Abstract: A method and device for laser machining a substrate, involves deflecting the laser radiation using a galvanometer scanner and an electro-optical deflector. The laser radiation thus deflected multiple times is then directed at a machining position on the substrate. By superposing an additional beam deflection by the electro-optical deflector onto the advance movement in the machining direction, which deflector is operated with steady oscillation excitation for this purpose, the resultant beam deflection follows a circular revolving path. In the process, the series of pulses of a pulsed radiation source is restricted to individual or a plurality of machining positions on the substrate, and forms for example a cutting front so as to thus quickly and reliably produce a kerf having the desired width.

Abstract: A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis.

Abstract: A method and device can create, with a laser beam, plural recesses in a substrate useful as an interposer, and a substrate produced thereby. A laser beam may be directed to the surface of a substrate. The duration of the laser beam effect is extremely short such that the substrate is only modified concentrically about the laser beam axis without reaching a substrate material recess. The laser beam is initially diverted by a transmission medium having a higher intensity-dependent refractive index than air, and subsequently reaching the substrate. Non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces; the refractive index also changes. The focus point of the laser beam moves between the outer surfaces of the substrate along the beam axis such that it reaches the desired modification along the beam axis without correcting the laser processing head in the z-axis.

Abstract: A method for the at least portion-wise and adhesive metallisation of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallised, within an area to be metallised that is enclosed by one or more limiting lines, by moulding a tool that is microstructured in accordance with the regions to be metallised within a moulding area.

Abstract: A method for producing an electrically conductive structure, e.g., a conducting track, on a non-conductive substrate material, having an additive (1) having at least one metal compound. The substrate material may be irradiated using a laser to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (1). The metal seeds formed by the activation are then metallized to create the electrically conductive structure on the substrate material. Because the additive (1) has a preferably full-surface coating before the additive is introduced into the substrate material, such that the additive (1) is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive (1) are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted.