Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.

Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.

Abstract: Methods and apparatus for fast and efficient verify recovery and array discharge for 3D NAND memory arrays and other 3D storage devices. The 3D storage device includes storage arrays including strings of memory cells stacked on top of one another and sharing a channel in a pillar for the string. The memory cells for a string occupy respective tiers in a 3D structure with each tier having an associated wordline. A controller is used to program charge levels in the memory cells. Programming is followed by a fast verify recovery where a voltage is applied to the wordlines to perform a program verify, followed by discharging wordlines. Erased wordlines are identified and discharged first, followed by programmed wordlines, which may employ staggered discharge sequences. Dummy wordlines are then discharged, with an optional timer delay. For multi-deck devices, wordlines in the deck with an active wordline are discharged before wordlines in one or more other decks.

Abstract: The gap width in a threshold voltage (Vt) distribution for a 3D NAND Flash cell is improved by performing touchup program on a selected portion of the word lines in a block after all of the word lines in the block have been programmed.

Abstract: In one embodiment, an apparatus comprises a memory comprising a group of memory cells coupled to a wordline; and a controller configured to skip programming of one or more pages of the group of memory cells responsive to a sequential write operation; and program the one or more pages of the group of memory cells responsive to one or more random write commands.

Abstract: After reading a 3D (three dimensional) NAND array, the wordlines of the 3D NAND array can be transitioned to ground in a staggered manner. The 3D NAND array includes a 3D stack with multiple wordlines vertically stacked, including a bottom-most wordline, a top-most wordline, and middle wordlines between the bottom-most wordline and the top-most wordline. A controller that controls the reading can set the multiple wordlines to a read voltage for reading operations and then transition a selected wordline of the multiple wordlines from the read voltage to ground prior to transitioning the other wordlines to ground. Thus, the controller will transition the other wordlines from the read voltage to ground after a delay.

Abstract: A memory device comprising a memory array; and controller circuitry to apply a first pass voltage to a first plurality of unselected wordlines of the memory array during a string current sensing phase; and reduce the first pass voltage applied to the first plurality of unselected wordlines during a multistrobe sensing phase that follows the string current sensing phase.

Abstract: A nonvolatile (NV) memory device includes an NV storage media and a storage controller to control access to the NV storage media. In response to a host read request, the storage controller can determine if the NV storage media is in a stable Vt (threshold voltage) state. If the NV storage media is in a stable Vt state, the storage controller can perform a reset read operation prior to servicing the host read request. A reset read is a read operation that does not produce data to send back to the host. The reset read operation is a dummy read that puts the NV storage media into a transient Vt state, which has lower risk of read disturb.

Abstract: A memory device comprising a memory array; and controller circuitry to apply a first pass voltage to a first plurality of unselected wordlines of the memory array during a string current sensing phase; and reduce the first pass voltage applied to the first plurality of unselected wordlines during a multistrobe sensing phase that follows the string current sensing phase.

Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.

Abstract: Error correction coding (ECC) mis-corrected reads, if undetected, result in silent data corruption of a non-volatile memory device. Overcoming ECC mis-corrected reads is based on a read signature of a result of reading a page in the non-volatile memory device. An ECC mis-correct logic counts the number of bits in the end-most buckets into which the bits of the result is divided. End-most buckets that are overpopulated or starved reveal a tell-tale read signature of an ECC mis-correct. The ECC mis-correct is likely to occur when the read reference voltage level used to read the page is shifted in one direction or another to an extreme amount that risks reading data from a different page. Detecting ECC mis-corrected reads can be used to overcome the ECC mis-corrects and mitigate silent data corruption.

Abstract: A nonvolatile (NV) memory device includes an NV storage media and a storage controller to control access to the NV storage media. In response to a host read request, the storage controller can determine if the NV storage media is in a stable Vt (threshold voltage) state. If the NV storage media is in a stable Vt state, the storage controller can perform a reset read operation prior to servicing the host read request. A reset read is a read operation that does not produce data to send back to the host. The reset read operation is a dummy read that puts the NV storage media into a transient Vt state, which has lower risk of read disturb.

