Abstract: The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.

Abstract: A substrate carrier made of glass for processing a transparent or transmissive substrate by electromagnetic radiation includes a first upper side serving as a substrate support and a lower side facing away from the upper side. The substrate support and/or the lower side of the substrate carrier has a structuring produced by modifications in the substrate carrier and a material removal by action of an etching medium in respective regions of the modifications in the substrate carrier. The structuring has a plurality of adjacent and/or merging conical recesses. At least one of the conical recesses is configured as a through-hole of the substrate carrier between the substrate support and the lower side, and a plurality of other ones of the conical recesses are configured as depressions.

Abstract: The invention provides a process for producing plastic parts, each of which has at least one glass insert which is connected to the plastic part along a connecting region, and the glass insert is free of plastic in the region encompassed by the connecting region and forms a glass window. The connecting region of the glass insert is preferably circumferentially closed. The glass window can have through-holes or preferably recesses extending only over a portion of the thickness of the glass window and having microstructures.

Abstract: A substrate made of glass includes an essentially dimensionally stable portion, one or more flexible portions, and one or more recesses on one side or which do not penetrate the substrate, and which is/are disposed in an outer surface of the substrate, so as to reduce a material thickness of the substrate in the flexible portion relative to an adjacent portion. The recess is formed in each case by a plurality of concave depressions that are defined by microstructures, a course of which determines a remaining material thickness of the substrate in the flexible portion. The depressions extend at least in portions into an area having a thickness parallel to the outer surface which on bending the substrate encloses a plane of a neutral axis between an extension zone and a compression zone of the substrate.

Abstract: A substrate comprises glass, sapphire, silicon and/or aluminosilicate, and has at least one recess or through-opening. The at least one recess or through-opening is formed by anisotropic removal of substrate material by etching a portion of the substrate that has been modified by a pulse of laser radiation in a direction of a thickness of the substrate. The modified portion of the substrate extends along a beam axis of the laser radiation. The pulse of laser radiation was applied with a focus extending from a first focal depth positioned past one side of the substrate to a second focal depth located at an opposite side of the substrate.

Abstract: A method for introducing a recess into a substrate, and/or for reducing a material, includes spatially beam shaping a focus of a laser beam along a beam axis, whereby defects are produced in the substrate along the beam axis without there being any material removal. One or more of the defects forms a modification in the substrate, so that subsequently the recess and/or the material thickness reduction is produced by action of an etching medium by an anisotropic material removal. An additional modification is introduced into the substrate along an additional beam axis that is parallel to and spaced from the beam axis, the additional modification having an extent between a first outer surface of the substrate and a position within the substrate that is at a distance from a second, opposite outer surface of the substrate.

Abstract: A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.

Abstract: A mounting method for an integrated semiconductor wafer device including a glass substrate a recess, at least one semiconductor wafer that is arranged in the recess, and at least one spring element engaging in the recess for maintaining the position or orienting the semiconductor wafer, wherein the method includes providing the glass substrate with a relaxed spring element engaging in the contour space of the semiconductor wafer, providing a spring manipulator substrate with a manipulation element adapted to the contour space and/or the at least one spring element, displacing the glass substrate in relation to the spring manipulator substrate such that its manipulation element runs into the recess, placing the semiconductor wafer into the recess, and displacing the glass substrate back in relation to the spring manipulator substrate such that its manipulation element moves out of the contour space of the semiconductor wafer, releasing the spring element.

Abstract: A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.

Abstract: A method for the integration of semiconductor components in a confined space, in particular for 3D integration, in which, after positioning relative to a carrier substrate and/or a redistribution layer, the semiconductor components are protected and fixed in their relative position by introduction of a potting compound, characterized in that before the introduction of the potting compound, a glass substrate having a multiplicity of cutouts separated by partition walls and serving to receive a semiconductor component, is positioned in such a way that the semiconductor component is enclosed by the sidewall surfaces—facing it—of the respective partition walls of the glass substrate.

Abstract: A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.

Abstract: A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

Abstract: An aspect of the invention provides a device, comprising: a laser machining head configured to deflect laser radiation onto an optical system comprising a substrate, the device being configured to carry out a method for separating the substrate using the optical system, the optical system being configured to provide the laser radiation, a thickness of the substrate not exceeding 2 mm in a region of a separating line, the method comprising: applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate using the optical system, the substrate material being transparent at least in part to a laser wavelength of the pulsed laser radiation, the pulsed laser radiation being focused using the optical system at an original focal depth (f1), an intensity of the pulsed laser radiation leading to a modification of the substrate along a beam axis (Z) of the pulsed laser radiation.

Abstract: A method for producing a display comprising a carrier substrate made of glass, the display having flexible, bendable and/or elastic properties in a predetermined region of the carrier substrate, includes introducing modifications into the carrier substrate within the region by laser radiation along a closed and/or linear contour and/or points. Within the region, a one flexible, bendable and/or elastic layer is applied. A side of the carrier substrate facing away from the layer is subjected to an etching attack, by which material removal from the carrier substrate takes place along the modifications along the contour and/or at the points of the region until recesses are produced that extend across or over a substantial part of a material thickness of the carrier substrate.

Abstract: A method for making a recess or opening in a planar workpiece with a thickness of less than 3 millimeters includes successively etching a plurality of flaws to form the recess or opening such that a contour of the recess or opening has a sequence of widenings and constrictions as a result of the etching.

Abstract: A method for producing a microstructure in a substrate with a membrane-like bridging or overhanging surface includes modifying the substrate, which is made of glass, by laser radiation along a peripheral contour. A membrane layer is applied over a surface of the substrate for producing the bridging or overhanging surface, wherein, at least in partial surfaces enclosing the peripheral contour of the laser modifications, a sacrificial layer is disposed between the substrate and the membrane layer. A side of the substrate facing away from the membrane layer is exposed to an etching attack such that material is removed primarily along the peripheral contour until the sacrificial layer is reached and there is a disintegration or reduction of the sacrificial layer and a separation of a connection of a part of the substrate enclosed by the peripheral contour from the surrounding substrate and from the membrane layer.

Abstract: A method for producing microstructures includes introducing modifications by a laser beam into a volume between two opposite outer surfaces of a glass substrate. An etching method is carried out which provides anisotropic material removal in one of the outer surfaces so as to produce recesses that have a conical shape. A layer that is resistant to an etching effect of the etching method is applied as a cover layer to only one outer surface. Then, a further etching method is carried out so that material is removed in the other outer surface until recesses of this other outer surface, which are produced and/or enlarged by the further etching method, have reached the cover layer.

Abstract: A method for producing microstructures includes introducing modifications by a laser beam into a volume between two opposite outer surfaces of a glass substrate. An etching method is carried out which provides anisotropic material removal in one of the outer surfaces so as to produce recesses that have a conical shape. A layer that is resistant to an etching effect of the etching method is applied as a cover layer to only one outer surface. Then, a further etching method is carried out so that material is removed in the other outer surface until recesses of this other outer surface, which are produced and/or enlarged by the further etching method, have reached the cover layer.

Abstract: The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.

Abstract: A process for the production of a glass-plastic connection which is form-fitting, and to a form-fitting composite between glass and plastic which is obtainable by the process. The process and the glass-plastic composite are characterized in that a glass, which in particular is planar, neither during the process nor in the glass-plastic composite is subjected to a mechanical load which could lead to cracks, e.g. microcracks. Accordingly, in the composite, the glass is connected to a plastic in a stress-free manner The composite of glass with plastic is especially gas-proof and/or liquid-proof.