Abstract: Data may be transferred from a communication subsystem of a first device to a communication subsystem of a second device contactlessly, at high speed, and without intervention by host processors of either device. Devices may be programmed or personalized at the factory or warehouse, and may personalized at a warehouse or at a point of sale while in the box. Various modes of operation and use scenarios are described. Portions of the devices themselves, or a transmission path between the devices may be shielded against snooping by a material which degrades an EHF signal passing therethrough.

Abstract: “Smart” connectors with embedded processors, measurement circuits and control circuits are disclosed for establishing a “contactless” radio frequency (RF) electromagnetic (EM) Extremely High Frequency (EHF) communications link between two electronic devices having host systems. The connectors are capable of monitoring, controlling, and directing (managing) link operation to dynamically adapt to conditions, as well as monitoring and altering (or modifying) data passing through the connector, and selecting a protocol suitable for a communications session. The connectors are capable of identifying the type of content being transferred, providing authentication and security services, and enabling application support for the host systems based on the type of connection or the type of content. The connectors may operate independently of the host systems, and may perform at least one of sensing proximity of a nearby object; detecting a shape of a nearby object; and detecting vibrations.

Abstract: Shielded extremely high frequency (EHF) connector assemblies are disclosed herein. In some embodiments, a first extremely high frequency (EHF) shielded connector assembly configured to be coupled with a second EHF shielded connector assembly. The first EHF connector assembly can include a first EHF communication unit operative to contactlessly communicate EHF signals with a second EHF communication unit included in the second EHF shielded connector assembly. The first connector can include a connector interface that includes a configuration to interface with a respective connector interface of the second EHF shield connector assembly, and several different material compositions that, in conjunction with the configuration, provide shielding to prevent or substantially reduce EHF signal leakage when the first EHF assembly connector is coupled to the second EHF assembly connector and the first EHF communication unit is contactlessly communicating EHF signals with the second EHF communication unit.

Abstract: EHF communication systems described herein can selectively implement any one of the USB standards by mapping appropriate USB signal conditions over an EHF contactless communication link. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors, and as such enables wired connection USB signaling protocols to be used in a non-wired environment provided by the EHF contactless communications link. Use of a USB protocol over the EHF communications link can be accomplished by establishing the EHF link between counterpart EHF communication units, and then by establishing the appropriate USB protocol over the link.

Abstract: Embodiments discussed herein refer to systems, methods, and circuits for conforming to power up sequencing rules of a conventional hard-wired data connection even though the hard-wired data connection that would ordinarily exist between two data controllers has been replaced with one or more contactless connectors. A consequence of replacing the hard-wired connection with a contactless connector is that the data controllers no longer directly control the power sequencing between the controllers because they are not able to directly communicate with each other over the hard-wired data connections. Power sequence assist circuitry may be used to assists the data controllers in establishing a link in accordance with the power sequencing rules of a particular wired interface despite the intentionally broken hard-wired data connection between the two controllers by instructing the contactless connectors to communicate with their respective data controllers in compliance with the power sequencing rules.

Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (Host-cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link). The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Abstract: Embodiments discussed herein refer to electric vehicle charging ports having integrated contactless communication units (CCUs). The electric vehicle charging ports include male and female connector assemblies that can be coupled together in a manner that enables consistent and reliable operation of contactless communications and power transfer. The connector integrates power and alignment such that when two connector assemblies are coupled together, power connections are made in combination with establishing contactless communications links between counterpart CCUs in both connector assemblies. The fixed alignment of the connector assemblies ensures that contactless communication channels, spanning between the connector assemblies, are aligned to enable consistent and reliable operation of contactless communications.

Abstract: An adapter may facilitate easy and swift data transfer amongst two previously incompatible electronic devices. Such an adapter may be operative to communicate data with a first of the two electronic devices using a contactless communication link and a first communication protocol and to communicate data with a second of the two electronic devices using a mechanical communication link and/or using a second communication protocol that is different than the first communication protocol, such that data may be transferred between the first and second electronic devices via the adapter. The adapter may be communicatively coupled to both the first electronic device and the second electronic device at the same time. The adapter may rapidly transition between communicating data with the first device and communicating data with the second device (e.g., without altering a physical connection between the adapter and one of the first and second devices during such a transition).

