Patents by Inventor Robert Tozer
Robert Tozer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10309074Abstract: A modular foundation design for supporting a wind turbine or telecommunication tower, comprised of pre-cast concrete modules offering advantages of off-site manufacture and ease of transportation, but which deign is simple to construct. A base slab is provided comprised of sub-modules/base members arranged together in juxtaposed position which together provide a horizontal surface on which pre-cast pipe members may be stacked in end-to-end position to form a pedestal. Anchor rods extend through the pipe members into screw retainers in the base members, which rods serve to not only post-tension the pipe members and secure them together, but further advantageously serve to retain the base members together thereby assisting in distributing forces and loads applied to one sub-module/base member over the entire base slab. Coupling means to further couple the base members together may be added to better retain the base members together and still further improve distribution of forces.Type: GrantFiled: January 28, 2016Date of Patent: June 4, 2019Assignee: 649119 N.B. INC.Inventor: Robert Tozer
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Publication number: 20170183840Abstract: A modular foundation design for supporting a wind turbine or telecommunication tower, comprised of pre-cast concrete modules offering advantages of off-site manufacture and ease of transportation, but which deign is simple to construct. A base slab is provided comprised of sub-modules/base members arranged together in juxtaposed position which together provide a horizontal surface on which pre-cast pipe members may be stacked in end-to-end position to form a pedestal. Anchor rods extend through the pipe members into screw retainers in the base members, which rods serve to not only post-tension the pipe members and secure them together, but further advantageously serve to retain the base members together thereby assisting in distributing forces and loads applied to one sub-module/base member over the entire base slab.Type: ApplicationFiled: January 28, 2016Publication date: June 29, 2017Inventor: Robert TOZER
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Publication number: 20160066479Abstract: According to one embodiment of the present invention, there is provided cooling apparatus. The cooling apparatus comprises an outlet for supplying chilled liquid, an inlet for receiving return chilled liquid, a free cooling system for providing first cooling to the return chilled liquid, a chiller unit for further cooling the first cooled return liquid to a predetermined temperature, a pressure difference sensor for measuring the pressure difference between the chilled liquid supplied at the outlet and the return liquid received at the inlet, and a flow control module for maintaining a predetermined pressure difference between the liquid supplied at the outlet and the return liquid received at the inlet.Type: ApplicationFiled: September 18, 2015Publication date: March 3, 2016Inventor: Robert Tozer
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Patent number: 9179580Abstract: The invention is a cooling module for one or more data centers. The cooling module accepts coolant from a data center, chills the coolant, then returns the coolant to the data center. The coolant is subject to cooling via a free cooling system and a then chiller. The chiller includes a bypass. The free cooling system and the chiller are fluidly connected in a second cooling loop that includes a dry cooling tower. A pump maintains pressure at a predetermined level.Type: GrantFiled: June 10, 2010Date of Patent: November 3, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventor: Robert Tozer
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Patent number: 8634963Abstract: According to one embodiment of the present invention, there is provided an apparatus for cooling a data center. The apparatus comprises an air conditioning unit for supplying cooled air to a cold portion of a data center, an airflow measurement device for measuring a rate of bypass airflow through a segregation between the cold portion and hot portion of the data center, and outputting a bypass airflow signal indicative of the rate of bypass airflow between the cold portion and the hot portion, and a control unit arranged to receive the bypass airflow signal from the airflow measurement device and to output a control signal to a means for controlling a rate of the bypass airflow to maintain a predetermined rate of bypass airflow.Type: GrantFiled: November 13, 2009Date of Patent: January 21, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert Tozer, Luke Neville
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Publication number: 20120103591Abstract: According to one embodiment of the present invention, there is provided cooling apparatus. The cooling apparatus comprises an outlet for supplying chilled liquid, an inlet for receiving return chilled liquid, a free cooling system for providing first cooling to the return chilled liquid, a chiller unit for further cooling the first cooled return liquid to a predetermined temperature, a pressure difference sensor for measuring the pressure difference between the chilled liquid supplied at the outlet and the return liquid received at the inlet, and a flow control module for maintaining a predetermined pressure difference between the liquid supplied at the outlet and the return liquid received at the inlet.Type: ApplicationFiled: June 10, 2010Publication date: May 3, 2012Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventor: Robert Tozer
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Publication number: 20110238236Abstract: According to one embodiment of the present invention, there is provided an apparatus for cooling a data centre. The apparatus comprises an air conditioning unit for supplying cooled air to a cold portion of a data centre, an airflow measurement device for measuring a rate of bypass airflow through a segregation between the cold portion and hot portion of the data centre, and outputting a bypass airflow signal indicative of the rate of bypass airflow between the cold portion and the hot portion, and a control unit arranged to receive the bypass airflow signal from the airflow measurement device and to output a control signal to a means for controlling a rate of the bypass airflow to maintain a predetermined rate of bypass airflow.Type: ApplicationFiled: November 13, 2009Publication date: September 29, 2011Inventors: Robert Tozer, Luke Neville
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Patent number: 7969727Abstract: According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.Type: GrantFiled: April 29, 2009Date of Patent: June 28, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert Tozer, Cullen Bash, Chandrakant Patel
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Patent number: 7903404Abstract: According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.Type: GrantFiled: April 29, 2009Date of Patent: March 8, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert Tozer, Cullen Bash, Chandrakant Patel
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Publication number: 20100277863Abstract: According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.Type: ApplicationFiled: April 29, 2009Publication date: November 4, 2010Inventors: Robert TOZER, Cullen BASH, Chandrakant PATEL
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Publication number: 20100277864Abstract: According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.Type: ApplicationFiled: April 29, 2009Publication date: November 4, 2010Inventors: Robert Tozer, Cullen Bash, Chandrakant Patel
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Publication number: 20100252231Abstract: Embodiments of the present invention provide a data centre, comprising data centre air directing means for directing data centre air from the data centre through a first side of one or more heat exchangers; external air directing means for directing external air from external to the data centre through a second side of the one or more heat exchangers; and adiabatic cooling means for adiabatically cooling the external air prior to entering the one or more heat exchangers, such that the external air flowing through the second side of the one or more heat exchangers indirectly cools the data centre air flowing through the first side of the one or more heat exchangers. Embodiments of the present invention may be realised in which the data centre is a moveable data centre.Type: ApplicationFiled: October 7, 2009Publication date: October 7, 2010Inventors: Robert TOZER, Luke NEVILLE