Abstract: Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.

Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.

Abstract: This disclosure relates generally to package substrates with multiple embedded dice wherein each of the embedded dice can be connected directly to a bus of the package substrate without being routed through another die. The package substrate may be configured as a bumpless build up layer (BBUL) substrate.

Abstract: A system for treating a material includes first and second screw conveyors each having a rotary shaft and a helical flight extending radially outward therefrom, the flighting of the screw conveyors overlapping with each other, and first and second actuators operably coupled to the first and second screw conveyors in a one-to-one dedicated relationship to rotationally drive the screw conveyors independently of each other. In typical embodiments, also included is a system for varying the clocking position of the screw conveyors relative to each other, wherein the screw conveyor flights are axially adjusted with respect to each other between a normal position and an advanced and/or retarded position. Also disclosed are methods of varying the axial position of the screw conveyor flights with respect to each other between the normal and advanced and/or retarded positions.

Abstract: This disclosure relates generally to package substrates with multiple embedded dice wherein each of the embedded dice can be connected directly to a bus of the package substrate without being routed through another die. The package substrate may be configured as a bumpless build up layer (BBUL) substrate.

Abstract: A system for treating a material includes first and second screw conveyors each having a rotary shaft and a helical flight extending radially outward therefrom, the flighting of the screw conveyors overlapping with each other, and first and second actuators operably coupled to the first and second screw conveyors in a one-to-one dedicated relationship to rotationally drive the screw conveyors independently of each other. In typical embodiments, also included is a system for varying the clocking position of the screw conveyors relative to each other, wherein the screw conveyor flights are axially adjusted with respect to each other between a normal position and an advanced and/or retarded position. Also disclosed are methods of varying the axial position of the screw conveyor flights with respect to each other between the normal and advanced and/or retarded positions.

Abstract: This disclosure relates generally to package substrates with multiple embedded dice wherein each of the embedded dice can be connected directly to a bus of the package substrate without being routed through another die. The package substrate may be configured as a bumpless build up layer (BBUL) substrate.

Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.

Abstract: Systems and methods for treating carbon-containing waste materials include a gasifying system, a drier system for pre-drying the material, and an energy-recovery system for recovering waste heat and/or producer gas from the gasifying system/method for use in pre-drying the material. The energy-recovery system can include a recirculation system for recovering the waste heat and/or a thermal oxidizer or other combustion device for burning the producer gas, along with a heat-transfer-loop for transferring the recovered heat energy to the drier for pre-drying the material. In another aspect of the invention, the gasifying systems and methods use a thermal-screw conveyor with a product chamber and rotary thermal screws, and an oxygen-delivery system configured for delivering oxygen into the product chamber for immediate absorption into the material, with or without the dryer system and/or the energy-recovery system.

Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) (100,400,1000,1500) configured to control pitch, roll, and/or yaw via airfoils (141,142,1345,1346) having resiliently mounted trailing edges opposed by fuselage-house house deflecting actuator horns (621,622). Embodiments include one or more rudder elements (1045, 1046,1145, 1146,1245, 1345, 1346,1445, 1446,1545, 1546) which may be rotatably attached and actuated by an effector member (1049,1149,1249,1349) disposed within the fuselage housing (1001) and extendible in part to engage the one or more rudder elements.

Abstract: A system for treating a material includes first and second screw conveyors each having a rotary shaft and a helical flight extending radially outward therefrom, the flighting of the screw conveyors overlapping with each other, and first and second actuators operably coupled to the first and second screw conveyors in a one-to-one dedicated relationship to rotationally drive the screw conveyors independently of each other. In typical embodiments, also included is a system for varying the clocking position of the screw conveyors relative to each other, wherein the screw conveyor flights are axially adjusted with respect to each other between a normal position and an advanced and/or retarded position. Also disclosed are methods of varying the axial position of the screw conveyor flights with respect to each other between the normal and advanced and/or retarded positions.

Abstract: Disclosed are various embodiments relating to a self-service portal for coupon implementation in association with an electronic commerce system. Coupon campaigns are implemented in a computing device for a plurality of vendors in association with the electronic commerce system. Each of the coupon campaigns comprises one or more digital coupons. An automated submission of each of the campaigns is facilitated in the computing device from respective ones of the vendors through a self-service portal. Vendor control is facilitated through the self-service portal as to whether the digital coupons associated with a respective one of the campaigns are activated to be applied to a purchase of an item through the electronic commerce system.

Abstract: Various embodiments, including systems and methods, are described for providing digital coupons to third party network sites. In one representative embodiment, a computing device is provided, where a plurality of digital coupons are maintained in a memory associated with the computing device. Each digital coupon is directed to the purchase of at least one item through an electronic commerce system. A coupon service is implemented in the computing device that is configured to identify at least one of the digital coupons to present on a third party network site in response to a request for at least one of the digital coupons received from the third party network site based at least in part upon information contained in the request. The identified digital coupons are then sent to the third party network site.

Abstract: Various systems, methods, and other embodiments are described relating to the selection of digital coupons for display in network pages. In one embodiment, a plurality of coupon campaigns are maintained in a computing device for a plurality of entities in association with an operation of an electronic commerce system employed to sell a plurality of items over a network. Each of the coupon campaigns comprises at least one digital coupon to be applied to a purchase of at least one of the items. A network page is generated in the electronic commerce system to be rendered on a client. The network page is generated in association with the operation of the electronic commerce system. A subset of the digital coupons is determined to be included in the network page to present to a user.

Abstract: A screw conveyor includes a steam delivery chamber, a condensate return chamber, and a helical hollow flight. In example embodiments, the condensate return chamber is defined by an inner pipe, the steam delivery chamber is defined between the outer and inner pipes, and the helical flight extends radially from the outer pipe. The screw conveyor includes a series of heating zones, each having a “closed-loop” helical passageway formed by the hollow flight and each having a corresponding steam inlet, condensate outlet, and barrier. Steam travels into the screw conveyor, through the steam inlets, and into the helical passageways, where it condenses as it heats a material conveyed by the screw conveyor. As the screw conveyor rotates, the barriers force the condensate upward until it drains through the condensate outlets and into the condensate return chamber for removal from the screw conveyor.

Abstract: A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug.

Abstract: Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention are described in the claims.

Abstract: A wire-bonding substrate is disclosed. The wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate is also disclosed. The process includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package is also disclosed that includes coupling the die to the wire-bond pad. A computing system is also disclosed that includes the wire-bonding substrate.

Abstract: A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Abstract: A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.