Abstract: A method, performed by a node, of provisioning a plurality of cable modems connected to the node, the method including: recording a respective transmit power level for each cable modem of the plurality of cable modems; determining a first set of the plurality of cable modems that can be allocated to a specified frequency band available for upstream communications according to an aggregation of the transmit power levels of the first set of the plurality of cable modems; and provisioning each cable modem of the first set to use at least a portion of the specified frequency.

Abstract: The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.

Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract: A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

Abstract: The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.

Abstract: A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

Abstract: The present invention provides a method to fabricate an optical coupler comprising the steps of: preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide; masking a halftone design with variation in optical density to delineate an optical element in the glass; exposing the photosensitive glass substrate to an activating energy source; exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature; cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate; and etching the glass-crystalline substrate with an etchant solution to form the one or more optical elements.

Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract: An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.

Abstract: The present invention provides a method to fabricate an optical coupler comprising the steps of: preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide; masking a halftone design with variation in optical density to delineate an optical element in the glass; exposing the photosensitive glass substrate to an activating energy source; exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature; cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate; and etching the glass-crystalline substrate with an etchant solution to form the one or more optical elements.

Abstract: The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Abstract: The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Abstract: The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Abstract: An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.

Abstract: The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract: Braided or twisted lines made from a) gel spun polyolefin yarns and b) at least one other yarn or monofilament are stretched to increase line tenacity. If desired, stretching conditions can also be chosen to significantly reduce the denier of the line.

Abstract: Disclosed is a geometric puzzle comprising a plurality of three-dimensional components of at least one type, each component of the same type being derived by notionally dividing a fundamental shape into a plurality of equal parts, said fundamental shape being selected from the group consisting of a regular tetrahedron having edges of equal length and a regular pyramid with a square base and also having edges of equal length, said components being capable of assembly into multiple composite shapes. Each component may be equal and identical to one another or each pair of components may comprise mirror images of one another. Surfaces of said components may be provided attractive magnetic elements to hold said components in a composite shape.

Abstract: Braided or twisted lines made from a) gel spun polyolefin yarns and b) at least one other yarn or monofilament are stretched to increase line tenacity. If desired, stretching conditions can also be chosen to significantly reduce the denier of the line.