Abstract: Embodiments are directed towards a use of a supported biphenylphenol polymerization catalyst to make a polymer via a slurry-phase polymerization process, where the supported biphenylphenol polymerization catalyst is made from a biphenylphenol polymerization precatalyst of Formula I.

Abstract: A method for managing a metrology system includes receiving a part, identifying, with a processing device, a part type associated with the part, retrieving, with the processing device, test rule logic associated with the part type from a database, retrieving, with the processing device, measurement data associated with the identified part type, processing, with the processing device, the measurement data, applying, with the processing device, the test rule logic to the processed measurement data to determine whether the part should be measured, outputting the part responsive to determining that the part should not be measured, and incrementing, with the processing device, a counter and saving a value of the counter in the database responsive to outputting the part responsive to determining that the part should not be measured.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool that includes at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Abstract: A method for managing a metrology system includes receiving a part, identifying, with a processing device, a part type associated with the part, retrieving, with the processing device, test rule logic associated with the part type from a database, retrieving, with the processing device, measurement data associated with the identified part type, processing, with the processing device, the measurement data, applying, with the processing device, the test rule logic to the processed measurement data to determine whether the part should be measured, outputting the part responsive to determining that the part should not be measured, and incrementing, with the processing device, a counter and saving a value of the counter in the database responsive to outputting the part responsive to determining that the part should not be measured.

Abstract: Methods, apparatuses and systems for monitoring a stage alignment in a processing system are disclosed. A method for monitoring a stage alignment in a processing system may include providing a calibration target on a surface of the stage; measuring an angle of incident of a light beam to the calibration target; and monitoring the stage alignment based on the determined angle of incidence.

Abstract: A method for addressing high Work In Process (WIP) conditions for increasing throughput while minimizing risk in a manufacturing line. Selected products to be skipped over during high WIP conditions include determining toolsets having work in process exceeding a certain threshold. For each of the toolsets, products which meet a criteria for skipping are selected. The selected products skip over to the toolset used in a subsequent process step ahead of product failing to meet the criteria for skipping. Solutions to this problem also include the WIP of the current process step, nominal WIP and WIP of subsequent process steps. Candidate lots for skipping process steps are identified by referencing a matrix of parameters that includes yield and criticality.

Abstract: Dynamic offset determination for each of a plurality of measurement systems for matching the systems is disclosed. One embodiment uses an artifact which is periodically run across the measurement system to be matched. Inputs for each run include the current offsets and historical data for the entire fleet and the new test measurement for the current measurement system under test. Evaluation based on exponentially weighted moving average and median calculation techniques may result in a new, reset offset for one or more measurement systems. The reset offset(s) is then applied to product measurements to nullify any tool matching issues.

Abstract: A method, system and computer program product for determining an angle of incidence of a light beam illuminating a workpiece positioned on a stage are disclosed. A method for determining an angle of incidence of a light beam illuminating a workpiece positioned on a stage may include: positioning a calibration target on the stage with multiple different tilts; first determining an angle of incident of the light beam with respect to the calibration target with each tilt using a detector; mapping a response of the detector to a determined angle of incidence; and second determining the angle of incidence with respect to the workpiece based on a result of the mapping.

Abstract: A method, system and computer program product for determining an Azimuth angle of an incident beam to a wafer are disclosed. A method comprises: using the incident beam to make a first set of measurements of calibration targets of a first set of grating angles that are different than one another; analyzing the first set of measurements to determine an reference grating angle which corresponds to a grating line to which the incident beam has a practically zero Azimuth angle; and determining the Azimuth angle of the incident beam to the wafer using the determined reference grating angle.

Abstract: A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.

Abstract: A method of releasing units in a production facility includes forming a release plan for a production facility that establishes a number of units to be operated on by a production process, and creating a least one recipe bucket having an associated number of units. The method further requires evaluating production process throughput parameters, and comparing the number of units associated with the at least one recipe bucket with the number of units to be operated on by the production process and production process throughput parameters. If the number of units in the recipe bucket matches the number of units to be operated on by the production process and production process throughput parameters, recipe bucket is released to the production process, else the at least one recipe bucket is delayed from being released to the production process.

Abstract: A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.

Abstract: Methods, apparatuses and systems for monitoring a stage alignment in a processing system are disclosed. A method for monitoring a stage alignment in a processing system may include providing a calibration target on a surface of the stage; measuring an angle of incident of a light beam to the calibration target; and monitoring the stage alignment based on the determined angle of incidence.

Abstract: A method, system and computer program product for determining a signal quality of an optical metrology tool are disclosed. A method comprises: collecting a data pool regarding measurements of a target made by the optical metrology tool, the data pool including a wavelength of incident light used in a measurement; and statistically analyzing the data pool to obtain a wavelength specific signal quality of the optical metrology tool.

Abstract: A method, system and computer program product for determining an angle of incidence of a light beam illuminating a workpiece positioned on a stage are disclosed. A method for determining an angle of incidence of a light beam illuminating a workpiece positioned on a stage may include: positioning a calibration target on the stage with multiple different tilts; first determining an angle of incident of the light beam with respect to the calibration target with each tilt using a detector; mapping a response of the detector to a determined angle of incidence; and second determining the angle of incidence with respect to the workpiece based on a result of the mapping.

Abstract: A sample stage for performing measurements using an optical metrology system includes at least one sample section for retention of a sample, and components for controlling orientation of the sample section with relation to the optical metrology system. A method and a computer program product are provided.

Abstract: A method, system and computer program product for determining a geometric parameter of an optical spot of a light beam are disclosed. A method comprises: providing a calibration target, the calibration target including a systematic variation in a parameter; measuring the calibration target with respect to the systematic variation using the light beam to obtain a plurality of measurements; and analyzing the measurements and the systematic variation to determine the geometric parameter of the optical spot.