Abstract: Radiant tube space heating appliance (FIG. 1) has radiation ducting 10 with one or more inline burners 16 in a branch or branches 12 upstream of common tailpipe 20. An exhuast fan 22 in the tailpipe draws heated gases thought the ducting. A power operated control damper 28 in the tailpipe is actuated in response to sensing of the gas temperature in the tailpipe to reduce the induced flow therein when the temperature is below a certain level to counteract the increased volume throughput of the adjacent fan at lower temperature so that performance burners, e.g. on start up, is not adversely affected.

Abstract: An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.

Abstract: A container lid (10) including a base (11) having a rim (13) adapted to fit onto a container, a raised section projecting above the rim, the raised section including an inverted recess (15), a domed cover (12) attached to the raised section (14) above the recess to create a compartment (24) within and of substantially the same depth as the container lid, and releasable sealing means between the cover and the raised section to provide access to the compartment.

Abstract: The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.

Abstract: A compound of formula (I) or pharmaceutically acceptable salt thereof: ##STR1## wherein either Y is N and R.sub.2 is hydrogen, or Y is C--R.sub.1 ; where either one of R.sub.1 and R.sub.2 is hydrogen and the other is selected from the class of hydrogen, C.sub.3-8 cycloalkyl, C.sub.1-6 alkyl optionally interrupted by oxygen or substituted by hydroxy, C.sub.1-6 alkoxy or substituted arminocarbonyl, C.sub.1-6 alkylcarbonyl, C.sub.1-6 alkoxycarbonyl, C.sub.1-6 alkylcarbonyloxy, C.sub.1-6 alkoxy, nitro, cyano, halo, trifluoromethyl, CF.sub.3 S, or a group CF.sub.3 --A--, or a group CF.sub.2 H--A'--, trifluoromethoxy, C.sub.1-6 alkylsulphinyl, perfluoro C.sub.2-6 alkylsulphonyl, C.sub.1-6 alkylsulphonyl, C.sub.1-6 alkoxysulphinyl, C.sub.1-6 alkoxysulphonyl, aryl, heteroaryl, arylcarbonyl, heteroarylcarbonyl, phosphono, arylcarbonyloxy, heteroarylcarbonyloxy, arylsulphinyl, heteroarylsulphinyl, arylsulphonyl, heteroarylsulphonyl, C.sub.1-6 alkylcarbonylamino, C.sub.1-6 alkoxycarbonylamino, C.sub.

Abstract: This invention relates to the method of treatment and/or prophylaxis of anxiety and/or disorders treatable and/or preventable with anti-convulsive agents, such as epilepsy, using compounds of the formula (Ia): ##STR1##

Abstract: The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.

Abstract: An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.

Abstract: The invention provides a photographic element comprising a light-sensitive silver halide emulsion layer having associated therewith a dye-forming coupler of formula (I): ##STR1## wherein X is H or a coupling-off group, R.sub.1 is H or a substituent group; Y and Z are the same or different and are H or are independently selected from alkyl, aryl and heteroaryl groups; provided that Y and Z taken together with the nitrogen atom may form a 5-10 membered heterocyclic ring.

Abstract: Azo dyes having the general formula: ##STR1## wherein R.sub.1 represents a substituent selected from the group consisting of hydrogen, methyl, ethyl, methoxy, ethoxy, halogen, nitro, acetyl, carbomethoxy, carboethoxy, cyano and thiocyanate, and A is an aniline, 1,2,3,4-tetrahydroquinoline or benzomorpholine coupling component, may be used as conventional disperse dyes on polyester, polyamide, acrylic, triacetate and other synthetic fabrics, and some are particularly suitable for use in the transfer printing of polyesters and polyamides.

Abstract: A vertical radio-interferometer sector-definition system, using an array of aerial elements which are arranged in a vertical straight line and are symmetrically disposed about the center of the array, which is unaffected by ground-reflected indirect-path signals.If .theta. is the angle of arrival, by a direct path, of a signal and p is the ground reflection coefficient, then from a symmetrical pair of aerial elements is derived a product of two functions f.sub.1 (.theta.).f(p) and from another symmetrical pair is derived another product f.sub.2 (.theta.).f(p): division of one product by the other "cancels out" f(p) to provide a quotient signal which is a function of .theta. but not of p. Either or both product functions may be derived with or without the aid of a central element.