Abstract: Embodiments of the invention provide methods of reducing electroplating defects by adjusting immersion conditions. For one embodiment, the immersion conditions are adjusted based upon characteristics of the substrate, including feature size. Additionally or alternatively, the immersion conditions may be adjusted based upon aspects of the electroplating process, including motion of the substrate upon immersion. Immersion conditions that may be adjusted in accordance with various embodiments of the invention include entry bias voltage/current, vertical immersion speed, and angle of immersion.

Abstract: A die is provided with an insulation layer and an interconnect. The interconnect has been recrystallized to reduce void content.

Abstract: A method for manufacturing an optical compensation film and the device thereof are provided. The method includes steps as follows. First, a horizontal condensing electric field orientation layer along an x-axis is formed by exposing a first linear photo reactive polymer layer on a first substrate under a transmissive polarized-light UV. Secondly, a first optical anisotropy film having the x-axis optic axis is formed on the horizontal condensing electric field orientation layer. Thirdly, a vertical condensing electric field orientation layer along a y-axis is formed on the first optical anisotropy film by exposing a second linear photo reactive polymer layer under a reflective polarized-light UV. Fourthly, a second optical anisotropy film having the y-axis optic axis is formed on the vertical condensing electric field orientation layer. Thereby, an optical compensation film with double optical-axes is formed.

Abstract: An illumination lamp assembly has a wire, a plurality of illuminant bulbs, a plurality of lamp holders installed on the wire. Each of the illuminant bulbs is disposed on the corresponding lamp holder. The wire has two cores, a plastic sheath covering and separating the cores, and a covering casing adhered on an outer layer of the plastic sheath.

Abstract: A network system for providing a customer with a prepaid wireless remote access service where the system comprises a base station including a wireless access point for communicating through a wireless medium with a wireless station operated by a customer, a global communications network including a plurality of remote computer servers, the global communications network being connected to the base station, and a central access server in communication with the base station through the global communications network for providing the customer with the wireless prepaid remote access service from the wireless station to the plurality of remote computer servers.

Abstract: A prepaid card terminal connected via a global communications network to a remote central server adapted to store and maintain account data associated with a prepaid card where the prepaid card terminal comprises a microcontroller for executing preprogrammed instructions and generating directives, input means electrically connected and responsive to the microcontroller for enabling a customer to input information including prepayment amount in connection with the prepaid card and generating an information signal to the microcontroller, a currency acceptor electrically connected and responsive to the microcontroller for accepting currency from the customer to pay the prepayment amount, and generating a currency accepted signal to the microcontroller upon paying the prepayment amount, output means electrically connected and responsive to the microcontroller for prompting the customer to input the information, and a network interface device electrically connected and responsive to the microcontroller for interfa

Abstract: The present invention is generally directed to an access terminal maintained by a service provider and connected to a global communications network for furnishing telecommunications and automated teller machine (ATM) services to a customer, where the access terminal comprises a microcontroller for executing preprogrammed instructions and generating directives, a payment acceptor electrically connected and responsive to the microcontroller for accepting payment from the customer to pay for access to the services, a multimedia user interface electrically connected and responsive to the microcontroller for enabling exchange of information between the customer and the access terminal during access to the services upon accepting payment from the customer, the multimedia user interface including an ATM interface in one mode of operation for executing an ATM/POS financial transaction by the customer via the global communications network, and a network interface device electrically connected and responsive to the mic

Abstract: A multimedia access terminal for providing telecommunication and remote access services to a customer, in which the multimedia access terminal comprises a microcontroller for executing preprogrammed instructions and generating directives, a payment acceptor electrically connected and responsive to the microcontroller for accepting payment from the customer to pay for access to the services, a network interface device electrically connected and responsive to the microcontroller for connecting with a central service provider server via a global communications network, and a multimedia user interface electrically connected and responsive to the microcontroller for enabling exchange of information with the customer during access to the services upon acceptance of the payment.

Abstract: In accordance with a first aspect of the invention, a plasma reactor having a chamber for containing a plasma and a passageway communicating with the chamber is enhanced with a first removable plasma confinement magnet module placed adjacent the passageway including a first module housing and a first plasma confinement magnet inside the housing. It may further include a second removable plasma confinement magnet module placed adjacent the passageway including a second module housing, and a second plasma confinement magnet. Preferably, the first and second modules are located on opposite sides of the passageway. Moreover, the first and second plasma confinement magnets have magnetic orientations which tend to oppose plasma transport or leakage through the passageway. Preferably, the module housing includes a relatively non-magnetic thermal conductor such as aluminum and is in thermal contact with said chamber body.

Abstract: The present disclosure pertains to a post-etch treatment which is performed after a dielectric etch process. Using the method of the invention, byproducts formed on the sidewalls of contact vias during the dielectric etch process can be removed efficiently. The method of the invention also reduces or eliminates the problem of polymer accumulation on process chamber surfaces. Typically, after the etch of a dielectric material to define pattern or interconnect filling spaces, a series of post-etch treatment steps is performed to remove residues remaining on the wafer after the dielectric etch process. According to the method of the present invention, a post-etch treatment method including one or more steps is performed after the dielectric etch process, preferably within the same processing chamber in which the dielectric etch process was performed.

Abstract: In accordance with a first aspect of the invention, a plasma reactor having a chamber for containing a plasma and a passageway communicating with the chamber is enhanced with a first removable plasma confinement magnet module placed adjacent the passageway including a first module housing and a first plasma confinement magnet inside the housing. It may further include a second removable plasma confinement magnet module placed adjacent the passageway including a second module housing, and a second plasma confinement magnet. Preferably, the first and second modules are located on opposite sides of the passageway. Moreover, the first and second plasma confinement magnets have magnetic orientations which tend to oppose plasma transport or leakage through the passageway. Preferably, the module housing includes a relatively non-magnetic thermal conductor such as aluminum and is in thermal contact with said chamber body.