Patents by Inventor Robert P. Adler

Robert P. Adler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250190358
    Abstract: An integrated circuit for translating and reverse-translating the address included in a memory request is disclosed. The integrated circuit may first comprise a processor, a first boundary function, a second boundary function, and a component device. The processor is configured to transmit a memory request to a target module over a bus of the integrated circuit. The memory request requests access to one or more memory mapped resources and the memory request includes a physical address. The first boundary function is configured to translate the physical address to a relative address which operates in or applies to a different address space than an address space that the physical address operates in or applies to. The second boundary function is configured to translate the relative address to the physical address. The device is configured utilize the physical address transmitted by the second boundary function.
    Type: Application
    Filed: January 28, 2025
    Publication date: June 12, 2025
    Applicant: SiFive, Inc.
    Inventors: Dean A. Liberty, Robert P. Adler, Henry Cook, Abderrahmane Sensaoui, Perrine Peresse
  • Patent number: 12248405
    Abstract: An integrated circuit for translating and reverse-translating the address included in a memory request is disclosed. The integrated circuit may first comprise a processor, a first boundary function, a second boundary function, and a component device. The processor is configured to transmit a memory request to a target module over a bus of the integrated circuit. The memory request requests access to one or more memory mapped resources and the memory request includes a physical address. The first boundary function is configured to translate the physical address to a relative address which operates in or applies to a different address space than an address space that the physical address operates in or applies to. The second boundary function is configured to translate the relative address to the physical address. The device is configured utilize the physical address transmitted by the second boundary function.
    Type: Grant
    Filed: September 26, 2023
    Date of Patent: March 11, 2025
    Assignee: SiFive, Inc.
    Inventors: Dean Liberty, Robert P. Adler, Henry Cook, Abderrahmane Sensaoui, Perrine Peresse
  • Publication number: 20240338329
    Abstract: Disclosed are systems and methods that include accessing design parameters to configure an integrated circuit design. The integrated circuit design may include a transaction source or processing node to be included in an integrated circuit. The transaction source or processing node may be configured to transmit memory transactions to memory addresses. A compiler may compile the integrated circuit design with the transaction source or processing node to generate a design output. The design output may be configured to route memory transactions based on their targeting cacheable or non-cacheable memory addresses. The design output may be used to manufacture an integrated circuit.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Applicant: SiFive, Inc.
    Inventors: Robert P. Adler, David Parry, Rick H. Y. Chen, Henry Cook
  • Publication number: 20240338505
    Abstract: Disclosed are systems and methods that include integrated circuit generation with composable interconnect. In some implementations, a system may access a design parameters data structure that specifies an interconnect topology to be included in an integrated circuit. The system may invoke an integrated circuit design generator that applies the design parameters data structure, including with the interconnect topology. In some implementations, the design parameters data structure may specify a definition for a hardware object (e.g., the interconnect topology) and instances of the hardware object. The definition and the instances may each be modifiable. The system may invoke the generator to apply the design parameters data structure to generate the design.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Applicant: SiFive, Inc.
    Inventors: Robert P. Adler, Ryan Macdonald, Asmit De, Henry Cook
  • Publication number: 20240256462
    Abstract: An integrated circuit for translating and reverse-translating the address included in a memory request is disclosed. The integrated circuit may first comprise a processor, a first boundary function, a second boundary function, and a component device. The processor is configured to transmit a memory request to a target module over a bus of the integrated circuit. The memory request requests access to one or more memory mapped resources and the memory request includes a physical address. The first boundary function is configured to translate the physical address to a relative address which operates in or applies to a different address space than an address space that the physical address operates in or applies to. The second boundary function is configured to translate the relative address to the physical address. The device is configured utilize the physical address transmitted by the second boundary function.
