Abstract: The invention relates to a method for measuring the viscosity of a fluid, said method comprising the following steps: (a) providing a flow of said fluid in a laminar state inside a channel (14, 24) having a characteristic transverse dimension D, and in which an elongate member (12, 22) having a characteristic dimension d is placed substantially along the longitudinal direction of said channel and substantially at the center of the channel, and has a portion of the length l thereof submerged in said channel; (b) measuring the friction force (f) applied by said fluid on the walls of the elongate member; and (c) calculating the dynamic viscosity (?) of said fluid based on the equation (1) f=??lU where U is the average flow rate and ? is a geometric factor.

Abstract: The invention is a technique for predicting future haze formation in dewaxed, petroleum-derived, lubricant base stocks and, by extension, products made from such base stocks. In general, the technique measures the changes in light scattering caused by the formation and disappearance of wax crystals in a dilute test sample of neat base stock, over the course of a temperature profile. The data obtained is then compared to a previously formulated historical correlation of measurements taken using light scattering data to haze potential. The technique focuses on haze disappearance temperature as a reference point, as opposed to total wax formation. The technique also uses a solvent to accelerate the formation of wax crystals in the test sample. The technique provides a robust early warning system that allows refineries to rapidly and accurately determine the long term haze potential of a base stock production prior to release. The technique can be performed in real time, typically in less than an hour.

Abstract: The invention is a technique for predicting future haze formation in dewaxed, petroleum-derived, lubricant base stocks and, by extension, products made from such base stocks. In general, the technique measures the changes in light scattering caused by the formation and disappearance of wax crystals in a dilute test sample of neat base stock, over the course of a temperature profile. The data obtained is then compared to a previously formulated historical correlation of measurements taken using light scattering data to haze potential. The technique focuses on haze disappearance temperature as a reference point, as opposed to total wax formation. The technique also uses a solvent to accelerate the formation of wax crystals in the test sample. The technique provides a robust early warning system that allows refineries to rapidly and accurately determine the long term haze potential of a base stock production prior to release. The technique can be performed in real time, typically in less than an hour.

Abstract: The subject of the present invention is a method for removing pollution from a confined environment containing an interior space bounded by a wall, involving the following steps: the confined environment which has a leak is placed in a sealed chamber having for example an inlet for introducing a gas and a pump for pumping a gas and the gas contained in the chamber and the gas contained inside the space are simultaneously pumped through the leak so that the pressure difference across the wall is always below a wall damaging threshold. Another subject of the invention is a related device for removing pollution from a confined environment.

Abstract: The invention relates to a method for measuring the viscosity of a fluid, said method comprising the following steps: (a) providing a flow of said fluid in a laminar state inside a channel (14, 24) having a characteristic transverse dimension D, and in which an elongate member (12, 22) having a characteristic dimension d is placed substantially along the longitudinal direction of said channel and substantially at the centre of the channel, and has a portion of the length l thereof submerged in said channel; (b) measuring the friction force (f) applied by said fluid on the walls of the elongate member; and (c) calculating the dynamic viscosity (?) of said fluid based on the equation (1) f=??lU where U is the average flow rate and ? is a geometric factor.

Abstract: A pumping system comprising at least one pump unit (2) with a vacuum pump casing in which there are multiple pumping stages that includes at least one pumped gas treatment system is provided. The pumped gas treatment system compromises at least one plasma source located inside the vacuum pump casing of the pump unit, to generate a plasma that at least partially decomposes certain gases passing through the pump unit. This reduces the size of the pumped gas treatment system and improves its efficiency so that a gas pumping and treatment system can be created that is sufficiently small as to allow it to be placed in close proximity to the process chambers.

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: Apparatus of the invention for transporting substrates (3) comprises a mini-environment enclosure (1) that is movable and that can be coupled to a conditioning station (22). The mini-environment enclosure (1) includes a micropump (12) whose inlet is connected to an inside cavity (2) that is to contain the substrate (3) to be transported. An energy supply (16) is also provided in the mini-environment enclosure (1) to power the micropump (12). The mini-environment enclosure (1) comprises a peripheral shell (4) open to two opposite main faces (5, 6), and including a closable side opening (7). A first main wall (8) is fitted to close the first main face (5) in leaktight manner. A second main wall (9) is fitted and secured to close the second main face (6) in leaktight manner. The first and second main walls are disposed in planes parallel to the plane containing the substrate.

Abstract: The subject of the present invention is a method for removing pollution from a confined environment containing an interior space bounded by a wall, involving the following steps: the confined environment which has a leak is placed in a sealed chamber comprising means of introducing a gas and means of pumping a gas the gas contained in the chamber and the gas contained inside the space are simultaneously pumped through the leak so that the pressure difference across the wall is always below a wall-damaging threshold. Another subject of the invention is a device for removing pollution from a confined environment comprising: a pollution removal chamber able to contain the confined environment, means of introducing a purging gas, means of pumping a gas with variable pumping capacity, means for controlling the pumping rate, means for monitoring the pressure difference between the inside and the outside of the environment. mechanical warping that would damage the wall of the unsealed enclosed environment.

Abstract: Pumping apparatus of the invention using thermal transpiration micropumps comprises a plurality of individual thermal transpiration micropumps distributed over a substrate (5) as a plurality of rows (A, B, C, . . . , D) each made up of a plurality of micropumps (1, 6, . . . , 7, 8, 9), thereby building up a plurality of columns (a, b, . . . , c, d). Respective heater elements (4) in each of the thermal transpiration micropumps are controlled by suitably controlling a row control conductor (10A) and a column control conductor (11a). This greatly simplifies multiplexed control of a large number of individual micropumps, thus enabling pumping capacity to be adapted.

