Abstract: A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.

Abstract: An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at least second component with an at least partial overlap relative to the first component. The lower die and the upper die can be moved relative to one another. The upper die carries at least two heatable plungers which are connected so as to be able to move relative to one another via a sealed pressure pad. The plungers and the pressure pad have a first flexible layer between them. A second flexible layer is arranged between the upper die and the lower die.

Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.