    Type: Application
    Filed: September 26, 2023
    Publication date: August 1, 2024
    Inventors: Dean Liberty, Robert P. Adler, Henry Cook, Abderrahmane Sensaoui, Perrine Peresse
  • Patent number: 11686767
    Abstract: In one embodiment, an apparatus includes at least one fabric to interface with a plurality of intellectual property (IP) blocks of the apparatus, the at least one fabric including at least one status storage, and a fabric bridge controller coupled to the at least one fabric. The fabric bridge controller may be configured to initiate a functional safety test of the at least one fabric in response to a fabric test signal received during functional operation of the apparatus, receive a result of the functional safety test via the at least one status storage, and send to a destination location a test report based on the result. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 27, 2023
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert P. Adler, R. Selvakumar Raja Gopal
  • Patent number: 11372674
    Abstract: In one embodiment, a system on chip includes a first endpoint to issue a non-posted memory write transaction to a memory and a Peripheral Component Interconnect (PCI)-based fabric including control logic to direct the non-posted memory write transaction to the memory, receive a completion for the non-posted memory write transaction from the memory and route the completion to the first endpoint. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: June 28, 2022
    Assignee: Intel Corporation
    Inventors: Robert P. Adler, Robert De Gruijl, Sridhar Lakshmanamurthy, Ramadass Nagarajan, Peter J. Elardo
  • Patent number: 11105854
    Abstract: In one embodiment, an apparatus includes multiple die and at least one interconnect to couple the die. A first die includes one or more cores, a first fabric and a first fabric transactor coupled to the first fabric, the first fabric transactor to initiate a functional test of the apparatus in response to a test signal, cause at least one first test transaction to be sent to a second die, receive a first response to the at least one first test transaction from the second die, and identify, based at least in part on the first response to the at least one test transaction, a location of a failure and report the location of the failure to a destination. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert P. Adler, Ki Yoon
  • Patent number: 11100023
    Abstract: In one example, a semiconductor die includes a plurality of agents and a fabric coupled to at least some of the plurality of agents. The fabric may include at least one router to provide communication between two or more of the plurality of agents, the at least one router coupled to a first agent of the plurality of agents, where the first agent is to send a first message to the at least one router, the first message comprising a first header including a first source identifier, and the at least one router is to validate that the first source identifier is associated with the first agent and if so to direct the first message towards a destination agent, and otherwise to prevent the first message from being directed towards the destination agent. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: August 24, 2021
    Assignee: Intel Corporation
    Inventors: Ruirui Huang, Nilanjan Palit, Robert P. Adler, Ioannis T. Schoinas, Avishay Snir, Boris Dolgunov
  • Patent number: 10936048
    Abstract: In one embodiment, an apparatus includes a bulk write circuit to generate a bulk write message to send to a destination agent to cause the destination agent to write data comprising register contents into a plurality of registers, at least some of the plurality of registers comprising non-consecutive registers. The bulk write message may include a first message header, a first chunk header including an address of a first register of a first subset of the plurality of registers, and a first payload portion having the register contents for the first subset of the plurality of registers. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Ben Furman, Yoni Aizik, Robert P. Adler, Robert Hesse, Chen Ranel
  • Publication number: 20210042147
    Abstract: In one embodiment, a system on chip includes a first endpoint to issue a non-posted memory write transaction to a memory and a Peripheral Component Interconnect (PCI)-based fabric including control logic to direct the non-posted memory write transaction to the memory, receive a completion for the non-posted memory write transaction from the memory and route the completion to the first endpoint. Other embodiments are described and claimed.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Inventors: Robert P. Adler, Robert De Gruijl, Sridhar Lakshmanamurthy, Ramadass Nagarajan, Peter J. Elardo
  • Patent number: 10911261
    Abstract: In an embodiment, a system on chip includes: a plurality of local networks having one or more local endpoints and a first router, where at least some of the one or more local endpoints of different local networks have non-unique port identifiers; at least one global network having one or more global endpoints and at least one second router, where the one or more global endpoints have unique port identifiers; and a plurality of transparent bridges to couple between one of the plurality of local networks and the at least one global network. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: February 2, 2021
    Assignee: Intel Corporation
    Inventors: Robert P. Adler, Lichen Weng, Christopher C. Gianos
  • Patent number: 10860762
    Abstract: Methods and apparatus relating to subsystem-based System on Chip (SoC) integration are described. In one embodiment, logic circuitry determines one or more components of a subsystem. The subsystem supports an architectural feature to be implemented on a System on Chip (SoC) device. A first interface communicatively couples a first component of the subsystem to a first component of another subsystem. A second interface communicatively couples at least one component of the subsystem to at least one chassis component of the SoC device or communicatively couples the at least one component of the subsystem to at least one non-chassis component of the other subsystem. In an embodiment, components of the subsystem may be packaged such that the packaging generates a reusable collateral that allows for fast integration of all aspects of design in any SoC device with a compatible chassis prior to manufacture.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: December 8, 2020
    Assignee: Intel Corpration
    Inventors: Robert P. Adler, Husnara Khan, Satish Venkatesan, Ramamurthy Sunder, Mukesh K. Mishra, Bindu Lalitha, Hassan M. Shehab, Sandhya Seshadri, Dhrubajyoti Kalita, Wendy Liu, Hanumanth Bollineni, Snehal Kharkar
  • Patent number: 10846126
    Abstract: In one embodiment, a system on chip includes a first endpoint to issue a non-posted memory write transaction to a memory and a Peripheral Component Interconnect (PCI)-based fabric including control logic to direct the non-posted memory write transaction to the memory, receive a completion for the non-posted memory write transaction from the memory and route the completion to the first endpoint. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: November 24, 2020
    Assignee: Intel Corporation
    Inventors: Robert P. Adler, Robert De Gruijl, Sridhar Lakshmanamurthy, Ramadass Nagarajan, Peter J. Elardo
  • Publication number: 20190340313
    Abstract: Methods and apparatus relating to subsystem-based System on Chip (SoC) integration are described. In one embodiment, logic circuitry determines one or more components of a subsystem. The subsystem supports an architectural feature to be implemented on a System on Chip (SoC) device. A first interface communicatively couples a first component of the subsystem to a first component of another subsystem. A second interface communicatively couples at least one component of the subsystem to at least one chassis component of the SoC device or communicatively couples the at least one component of the subsystem to at least one non-chassis component of the other subsystem. In an embodiment, components of the subsystem may be packaged such that the packaging generates a reusable collateral that allows for fast integration of all aspects of design in any SoC device with a compatible chassis prior to manufacture.
