Patents by Inventor Rocky R. Arnold

Rocky R. Arnold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for coating a substrate
    Publication number: 20020002945
    Abstract: Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the substrate. The processing apparatus can include a surface preparation assembly, a heating assembly, a thermoforming assembly, a metallizing assembly, a cutting assembly, or the like.
    Type: Application
    Filed: March 19, 2001
    Publication date: January 10, 2002
    Inventor: Rocky R. Arnold
  • Electromagnetic interference shielding of electrical cables and connectors
    Publication number: 20010040043
    Abstract: The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.
    Type: Application
    Filed: February 16, 2001
    Publication date: November 15, 2001
    Applicant: SHIELDING FOR ELECTRONICS, INC.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold
  • EMI and RFI shielding for printed circuit boards
    Publication number: 20010033478
    Abstract: The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit board from EMI. The metallized conductive layer can be disposed over an encapsulating insulative layer or onto a shaped thermoform or mold injected plastic substrate that is coupled to the PCB or FPC.
    Type: Application
    Filed: February 16, 2001
    Publication date: October 25, 2001
    Applicant: SHIELDING FOR ELECTRONICS, INC.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold