Abstract: A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.

Abstract: An information display system is disclosed that is particularly intended for displaying information to waiting customers. The system comprises a content repository (12) that contains content items for display. Each content item is classified according to its subject-matter . The system further includes a display device (14) capable of displaying a content item from the repository (12) and a content server (10) that operates to select a content item from the repository and send it to the display device (14). The content server (10) accesses a list of customers who are waiting to be served, applies an analysis of the list to identity preferred subject-matter likely to be of interest to the customers, selects a content item from the content database that relates to the preferred subject-matter and sends the retrieved content item to the display device. The display system preferably interacts with an automated customer reception system to obtain the list of customers waiting to be served.

Abstract: A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend between each other. In addition various connections between the substrates are disclosed, as well as methods of constructing such chip assemblies.

Abstract: A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate.

Abstract: A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together functioning as a capacitor. In a particular embodiment, the laterally adjacent traces provide shunt capacitance to compensate for an inductance in a signal path to the chip which includes the signal-bearing conductive trace. In a variation thereof, a transmission line or waveguide is provided which includes the signal-bearing conductive trace and reference trace. In further variations, transmission lines are provided which include one or more metal layers of a package element, separated from each other by a thickness of a dielectric element included in the package element or the air gap between the package and a circuit panel.

Abstract: A steerable medical instrument includes a control handle, a shaft, steering control wires, and an end effector at the distal end of the shaft. The end effector is a separate component engineered to distribute the stress and strain of bending moments along the length of the end effector to achieve predicable, repeatable, fine motion control over the distal end of the instrument. The end effector may be customized for any medical application. For example, the end effector may comprise a grasping device, a cutting devise, a snare, a specimen retrieval device, or a wound closure device (such as a stapler).

Abstract: A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together functioning as a capacitor. In a particular embodiment, the laterally adjacent traces provide shunt capacitance to compensate for an inductance in a signal path to the chip which includes the signal-bearing conductive trace. In a variation thereof, a transmission line or waveguide is provided which includes the signal-bearing conductive trace and reference trace. In further variations, transmission lines are provided which include one or more metal layers of a package element, separated from each other by a thickness of a dielectric element included in the package element or the air gap between the package and a circuit panel.

Abstract: A stackable chip assembly is disclosed, as are different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend or are interspersed between each other. Different connections between the substrates are disclosed, as well as methods of constructing such chip assemblies. In addition, a high G-force testing fixture is also disclosed for use in testing chip packages or the like.

Abstract: Mediation sitting cushions and mats allow the user to meditate in comfort for great lengths of time, avoiding stress and pain often caused by traditional meditation cushions and mats. The layered mediation sitting cushions and mats combine a slow recovery visco-elastic foam (“VEF”), having load deformation properties and densities, with one or more base layers of a batting support. The sitting cushions and mats enable a person seated in traditional meditative positions to achieve a comfortable posture, regardless of the meditator's size or weight. The sitting cushions and mats also allow people to meditate in traditional cross-legged or kneeling postures comfortably, without irritation or pain. The mediation sitting cushions and mats also maintain of the pelvis in a neutral or slightly anterior position, resulting in proper alignment of the pelvis and spine, which minimizes the muscular and ligamentous strain caused by sitting in stillness for long periods of time.

Abstract: A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

Abstract: A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

Abstract: A stub-out assembly includes a stub-out conduit that defines a major diameter and a minor diameter. The minor diameter defines an attachment groove for receipt of a mount housing and a valve housing. The mount housing includes a multitude of circumferential fingers which each include a barbed end that engage a corresponding internal groove within the valve housing of the valve assembly. The mount housing fits over the minor diameter and a retainer in the mount housing is aligned with the attachment groove. The retainer includes a partially annular set of conduit attachment legs and a set of housing attachment legs. The conduit attachment legs engage the attachment groove to axially retain the conduit therein. The housing attachment legs each include a barbed end which engage a corresponding surface located within the slot.

Abstract: Method and system for preparing a personal genetic profile includes collecting genetic data from an individual, assigning the data to a coordinate system, storing the data, and providing access for retrieval by the individual from whom the genetic data were collected, after receipt of an Identifier that adequately authenticates the identity of the data requestor. Locations of genetic markers are provided as three-dimensional coordinates, described with matrix relationships that are consistent with the primary and secondary chemical structure of molecular constituents of a DNA chain for the individual.

Abstract: A cavity resonator is provided which includes a shielded enclosure enclosing a volume and a unitary conductor disposed within the volume, the unitary conductor having a first inductor portion and a transmission line portion. The transmission line portion is included in a transmission line having a reference conductor separated from the transmission line portion by a dielectric element. An active semiconductor device is coupled to the unitary conductor, and is operable to conduct a current to the unitary conductor at a resonant frequency of the unitary conductor.

Abstract: A storage and dispensing system for viscous fluids using a single aerosol container having a multi-valve body wherein the valves are activated by a single actuator and viscous materials are kept separate until used. The system may use multiple collapsible bags, a barrier liner, a dip tube, and an omnidirectional valve. Novel mounting cups lacking conventional central pedestal portions are disclosed. New domes for containers are disclosed which eliminate the need for mounting cups. New static mixing devices are disclosed. The devices are made up of static mixing components and static dispensing components. New filling machines for aerosol containers are disclosed. The filling machines contain a plurality of conduits for the separate viscous materials. Filling heads having nozzles depress the actuators of the containers and fill the containers.

Abstract: Mediation sitting cushions and mats allow the user to meditate in comfort for great lengths of time, avoiding stress and pain often caused by traditional meditation cushions and mats. The layered mediation sitting cushions and mats combine a slow recovery visco-elastic foam (“VEF”), having load deformation properties and densities, with one or more base layers of a batting support. The sitting cushions and mats enable a person seated in traditional meditation positions to achieve a comfortable posture, regardless of the meditator's size or weight. The sitting cushions and mats also allow people to meditate in traditional cross-legged or kneeling postures comfortably, without irritation or pain. The mediation sitting cushions and mats also maintain of the pelvis in a neutral or slightly anterior position, resulting in proper alignment of the pelvis and spine, which minimizes the muscular and ligamentous strain caused by sitting in stillness for long periods of time.

Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element.

Abstract: A microelectronic package is provided in which a first chip having active elements, e.g. amplifying elements, and passive elements, e.g. resistors, capacitors and inductors, is mounted in electrical communication with a microelectronic element having conductive patterns opposing a front face of the first chip. Absorptive material patterns are disposed between the conductive patterns of the microelectronic element and at least some of the passive elements while leaving at least some of the active elements exposed so as to attenuate radio frequency energy propagated by wave between the passive devices and conductive patterns of the microelectronic element. A packaged chip is also provided in which a chip is disposed beneath a package element, the chip having an opening which extends between a front face and a rear face of the chip, a conductor being disposed in the opening which is conductively connected to a conductive element of the package element.

Abstract: A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

Abstract: An ergonomic keyboard device is disclosed which reduces the amount of strain and fatigue in the user. The device consists of a keyboard mounted in a housing, the keyboard having a forward edge, a back edge and a longitudinal axis. The keyboard is moveably mounted to the housing such that the keyboard is moveable in a first direction whereby the keyboard moves forward and back. The keyboard is also mounted to the housing in such a way that it can pivot about its longitudinal axis. The keyboard device also has a mechanism for continuously oscillating the keyboard in both the back and forth motion and in the pivotal motion simultaneously.