Abstract: Systems for effecting online financial transactions between individuals are disclosed. Any user may initiate a send money transaction or a request payment transaction with any other entity provided that entity has an e-mail address. For a send money transaction, the user sending money (payor) enters an amount of funds to be transferred and an e-mail address of the recipient of the funds (payee). The transfer request may include an identity confirmation through which the payor confirms the identity of the payee. The system sends an e-mail message to the payee at the address provided indicating that the amount of funds has been “received” on the payee's behalf. The payee may open an online account or identify an existing online account to complete the transaction as well as provide identity confirmation for the payor. Upon confirmation, the transfer may occur.

Abstract: An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: Interactions with a trigger device and/or body motions, such as motions detected with an accelerometer, may be used to augment user input interaction with a mobile terminal. In one implementation, logic senses when a first trigger device enters close proximity to the mobile terminal. A command for the mobile terminal is then executed based on the trigger device. The trigger device may be, for example, integrated with jewelry or clothing.

Abstract: A method and apparatus for managing a network access device is provided. Embedded within the access device are three distinct software layers. The first layer is a combined text-interface generator and Hypertext Transport Protocol client. The second layer is a combined Hypertext Transport Protocol server and Simple Network Management Protocol manager. The third layer is a Simple Network Management Protocol agent that has direct access to the configuration data of the access device. A user can manage the device through the embedded text-interface generator, by using an external HTTP client to communicate with the embedded HTTP server, or by using an external SNMP manager to communicate with the embedded SNMP agent. Techniques are disclosed for embedding SNMP information in messages passed between HTTP clients and servers.

Abstract: A remote water meter monitoring system is provided. A mesh network-type transceiver unit is coupled to a water meter housing having a water counting mechanism inside to transmit water consumption information as well as other sensor information, such as backflow detection, water pressure, and water metrics (e.g., residual chlorine and temperature) to a central server system via a bridge device and a corresponding mesh network. Mechanical energy from the water flowing through the water meter housing is converted to electrical energy via an energy conversion unit. An electrically powered shut off valve is remote addressable via the transceiver unit.

Abstract: An orifice array plate and a charge plate for a continuous ink jet printer print head are integrally fabricated by providing an electrically non-conductive substrate; forming, on one side of the substrate, an orifice plate with an array of orifices; forming, on the other side of the substrate, a charge plate comprising a plurality of charge leads aligned with respective ones of the orifices; and removing at least that portion of the substrate that is between the orifices and the charge leads. The final produce includes an electrically non-conductive substrate; an orifice plate, including an array of orifices, on one side of the substrate; a charge plate, including a plurality of charge leads, on the other side of the substrate such that the charge leads are aligned with respective ones of the orifices; and a plurality of passages through the substrate, said passages extending between the orifices and the charge leads.

Abstract: Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

Abstract: A method and apparatus for managing a network access device is provided. Embedded within the access device are three distinct software layers. The first layer is a combined text-interface generator and Hypertext Transport Protocol client. The second layer is a combined Hypertext Transport Protocol server and Simple Network Management Protocol manager. The third layer is a Simple Network Management Protocol agent that has direct access to the configuration data of the access device. A user can manage the device through the embedded text-interface generator, by using an external HTTP client to communicate with the embedded HTTP server, or by using an external SNMP manager to communicate with the embedded SNMP agent. Techniques are disclosed for embedding SNMP information in messages passed between HTTP clients and servers.

Abstract: A drive assembly associated with a front wheel of a wheeled conveyance having a crosswise extending and linear shaped handle. A pair of sliding handle gripping portions are attached to extending ends of the handle, the gripping portions being linearly translated in first and second directions to continuously drive a closed loop belt extending within the handle. A drive shaft is operably engaged at a first end to the continuously driven closed loop belt. An extending end of the drive shaft operably engages the front wheel of the conveyance, such that actuation of the gripping portions is translated to forward rotating motion of the wheel.

Abstract: A method and apparatus for managing a network access device is provided. Embedded within the access device are three distinct software layers. The first layer is a combined text-interface generator and Hypertext Transport Protocol client. The second layer is a combined Hypertext Transport Protocol server and Simple Network Management Protocol manager. The third layer is a Simple Network Management Protocol agent that has direct access to the configuration data of the access device. A user can manage the device through the embedded text-interface generator, by using an external HTTP client to communicate with the embedded HTTP server, or by using an external SNMP manager to communicate with the embedded SNMP agent. Techniques are disclosed for embedding SNMP information in messages passed between HTTP clients and servers.

Abstract: A heat transfer apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Abstract: A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.

Abstract: A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange element includes a first set and a second set of coolant flow passages intersecting different pairs of parallel face surfaces of the elements, with the second set of flow passages extending in a transverse direction to the first set of flow passages. The heat exchange elements are disposed within the housing with the first set of flow passages oriented in a first common direction in fluid communication with the first coolant inlet and outlet and the second set of flow passages oriented in a second common direction in fluid communication with the second coolant inlet and outlet of the housing.

Abstract: A method and incorporated hybrid air and liquid cooled module for cooling electronic components of a computing system is disclosed. The module is used for cooling electronic components and comprise a closed loop liquid cooled assembly in thermal communication with an air cooled assembly, such that the air cooled assembly is at least partially included in the liquid cooled assembly.

Abstract: An inkjet printer having an array of nozzles from which ink drops are emitted further includes a mechanism adapted to detect fluid levels in an ink supply tank to the inkjet printer while the printer is in idle mode, and shut down the printer when ink usage exceeds a predetermined volume.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.