Wing portion of a butterfly-style inside-out heat sink

- Cubic Wafer, Inc.
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Description

FIG. 1 is a perspective view illustrating the top, front and right side of a butterfly-style, inside out heat sink wing portion embodying our claimed design, wherein the broken-line disclosure illustrates an example intended environment of this example embodiment for illustrative purposes only and forms no part of the claimed design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof, with the opposite side being a mirror image;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

We claim the ornamental design for a wing portion of a butterfly-style inside out heat sink, as shown and described.

Referenced Cited
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D479828 September 23, 2003 Dugas
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Foreign Patent Documents
06310629 November 1994 JP
Patent History
Patent number: D543953
Type: Grant
Filed: Sep 2, 2003
Date of Patent: Jun 5, 2007
Assignee: Cubic Wafer, Inc. (Merrimack, NH)
Inventors: Roger Dugas (Chester, NH), Ross L. Frushour (Westford, MA)
Primary Examiner: Selina Sikder
Attorney: Morgan & Finnegan, LLP
Application Number: 29/189,322
Classifications
Current U.S. Class: Heat Sink (D13/179)