Abstract: Provided is a device for the emission of X-rays. The device includes a vacuum pump including a sealed peripheral casing containing a cathode which emits a flux of electrons, a rotary anode mounted at the end of the shaft of the vacuum pump, a collection device for collecting an emitted electron beam and at least one cooling element, disposed opposite one of the main radial faces of the rotary anode, which is fixed to one of the vacuum pump stator or to the sealed peripheral casing.

Abstract: The present invention relates to a sealed enclosure for transporting and storing semiconductor substrates, the enclosure comprising a sealed container and support means placed inside the container and including trays for supporting substrates. The container comprises two touching half-shells that can be spaced apart in order to open the container, and each end of said support means is secured mechanically to a respective one of said half-shells. The total height of said means varies depending on whether the container is opened or closed, the trays being separated from one another by equal distances. Said support means preferably comprise an alternation of segments and ball joints having end segments that are mechanically connected to respective ones of the half-shells. Under such circumstances, the total height of said support means varies by the alternation of segments and ball joints moving concertina-like.

Abstract: A SMIF type mini-environment (1) can be connected onto a purge station (2). The purge station comprises a leaktight purge compartment (2b) whose top face includes a closable transfer passage (2c) facing the bottom face (1b) of the mini-environment pod (1). An elevator (4) is suitable for vertically displacing the bottom wall (1b) of the mini-environment pod (1) when coupled thereto, simultaneously moving the stack (3) of substrate wafers carried by the bottom wall (1c) so as to introduce them together into the leaktight purge compartment (2b). The stack (3) of substrate wafers is then purged inside a leaktight purge compartment (2b) of the purge station (2), while simultaneously purging the mini-environment pod (1). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.

Abstract: A device in accordance with the invention for the emission of X-rays, comprises a vacuum pump the sealed peripheral casing whereof contains a cathode for emitting a flux of electrons, a rotary anode mounted at the end of the shaft of the vacuum pump and a collection device for collecting an emitted electron beam. This considerably reduces the overall size of the X-ray source and, thanks to the very fast and stable rotation of the rotary anode attached to the rotor of the vacuum pump, a source of very great brightness is produced. The rotary anode may be moved axially to compensate the wear that it suffers through the impact of the incident electron beam coming from the cathode. According to the invention the device further comprises at least one cooling element fixed to the vacuum pump stator or to the sealed peripheral casing opposite one of the main radial faces of the rotary anode to absorb radiated heat energy emitted by the rotary anode in operation.

Abstract: In the invention, the atmosphere in a process chamber is conditioned using a primary pump, a secondary pump, speed control means for controlling the speed of the primary pump, and at least first gas analyzer means adapted for analyzing the extracted gases upstream from the primary pump and for producing first analysis signals. First signal processing means control the pumping speed as a function of the first analysis signals, so as to determine the variation in the pressure inside the process chamber during the transient stages of the treatment. In this way, deposits and turbulence are avoided in the process chamber, as are deposits in the pumping line, so that the secondary pump can be placed in the immediate vicinity of the process chamber.

Abstract: A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).

Abstract: Apparatus of the invention for transporting substrates (3) comprises a mini-environment enclosure (1) that is movable and that can be coupled to a conditioning station (22). The mini-environment enclosure (1) includes a micropump (12) whose inlet is connected to an inside cavity (2) that is to contain the substrate (3) to be transported. An energy supply (16) is also provided in the mini-environment enclosure (1) to power the micropump (12). The mini-environment enclosure (1) comprises a peripheral shell (4) open to two opposite main faces (5, 6), and including a closable side opening (7). A first main wall (8) is fitted to close the first main face (5) in leaktight manner. A second main wall (9) is fitted and secured to close the second main face (6) in leaktight manner. The first and second main walls are disposed in planes parallel to the plane containing the substrate.

Abstract: In a device of the invention, an SMIF type mini-environment (1) can be connected onto a purge station (2). The purge station comprises a leaktight purge compartment (2b) whose top face includes a closable transfer passage (2c) facing the bottom face (1b) of the mini-environment pod (1). An elevator (4) is suitable for vertically displacing the bottom wall (1b) of the mini-environment pod (1) when coupled thereto, simultaneously moving the stack (3) of substrate wafers carried by the bottom wall (1c) so as to introduce them together into the leaktight purge compartment (2b). The stack (3) of substrate wafers is then purged inside a leaktight purge compartment (2b) of the purge station (2), while simultaneously purging the mini-environment pod (1). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.

Abstract: According to the invention, a pumping system comprises at least one pump unit (2) with a vacuum pump casing in which there are multiple pumping stages (5, 6, 7, 8, 9) that includes at least one pumped gas treatment system, characterised by the fact that the pumped gas treatment compromises at least one plasma source (15, 16, 26, 27), located inside the vacuum pump casing of the pump unit (2), to generate a plasma that at least partially decomposes certain gases passing through the pump unit (2). This considerably reduces the size of the pumped gas treatment system and improves its efficiency so that a gas pumping and treatment system can be created that is sufficiently small as to allow it to be placed in close proximity to the process chambers.

Abstract: According to the invention, a semiconductor component manufacturing plant is constructed in a building having an upper storey and a lower storey separated from one another by a support slab and a false floor. The support slab has passageway openings, whilst the false floor consists of plates themselves having through passages. Vacuum generation means are disposed in an intermediate space situated between the support slab and the false floor which itself carries a process chamber situated in the upper space constituting a clean room. Suction means situated in the lower storey create a gaseous flow directed downwards from the clean room through the intermediate space to the lower storey. In this way, the false floor acts as a non-return mechanism for noise, thermal or chemical pollution coming from the vacuum generation means.