    Type: Application
    Filed: July 11, 2019
    Publication date: November 7, 2019
    Applicant: Intel Corporation
    Inventors: Robert P. Adler, Husnara Khan, Satish Venkatesan, Ramamurthy Sunder, Mukesh K. Mishra, Bindu Lalitha, Hassan M. Shehab, Sandhya Seshadri, Dhrubajyoti Kalita, Wendy Liu, Hanumanth Bollineni, Snehal Kharkar
  • Publication number: 20190286223
    Abstract: In one embodiment, an apparatus includes a bulk write circuit to generate a bulk write message to send to a destination agent to cause the destination agent to write data comprising register contents into a plurality of registers, at least some of the plurality of registers comprising non-consecutive registers. The bulk write message may include a first message header, a first chunk header including an address of a first register of a first subset of the plurality of registers, and a first payload portion having the register contents for the first subset of the plurality of registers. Other embodiments are described and claimed.
    Type: Application
    Filed: March 29, 2019
    Publication date: September 19, 2019
    Inventors: Ben Furman, Yoni Aizik, Robert P. Adler, Robert Hesse, Chen Ranel
  • Patent number: 10255399
    Abstract: In one embodiment, a design tool for designing a system on chip (SoC) includes hardware mapping logic to automatically generate a channel mapping for a path between a first intellectual property (IP) logic of the SoC and a second IP logic of the SoC. The hardware mapping logic, based at least in part on user input of a source channel associated with the first IP logic, a sink channel associated with the second IP logic and at least one derivation parameter, is to generate the channel mapping according to one of a plurality of derivation algorithms. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: April 9, 2019
    Assignee: Intel Corporation
    Inventors: Krishnan Srinivasan, Robert P. Adler, Eric A. Geisler, Robert De Gruijl, Jay Tomlinson
  • Publication number: 20190095372
    Abstract: In one example, a semiconductor die includes a plurality of agents and a fabric coupled to at least some of the plurality of agents. The fabric may include at least one router to provide communication between two or more of the plurality of agents, the at least one router coupled to a first agent of the plurality of agents, where the first agent is to send a first message to the at least one router, the first message comprising a first header including a first source identifier, and the at least one router is to validate that the first source identifier is associated with the first agent and if so to direct the first message towards a destination agent, and otherwise to prevent the first message from being directed towards the destination agent. Other embodiments are described and claimed.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Inventors: Ruirui Huang, Nilanjan Palit, Robert P. Adler, Ioannis T. Schoinas, Avishay Snir, Boris Dolgunov
  • Patent number: 10235486
    Abstract: In one embodiment, a design tool for designing a system on chip (SoC) includes hardware logic to generate one or more configuration files for a fabric of a SoC to be designed by the design tool. This logic is configured, based at least in part on user input, to generate the one or more configuration files, according to at least one of: automatic derivation of all parameters of the fabric, according to a first user selection; manual input by a user of at least some parameters of the fabric and automatic derivation of at least other parameters of the fabric, according to a second user selection; and manual input by the user of the all parameters of the fabric, according to a third user selection. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: March 19, 2019
    Assignee: Intel Corporation
    Inventors: Krishnan Srinivasan, Robert P. Adler, Robert De Gruijl, Jay Tomlinson, Eric A. Geisler
  • Publication number: 20190033367
    Abstract: In one embodiment, an apparatus includes at least one fabric to interface with a plurality of intellectual property (IP) blocks of the apparatus, the at least one fabric including at least one status storage, and a fabric bridge controller coupled to the at least one fabric. The fabric bridge controller may be configured to initiate a functional safety test of the at least one fabric in response to a fabric test signal received during functional operation of the apparatus, receive a result of the functional safety test via the at least one status storage, and send to a destination location a test report based on the result. Other embodiments are described and claimed.
    Type: Application
    Filed: November 2, 2017
    Publication date: January 31, 2019
    Inventors: Lakshminarayana Pappu, Robert P. Adler, R. Selvakumar Raja Gopal