Abstract: A method of forming a semiconductor device comprising forming a patterned resist over a stack comprising at least one material and removing a portion of the stack exposed through the patterned resist to form a stack opening. A portion of the patterned resist is laterally removed to form a trimmed resist and an additional portion of the stack exposed through the trimmed resist is removed to form steps in sidewalls of the stack. A dielectric material is formed between the sidewalls of the stack to substantially completely fill the stack opening, and the dielectric material is planarized. Additional methods are disclosed, as well as semiconductor devices.

Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.

Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.

Abstract: Various embodiments disclosed relate to methods of manufacturing a textured surface comprising disposing a nanoparticulate ink on a substrate.

Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.

Abstract: A system for remote handset diagnostics is provided. The system includes a plurality of handsets each having a diagnostic engine, and a carrier system having a plurality of encoder/decoder components. Each encoder/decoder component is operable to promote communication with at least one diagnostic engine to obtain diagnostic data. The carrier system further includes a diagnostic component that is operable to provide a common interface for diagnosing handsets. The diagnostic component is also operable to communicate with the plurality of encoder/decoder components and to facilitate diagnosis of the handset.

Abstract: A system for handset self diagnostics is provided. The system includes a handset and a diagnostic engine on the handset to obtain diagnostic data for the handset. The system also includes an application on the handset, and the application includes at least one user interface that uses the diagnostic data to assist a user of the handset to operate the handset.

Abstract: A system for remote handset diagnostics is provided. The system includes a plurality of handsets each having a diagnostic engine, and a carrier system having a plurality of encoder/decoder components. Each encoder/decoder component is operable to promote communication with at least one diagnostic engine to obtain diagnostic data. The carrier system further includes a diagnostic component that is operable to provide a common interface for diagnosing handsets. The diagnostic component is also operable to communicate with the plurality of encoder/decoder components and to facilitate diagnosis of the handset.

Abstract: A system for handset self diagnostics is provided. The system includes a handset and a diagnostic engine on the handset to obtain diagnostic data for the handset. The system also includes an application on the handset, and the application includes at least one user interface that uses the diagnostic data to assist a user of the handset to operate the handset.

Abstract: A method for synthetizing polyanhydrides in solution using coupling agents and a removable acid acceptor to effect a one-step polymerization of dicarboxylic acids. As used in the method, these coupling agents include phosgene, diphosgene, and acid chlorides. Insoluble acid acceptors include insoluble polyamines and crosslinked polyamines such as polyethyleneimine and polyvinylpyridine and inorganic bases such as K.sub.2 CO.sub.3, Na.sub.2 CO.sub.3, NaHCO.sub.3, and CaCO.sub.3. The only byproduct formed is a removable hydrochloric acid-acid acceptor.Examples are provided of the polymerization of highly pure polyanhydrides using phosgene, diphosgene or an acid chloride as the coupling agent, in combination with either an insoluble acid acceptor or a soluble acid acceptor in a solvent wherein the polymerizaiton byproduct or polymer is insoluble.A particularly important application of these polyanhydrides is in the formation of drug delivery devices containing bioactive compounds.

Abstract: A method for synthesizing polyanhydrides in solution using coupling agents and a removable acid acceptor to effect a one-step polymerization of dicarboxylic acids. As used in the method, these coupling agents include phosgene, diphosgene, and acid chlorides. Insoluble acid acceptors include insoluble polyamines and crosslinked polyamines such as polyethyleneimine and polyvinylpyridine and inorganic bases such as K.sub.2 CO.sub.3, Na.sub.2 CO.sub.3, NaHCO.sub.3, and CaCO.sub.3. The only byproduct formed is a removable hydrochloric acid-acid acceptor.Examples are provided of the polymerization of highly pure polyanhydrides using phosgene, diphosgene or an acid chloride as the coupling agent, in combination with either an insoluble acid acceptor or a soluble acid acceptor in a solvent wherein the polymerization byproduct or polymer is insoluble.A particularly important application of these polyanhydrides is in the formation of drug delivery devices containing bioactive compounds.