Abstract: A back-illuminated image sensor includes a sensor layer of a first conductivity type having a frontside and a backside opposite the frontside. One or more frontside regions of a second conductivity type are formed in at least a portion of the frontside of the sensor layer. A backside region of the second conductivity type is formed in the backside of the sensor layer. A plurality of frontside photodetectors of the first conductivity type is disposed in the sensor layer. A distinct plurality of backside photodetectors of the first conductivity type separate from the plurality of frontside photodetectors are formed in the sensor layer contiguous to portions of the region of the second conductivity type. A voltage terminal is disposed on the frontside of the sensor layer. One or more connecting regions of the second conductivity type are disposed in respective portions of the sensor layer between the voltage terminal and the backside region for electrically connecting the voltage terminal to the backside region.

Abstract: A digital camera system, comprising: a digital image sensor; an optical system for forming an image of a scene onto the digital image sensor; a global positioning system sensor; a processor-accessible memory system; and a processor. The processor performs the steps of analyzing a signal from the global positioning system sensor to determine whether the digital camera system is indoors or outdoors; capturing an input digital image of the scene using the digital image sensor; processing the input digital image responsive to whether the digital camera system is indoors or outdoors; and storing the processed digital image in the processor-accessible memory system.

Abstract: A vertically-integrated active pixel sensor includes a sensor wafer connected to a support circuit wafer. Inter-wafer connectors or connector wires transfer signals between the sensor wafer and the support circuit wafer. The active pixel sensor can be fabricated by attaching the sensor wafer to a handle wafer using a removable interface layer. Once the sensor wafer is attached to the handle wafer, the sensor wafer is backside thinned to a given thickness. The support circuit wafer is then attached to the sensor wafer and the handle wafer separated from the sensor wafer.

Abstract: A back-illuminated image sensor includes a sensor layer of a first conductivity type having a frontside and a backside opposite the frontside. An insulating layer is disposed over the backside. A circuit layer is formed adjacent to the frontside such that the sensor layer is positioned between the circuit layer and the insulating layer. One or more frontside regions of a second conductivity type are formed in at least a portion of the frontside of the sensor layer. A backside region of the second conductivity type is formed in the backside of the sensor layer. A plurality of frontside photodetectors of the first conductivity type is disposed in the sensor layer. A distinct plurality of backside photodetectors of the first conductivity type separate from the plurality of frontside photodetectors is formed in the sensor layer contiguous to portions of the backside region of the second conductivity type.

Abstract: A digital camera for capturing an image containing the photographer, comprising: an image sensor; an optical system for forming an image of a scene on the image sensor; a processor for processing the output of the image sensor in order to detect the presence of one or more faces in a field of view of the digital camera; a feedback mechanism for providing feedback to the photographer while the photographer is included within the field of view, responsive to detecting at least one face in the field of view, and a means for initiating capture of a digital image of the scene containing the photographer.

Abstract: A vertically-integrated active pixel sensor includes a sensor wafer connected to a support circuit wafer. Inter-wafer connectors or connector wires transfer signals between the sensor wafer and the support circuit wafer. The active pixel sensor can be fabricated by attaching the sensor wafer to a handle wafer using a removable interface layer. Once the sensor wafer is attached to the handle wafer, the sensor wafer is backside thinned to a given thickness. The support circuit wafer is then attached to the sensor wafer and the handle wafer separated from the sensor wafer.

Abstract: A method for lowering dark current in an image sensor pixel, the method includes the steps of providing a photosensitive area for receiving incident light which is converted into a charge; providing a gate for transferring charge from the photosensitive area; wherein the gate is held at a voltage which will accumulate majority carriers at a semiconductor-dielectric interface during integration for the photosensitive area. Alternatively, a potential profile can be provided under the gate to drain the dark current away from the photogeneration diffusion.

Abstract: An image sensor includes a plurality of pixels; a color filter pattern spanning at least a portion of the pixels, wherein the color filter pattern forms a color filter kernel having colors in a predetermined arrangement; and a mechanism for controlling integration time of the pixels, wherein the integration time of the plurality of pixels is spatially variant in a pattern that is correlated with the color filter array kernel.

Abstract: A vertically-integrated image sensor includes a sensor wafer connected to a support circuit wafer. Each pixel region on the sensor wafer includes a photodetector, a charge-to-voltage conversion mechanism, a transfer mechanism for transferring charge from the photodetector to the charge-to-voltage conversion mechanism, and a reset mechanism for discharging the charge-to-voltage conversion mechanism. The support circuit wafer includes an amplifier and other support circuitry for each pixel region on the sensor wafer. An inter-wafer connector directly connects each charge-to-voltage mechanism on the sensor wafer to a respective gate to an amplifier on the support circuit wafer.

