Patents by Inventor Roberto A. Pugliese

Roberto A. Pugliese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Patent number: 6945634
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: September 20, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith
  • Methods and systems for forming slots in a substrate
    Patent number: 6911155
    Abstract: The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: June 28, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael D. Miller, Michael Hager, Naoto A. Kawamura, Roberto A. Pugliese, Jr., Ronald L. Enck, Susanne L. Kumpf, Shen Buswell, Mehrgan Khavari
  • Droplet plate architecture
    Patent number: 6837572
    Abstract: A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: January 4, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ravi Ramaswami, Victor Joseph, Colin C. Davis, Ronnie J. Yenchik, Daniel A. Kearl, Martha A. Truninger, Roberto A. Pugliese, Jr., Ronald L. Enck
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Publication number: 20040067319
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 8, 2004
    Inventors: Roberto A. Pugliese, Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P. Storm, Allen H. Smith
  • Droplet plate architecture
    Publication number: 20040032456
    Abstract: A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
    Type: Application
    Filed: August 19, 2003
    Publication date: February 19, 2004
    Inventors: Ravi Ramaswami, Victor Joseph, Collin C. Davis, Ronnie J. Yenchik, Daniel A. Kearl, Martha A. Truninger, Roberto A. Pugliese, Ronald L. Enck
  • Droplet plate architecture
    Patent number: 6682874
    Abstract: A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: January 27, 2004
    Assignee: Hewlett-Packard Development Company L.P.
    Inventors: Ravi Ramaswami, Victor Joseph, Colin C. Davis, Ronnie J. Yenchik, Daniel A. Kearl, Martha A. Truninger, Roberto A. Pugliese, Jr., Ronald L. Enck
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Patent number: 6648732
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: November 18, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith
  • Methods and systems for forming slots in a substrate
    Publication number: 20030141279
    Abstract: The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Michael D. Miller, Michael Hager, Naoto A. Kawamura, Roberto A. Pugliese, Ronald L. Enck, Susanne L. Kumpf, Shen Buswell, Mehrgan Khavari
  • Droplet plate architecture
    Publication number: 20030011659
    Abstract: A process for fabricating a droplet plate for the printhead of an inkjet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
    Type: Application
    Filed: September 16, 2002
    Publication date: January 16, 2003
    Inventors: Ravi Ramaswami, Victor Joseph, Colin C. Davis, Ronnie J. Yenchik, Daniel A. Kearl, Martha A. Truninger, Roberto A. Pugliese, Ronald L. Enck
  • Droplet plate architecture in ink-jet printheads
    Patent number: 6482574
    Abstract: A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: November 19, 2002
    Assignee: Hewlett-Packard Co.
    Inventors: Ravi Ramaswami, Victor Joseph, Colin C. Davis, Ronnie J. Yenchik, Daniel A. Kearl, Martha A. Truninger, Roberto A. Pugliese, Jr., Ronald L. Enck
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Publication number: 20020102918
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Roberto A. Pugliese, Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P. Storm, Allen H. Smith