Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A micro IVF chamber that enables rapid filling, hermetic sealing, and custom gas environment control for secure cell extraction, fertilization, culturing, insemination, macro and microscopic content examination, post examination rapid refilling, return to optimal gas levels and pH values, with direct view of cell in conventional microscopes while maintaining culture environment, designed for use in any incubator and multiple devices per shelf for optimum efficiency while maintaining integrity of individual devices and patient-culture identity in a simple one-sample clamp-and-go device is disclosed.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: A system and method to facilitate receipt of an optoelectronic module in a first direction and make an electrical connection by movement of the module in a second direction different from the first direction.

Abstract: A system and method to facilitate receipt of an optoelectronic module in a first direction and make an electrical connection by movement of the module in a second direction different from the first direction.

Abstract: An optical device has a mating piece constructed to accept and mate with a commercially available optical connector, an optical module, and a spacer located between the mating piece and the optical module, the spacer maintaining the mating piece and the optical module in alignment relative to each other in at least the Z direction and one other direction.

Abstract: An ultrasound imaging system including an electromagnetically protected ultrasound TEE probe, a display for displaying ultrasound images, a housing including a transducer connector including at least one connection and a computer for processing electrical signals representative of received ultrasound echoes. The TEE probe includes a probe housing including an imaging sensor, an outer acoustic lens, a cable interconnect and an internal metal shield which surrounds the sensor and cable interconnect, and a cable including electrical conductors and electromagnetic cable shielding, the electrical conductors electrically connected to the cable interconnect at a first end, and the electrical conductors and the cable shielding are electrically connected to a transducer connector at a second end.

Abstract: A heat sink has a fenestrated outer surface and internal structure supporting the outer surface to facilitate heat transfer from, and provide structural rigidity to, the heat sink.

Abstract: An ultrasound imaging system including an electromagnetically protected ultrasound TEE probe, a display for displaying ultrasound images, a housing including a transducer connector including at least one connection and a computer for processing electrical signals representative of received ultrasound echoes. The TEE probe includes a probe housing including an imaging sensor, an outer acoustic lens, a cable interconnect and an internal metal shield which surrounds the sensor and cable interconnect, and a cable including electrical conductors and electromagnetic cable shielding, the electrical conductors electrically to the cable interconnect at a first end, and the electrical conductors and the cable shielding are electrically connected to a transducer connector at a second end. The internal metal shield is electrically connected to the cable shielding such that all elements inside a boundary formed by the transducer housing and outer acoustic lens are substantially electromagnetically protected.