Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.

Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.

Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.

Abstract: Disclosed herein is a method of operating display systems with reduction of the warm-up time of an arc lamp in the event of an accidental or unintentional turn-off.

Abstract: A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

Abstract: A method and spatial light modulator are provided herein. The spatial light modulator has a higher resolution and an increased fill factor. The spatial light modulator also provides an increased contrast ratio. Furthermore, the spatial light modulator of the present invention can be operated in the absence of polarized light and that has improved electro-mechanical performance and robustness with respect to manufacturing. A method and its alternative are disclosed herein by the present invention for manufacturing the spatial light modulator.

Abstract: A projection system, a spatial light modulator, and a method for forming micromirrors are disclosed. A substrate comprises circuitry and electrodes for electrostatically deflecting micromirror elements that are disposed within an array of such elements forming the spatial light modulator. In one embodiment, the substrate is a silicon substrate having circuitry and electrodes thereon for electrostatically actuating adjacent micromirror elements, and the substrate is fully or selectively covered with a light absorbing material.

Abstract: Methods and structures are provided which support spacer walls in a position which facilitates installation of the spacer walls between a faceplate structure and a backplate structure of a flat panel display. In one embodiment, spacer feet are formed at opposing ends of the spacer wall. These spacer feet can be formed of materials such as ceramic, glass and/or glass frit. The spacer feet support the corresponding spacer wall on the faceplate (or backplate) structure. Tacking electrodes can be provided on the faceplate (or backplate) structure to assert an electrostatic force on the spacer feet, thereby holding the spacer feet in place during installation of the spacer wall. The spacer wall can be mechanically and/or thermally expanded prior to attaching both ends of the spacer wall to the faceplate (or backplate) structure. The spacer wall is then allowed to contract, thereby introducing tension into the spacer wall which tends to straighten any inherent waviness in the spacer wall.