser marking head within a walled, substantially bottomless enclosure defining an opening into which a tray carrier bearing a tray of IC packages to be marked may be raised to place the tray at correct laser focal length and effect complete (laser) light containment within the enclosure using the tray carrier to effect closure of the opening. A lift mechanism for raising the tray carrier into the enclosure is also disclosed.

Abstract: A lift mechanism for controlled lifting and lowering, especially suitable for lifting and lowering a tray of ICs. The lift mechanism includes a horizontally movable drive wedge element having an upper inclined surface and a slave wedge element having a lower inclined surface slidingly supported on the drive wedge element upper inclined surface. Horizontal movement of the slave wedge element is constrained while vertical movement is permitted, so that horizontal movement of the drive wedge element raises or lowers the slave wedge element. A lift structure extending upwardly from the slave wedge element may be employed to engage a tray as, for example, when loading or unloading trays from a transport at a shuttle assembly. A dual-action drive mechanism may move the drive wedge element horizontally, while a dual-action stop mechanism may be employed to limit travel of the drive wedge element at a position short of full vertical extension.

Abstract: A shuttle assembly for handling trays of IC packages. The shuttle assembly is configured to accept cooperatively-configured trays in a vertically-extending tray stack volume in only a single rotational orientation. Trays are selectively released from or accepted by the tray stack volume by operation of selectively extendable and retractable tray support elements driven by actuators, which may comprise air cylinders. A lift mechanism for raising and lowering a tray in alignment with the tray stack volume may be included. A method of operation of the shuttle assembly is also disclosed.

Abstract: An apparatus for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface of a packaged die presented by a handling device is covered by an applicator with an overlayer of material to fill the engraved markings and provide a surface suitable for re-marking. The covering material may be applied in a flowable state by applicator contact or by non-contact dispensing, or may be applied by the applicator as a preformed segment. A pre-treatment device may be employed to treat the package exterior surface to be covered to enhance bonding of the covering material thereto. Bonding of the covering material to the package surface, or solidification of the covering material, may be enhanced by use of a post-application curing station.

Abstract: A method for dispensing, receiving, storing, testing or binning packaged integrated circuit devices using at least one vertically-oriented, removable, tubular magazine disposed above a controllably-driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.

Abstract: A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to fill the engraved markings and provide a surface suitable for re-marking. The covering material may be applied in a flowable state by applicator contact or by non-contact dispensing, or may be applied as a preformed segment. The exterior surface to be covered may be pre-treated to enhance bonding of the covering material. The covering material may be bonded to the marked surface in a post-application curing operation. De-marked integrated circuit packages are also disclosed.

Abstract: An apparatus for dispensing, receiving or storing packaged integrated circuit devices using at least one vertically-oriented, removable, tubular magazine disposed above a controllably-driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.

Abstract: A method for positioning a workpiece comprises the steps of providing a pedestal having a chamfered portion and a generally circular portion having a first diameter and providing a table having a hole therein and a chamfered portion, the hole having a second diameter larger than the first diameter. The inventive method further includes the steps of supporting the pedestal with the table, the chamfered portion of the table contacting the chamfered portion of the pedestal and placing the workpiece on the pedestal. Next, the chamfered portion of the pedestal is urged away from the table. Subsequent to the step of urging the chamfered portion of the pedestal away from the table, the pedestal is moved in at least one of X-, Y-, and theta directions while the generally circular portion of the pedestal extends into the hole in the table.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract: A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract: A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

Abstract: An apparatus for positioning a workpiece comprises a plurality of pedestals each comprising a first portion having a first width, a second portion having a second width greater than the first width, and a chamfered portion interposed between the first and second portions. The inventive apparatus further comprises a support having a plurality of holes therein for receiving the plurality of pedestals, the support further having a plurality of chamfered portions with one the chamfered portion about a periphery of each the hole. A base urges the chamfered portions of the pedestal away from the chamfered portions of the support.

Abstract: An integrated circuit testing apparatus and method of testing. In a first embodiment an amplifier amplifies the difference in a reference integrated circuit (RIC) response and a device under test integrated circuit (DUTIC) response to an electrical stimulus. The electrical stimulus is provided at an input of the DUTIC and the RIC by a stimulus circuit. A analog comparator determines when the amplified differences exceeds an adjustable threshold value. The sensitivity of the comparator is adjustable and the desired threshold value is adjusted before testing begins. If the amplified difference exceeds the threshold value of the comparator an error signal is generated. The apparatus of the invention includes a presetable counter which generates a device fail signal if a predetermined number of error signals are generated by the comparator. An initialization circuit loads a selectable value into the counter to provide a variable number of allowable errors before a DUTIC fails the test.

Abstract: An apparatus for testing an unencapsulated, diced semiconductor device comprises a test head. The test head comprises a carousel table having a chamfered portion and a chamfered pedestal. While testing is pending the pedestal rests against the chamfered portion of the carousel table, and the pedestal receives a semiconductor device to be tested. The carousel table rotates 90.degree. to position the semiconductor device under the test head. The pedestal is lifted, and the chamfered nature of the pedestal and the carousel table allow for adjustments to the pedestal in the X-, Y-, and theta-directions to align the die with a probe responsive to signals from a camera positioned above the probe. Once the die is aligned, the pedestal continues to rise until contact is made between bond pads on the die and the probe, and testing is performed.