Abstract: Methods, systems, and apparatus for EM communications. One of the apparatus includes a super-regenerative amplifier (SRA) configured to receive a binary phase shift keying (BPSK) modulated signal and to output an amplitude signal as a function of changes in phase in the BPSK modulated signal; a pseudo synchronous demodulator that rectifies the amplitude signal and generates an envelope of the rectified amplitude signal; and an analog to digital converter that converts the amplitude values of the envelope to digital binary values.

Abstract: Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.

Abstract: Methods, systems, and apparatus for EM communications. One of the methods includes determining, at a first device, that a second device is present; initiating a half duplex communication with the second device; configuring communication with the second device including determining whether full duplex communication is available; in response to a determination that full duplex communication is not available, communicating with the second device in half duplex mode; and in response to a determination that full duplex communication is available, communication with the second device in full duplex mode.

Abstract: Shielded extremely high frequency (EHF) connector assemblies are disclosed herein. In some embodiments, a first extremely high frequency (EHF) shielded connector assembly configured to be coupled with a second EHF shielded connector assembly. The first EHF connector assembly can include a first EHF communication unit operative to contactlessly communicate EHF signals with a second EHF communication unit included in the second EHF shielded connector assembly. The first connector can include a connector interface that includes a configuration to interface with a respective connector interface of the second EHF shield connector assembly, and several different material compositions that, in conjunction with the configuration, provide shielding to prevent or substantially reduce EHF signal leakage when the first EHF assembly connector is coupled to the second EHF assembly connector and the first EHF communication unit is contactlessly communicating EHF signals with the second EHF communication unit.

Abstract: The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

Abstract: An adapter may facilitate easy and swift data transfer amongst two previously incompatible electronic devices. Such an adapter may be operative to communicate data with a first of the two electronic devices using a contactless communication link and a first communication protocol and to communicate data with a second of the two electronic devices using a mechanical communication link and/or using a second communication protocol that is different than the first communication protocol, such that data may be transferred between the first and second electronic devices via the adapter. The adapter may be communicatively coupled to both the first electronic device and the second electronic device at the same time. The adapter may rapidly transition between communicating data with the first device and communicating data with the second device (e.g., without altering a physical connection between the adapter and one of the first and second devices during such a transition).

Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Abstract: Display systems that use contactless connectors for transmitting data are provided. The contactless connectors are electromagnetic connectors that form an electromagnetic communications link. The electromagnetic communications link can be established within different locations of the same device, or between two different devices. The communications link can be established using at least two transceivers. The transceivers can be incorporated in different enclosures that are hinged together, or the transceivers can be incorporated within a hinge that enables two enclosures to move with respect to each other. A transceiver can be incorporated into a display device that can receive data from an active surface that has a transceiver. When the display device is placed on the active surface, the display device may serve as an access point to content contained within the active surface.

Abstract: Embodiments discussed herein refer to systems, methods, and circuits for conforming to power up sequencing rules of a conventional hard-wired data connection even though the hard-wired data connection that would ordinarily exist between two data controllers has been replaced with one or more contactless connectors. A consequence of replacing the hard-wired connection with a contactless connector is that the data controllers no longer directly control the power sequencing between the controllers because they are not able to directly communicate with each other over the hard-wired data connections. Power sequence assist circuitry may be used to assists the data controllers in establishing a link in accordance with the power sequencing rules of a particular wired interface despite the intentionally broken hard-wired data connection between the two controllers by instructing the contactless connectors to communicate with their respective data controllers in compliance with the power sequencing rules.

Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Abstract: Display systems that use contactless connectors for transmitting data are provided. The contactless connectors are electromagnetic connectors that form an electromagnetic communications link. The electromagnetic communications link can be established within different locations of the same device, or between two different devices. The communications link can be established using at least two transceivers. The transceivers can be incorporated in different enclosures that are hinged together, or the transceivers can be incorporated within a hinge that enables two enclosures to move with respect to each other. A transceiver can be incorporated into a display device that can receive data from an active surface that has a transceiver. When the display device is placed on the active surface, the display device may serve as an access point to content contained within the active surface.

Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.