Abstract: Provided are techniques for resuming storage die programming after power loss. In response to receipt of an indication of the power loss, data that was to be programmed to multi-level cell NAND blocks are copied to single level cell NAND blocks and a pulse number at which programming was interrupted is stored. In response to receipt of an indication to resume from the power loss, the data is copied from the single level cell NAND blocks to a page buffer, the pulse number is retrieved, and programming of the multi-level cell NAND blocks is resumed at the retrieved pulse number using the data in the page buffer.

Abstract: Provided are techniques for resuming storage die programming after power loss. In response to receipt of an indication of the power loss, data that was to be programmed to multi-level cell NAND blocks are copied to single level cell NAND blocks and a pulse number at which programming was interrupted is stored. In response to receipt of an indication to resume from the power loss, the data is copied from the single level cell NAND blocks to a page buffer, the pulse number is retrieved, and programming of the multi-level cell NAND blocks is resumed at the retrieved pulse number using the data in the page buffer.

Abstract: A memory programmer apparatus may include a first-level programmer to program a first-level cell portion of a multi-level memory in a first pass, a coarse programmer to coarse program a second-level cell portion of the multi-level memory in the first pass, wherein the second-level cell portion includes more levels than the first-level cell portion, and a fine programmer to fine program the second-level cell portion of the multi-level memory in a second pass from data programmed in the first-level cell portion in the first pass.

Abstract: A device has a M8XY6 layer in between a first conductive layer on the top and a second conductive layer on the bottom, wherein (i) M includes at least one element selected from the following: Cu, Ag, Li, and Zn, (ii) X includes at least one Group XIV element, and (iii) Y includes at least one Group XVI element. Another device has MaXbYc material contacted on opposite sides by respective layers of conductive material, wherein: (i) M includes at least one element selected from the following: Cu, Ag, Li, and Zn, (ii) X includes at least one Group XIV element, and (iii) Y includes at least one Group XVI element, and a is in the range of 48-60 atomic percent, b is in the range of 4-10 atomic percent, c is in the range of 30-45 atomic percent, and a+b+c is at least 90 atomic percent.

Abstract: A crystalline semiconductor Schottky barrier-like diode sandwiched between two conducting electrodes is in series with a memory element, a word line and a bit line, wherein the setup provides voltage margins greater than 1V and current densities greater than 5×106 A/cm2. This Schottky barrier-like diode can be fabricated under conditions compatible with low-temperature BEOL semiconductor processing, can supply high currents at low voltages, exhibits high on-off ratios, and enables large memory arrays.

Abstract: A device for use with a memory cross-point array of elements, each of which comprises a selection device in series with a state-holding device, in one embodiment includes a controller, configured to apply at least one voltage and/or current pulse to a selected one or more of the elements, said selected one or more of the elements including a partially- or completely-shorted selection device, so that said partially- or completely-shorted selection device passes enough current so as to damage its corresponding state-holding device and place said corresponding state-holding device in a highly resistive state, while any other selection device that is not partially- or completely-shorted passes less current so that the state-holding device corresponding to said other selection device remains unaffected. Additional systems and methods are also presented.

Abstract: A system, method and computer program product produce spike-dependent plasticity in an artificial synapse. A method includes: an electronic device generating a pre-synaptic pulse that occurs a predetermined period of time after receiving a pre-synaptic spike at a first input. The electronic device generating a post-synaptic pulse that starts at a baseline value and reaches a first voltage value a first period of time after receiving a post-synaptic spike at a second input, followed by a second voltage value a second period of time after the post synaptic spike, followed by a return to said baseline voltage a third period of time after the post-synaptic spike. The generated pre-synaptic pulse is applied to a pre-synaptic node of a synaptic device in series with a rectifying element that has a turn-on voltage based on a threshold. The generated post-synaptic pulse is applied to a post-synaptic node of said synaptic device.

Abstract: A device for use with a memory cross-point array of elements, each of which comprises a selection device in series with a state-holding device, in one embodiment includes a controller, configured to apply at least one voltage and/or current pulse to a selected one or more of the elements, said selected one or more of the elements including a partially- or completely-shorted selection device, so that said partially- or completely-shorted selection device passes enough current so as to damage its corresponding state-holding device and place said corresponding state-holding device in a highly resistive state, while any other selection device that is not partially- or completely-shorted passes less current so that the state-holding device corresponding to said other selection device remains unaffected. Additional systems and methods are also presented.