Abstract: An image sensor includes: (a) a plurality of light measuring elements arranged in an array and at least a portion of the elements have a color filter mated with the light receiving elements which permits selective color reception by the light measuring elements; (b) a plurality of floating diffusions respectively mated with the plurality of light receiving elements; and c) an output structure electrically connected to two or more of the floating diffusions; wherein the at least two light receiving elements receiving the same color are transferred to the output structure substantially simultaneously.

Abstract: An image sensor includes a plurality of pixels; a color filter pattern spanning at least a portion of the pixels, wherein the color filter pattern forms a color filter kernel having colors in a predetermined arrangement; and a mechanism for controlling integration time of the pixels, wherein the integration time of the plurality of pixels is spatially variant in a pattern that is correlated with the color filter array kernel.

Abstract: A vertically-integrated active pixel sensor includes a sensor wafer connected to a support circuit wafer. Inter-wafer connectors or connector wires transfer signals between the sensor wafer and the support circuit wafer. The active pixel sensor can be fabricated by attaching the sensor wafer to a handle wafer using a removable interface layer. Once the sensor wafer is attached to the handle wafer, the sensor wafer is backside thinned to a given thickness. The support circuit wafer is then attached to the sensor wafer and the handle wafer separated from the sensor wafer.

Abstract: A microshutter array has a frame having a light transmissive portion. Linear microshutter elements extend across the light transmissive portion and in parallel to each other. Each microshutter element has a flat blade extended in a length direction and first and second torsion arms extending outwards from each side of the blade in the length direction, the blade extending across the light transmissive portion. A control circuit provides a separately-controlled and independent voltage that is applied to each of the linear microshutter elements. A controller sets the respective voltages applied to each of the linear microshutter elements.

Abstract: A semiconductor wafer includes one or more back-illuminated image sensors each formed in a portion of the semiconductor wafer. One or more thinning etch stops are formed in other portions of the semiconductor wafer.

Abstract: A method for forming an image, implemented at least in part by a data processing apparatus, by obtaining a first image of a scene from a first subset of pixels in an image sensor array at a first f/# setting, adjusting the imaging optics that obtain light from the scene at a second f/# setting, obtaining a second image of the scene from a second subset of pixels in the image sensor array, and forming a composite image by combining image data from at least the first and second images.

Abstract: The invention utilizes an autofocus system (806) that is capable of very fast changes in focus over a relatively small portion of the focus range of the focusing system. When operating continuously in a repeating series of images or frames such as are found in preview mode or in video capture, autofocus images are captured before and after each video frame wherein the autofocus images have different focus settings than the images in the series. The autofocus images are then evaluated for focus quality to determine whether focus adjustments are needed.

Abstract: A backside illuminated image sensor includes a sensor layer comprising a plurality of photosensitive elements of the pixel array, a circuit layer comprising circuitry associated with the pixel array, a conductive layer formed on a backside surface of the sensor layer, and one or more conductive contacts configured to couple the conductive layer to a bias source in the circuit layer. The biased conductive layer produces an electric field across the photosensitive elements of the pixel array that facilitates charge carrier collection and reduces crosstalk between adjacent photosensitive elements, thereby providing improved quantum efficiency in the image sensor. The image sensor may be implemented in a digital camera or other type of digital imaging device.

Abstract: A vertically-integrated image sensor includes a sensor wafer connected to a support circuit wafer. Each pixel region on the sensor wafer includes a photodetector, a charge-to-voltage conversion mechanism, a transfer mechanism for transferring charge from the photodetector to the charge-to-voltage conversion mechanism, and a reset mechanism for discharging the charge-to-voltage conversion mechanism. The support circuit wafer includes an amplifier and other support circuitry for each pixel region on the sensor wafer. An inter-wafer connector directly connects each charge-to-voltage mechanism on the sensor wafer to a respective gate to an amplifier on the support circuit wafer.

Abstract: A method of minimizing noise in an image produced by an electronic imager comprising: determining a correction system for a range of imager integration times and a range of imager temperatures for an electronic imager which has taken a series of dark capture images and a series of flat field capture images in a calibration mode; and applying the correction system to an image produced by the electronic imager in an image capture mode.

Abstract: A vertically-integrated active pixel sensor includes a sensor wafer connected to a support circuit wafer. Inter-wafer connectors or connector wires transfer signals between the sensor wafer and the support circuit wafer. The active pixel sensor can be fabricated by attaching the sensor wafer to a handle wafer using a removable interface layer. Once the sensor wafer is attached to the handle wafer, the sensor wafer is backside thinned to a given thickness. The support circuit wafer is then attached to the sensor wafer and the handle wafer separated from the sensor wafer.