Abstract: Methods, systems, and apparatus, including computer program products, in which an indication of a telephone call being placed from a calling number is received, and a determination is made of an audio advertisement to play based on the calling number. The audio advertisement is played based on the determination.

Abstract: One embodiment of the present invention provides a system which drives on-chip wires using capacitive coupling. During operation, the system drives a signal onto a driven wire. This signal feeds from the driven wire through a coupling capacitor onto a coupled wire, which is an on-chip wire that routes the signal to its destination. Feeding the signal through the coupling capacitor reduces the voltage swing of the corresponding coupled signal on the coupled wire, thereby lessening the power required to drive the coupled signal on the coupled wire.

Abstract: A method for calibrating an offset voltage of an amplifier used to amplify capacitively coupled communication signals is described. During this process, a common voltage is applied to one or more inputs to the amplifier. Next, an output of the amplifier is iteratively, measured, and charge is applied to the one or more inputs until the offset voltage is less than a pre-determined value. Note that applying the charge may involve applying a sequence of one or more charge pulses.

Abstract: Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.

Abstract: One embodiment of the present invention provides a system that detects changes in power-supply current within an integrated circuit (IC) chip. During operation, the system monitors an induced current through a detection loop. This detection loop is situated at least partially within the IC chip in close proximity to a power-supply current for the IC chip, so that a change in the power-supply current changes a magnetic field passing through the detection loop, thereby inducing a corresponding current through the detection loop. The system then generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change. In addition, the system uses the control signal to control circuits within the IC chip.

Abstract: Embodiments of an integrated circuit that includes a debug circuit are described. This debug circuit is configured to test an asynchronous circuit by performing analog measurements on asynchronous signals associated with the asynchronous circuit, and includes a triggering module configured to gate the debug circuit based on one or more of the asynchronous signals. This triggering module has a continuous mode of operation and a single-shot mode of operation. A timing module within the debug circuit has a timing range exceeding a pre-determined value, and is configured to provide signals corresponding to a first time base or signals corresponding to a second time base. Furthermore, control logic within the debug circuit is configured to select a mode of operation and a given time base for the debug circuit, which is either the first time base or the second time base.

Abstract: Embodiments of an encoding circuit to communicate a sequence of words are described. This encoding circuit includes an encoding module that is configured to receive a first sequence of words and to generate a DC-balanced second sequence of words based on the first sequence of words, where communicating the second sequence of words consumes less energy than communicating a third sequence of words that includes words in the first sequence of words alternating with words in the inverse of the first sequence of words. In addition, the second sequence of words includes substantially twice as many words as the first sequence of words.

Abstract: One embodiment of the present invention provides a system that asynchronously controls the sending of data items from a sender to a receiver. The system includes a data path between the sender and the receiver, a first control path between the sender and the receiver, and a second control path between the sender and the receiver. The first control path and the second control path alternately control the asynchronous transmission of consecutive data items on the data path between the sender and the receiver.

Abstract: A method and apparatus for performing on-chip voltage sampling of a weakly-driven node of a semiconductor device are disclosed. In some embodiments, the node is a floating node or is capacitively-driven. In some embodiments, it is involved in proximity-based communication. Sampling the node may include isolating the signal to be sampled using a source-follower amplifier before passing it to the sampling circuit. Sampling the node may include biasing the node to a desired voltage using a leaky transistor or other biasing circuit. In some embodiments, the biasing circuit may also be used to calibrate the sampler by coupling one or more calibration voltages to the node in place of a biasing voltage and measuring the sampler output. The sampler may be suitable for sub-sampling high frequency signals to produce a time-expanded, lower frequency version of the signals. The output of the sampler may be a current communicated off-chip for testing.

Abstract: One embodiment of the present invention provides a system that facilitates detecting and correcting errors. The system operates by receiving a data packet comprised of p words on a communication pathway, wherein each bit of a word is received on a separate data line in a set of data lines that comprise the communication pathway. The system also receives a time signature t on the communication pathway, wherein t contains per-bit error information for the p words in the data packet. As the data packet is received, the system performs an error-detection operation on each data bit of the data packet in parallel, wherein the error-detection operation generates per-bit error information for each bit position across the p words in the data packet. Finally, the system compares the generated per-bit error-information with the corresponding per-bit error information in the time signature t to determine if there exists an error.

Abstract: Embodiments of a switch are described. This switch includes input ports configured to receive signals (which include data) and output ports configured to output the signals. In addition, the switch includes switching elements and a flow-control mechanism, which is configured to provide flow-control information associated with the data to the switching elements via an optical control path. These switching elements are configured to selectively couple the input ports to the output ports based on the flow-control information. Furthermore, a given switching element in the switching elements is coupled to a given input port and a given output port via electrical signal paths that are configured to use proximity communication to communicate the data.

Abstract: One embodiment of the present invention provides a system for distributing signals through a jig-plate in a computer system. The jig-plate contains alignment features that assist in positioning semiconductor chips in relation to the jig-plate. In addition, the jig-plate contains one or more embedded signal routing layers. These metal routing layers provide one or more signal routes for the distribution of signals through the jig-plate to semiconductor chips which have been aligned with the jig-plate. Note that routing the signals through the jig-plate facilitates the distribution of the signals without requiring that the signals be routed through the semiconductor chips in the jig-plate.

Abstract: An integrated circuit containing a communication channel is described. This communication channel includes a transmit circuit configured to transmit signals using a voltage-mode driver, a receive circuit, and a capacitive link that couples the transmit circuit to the receive circuit. The communication channel includes a filter with a capacitive-summing junction to equalize signals communicated between the transmit circuit and the receive circuit.

Abstract: A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.

Abstract: One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.

Abstract: A method for determining misalignment between two semiconductor dies is described in which signals are transmitted through a first subset of an array of proximity connectors that are proximate to a surface of one of the semiconductor dies and received through a second subset of an array of proximity connectors that are proximate to a surface of the other semiconductor die. A spatial beat frequency is determined from the received signals. This spatial beat frequency corresponds to misalignment-induced aliasing of spatial frequencies associated with the first subset of the array of proximity connectors and the second subset of the array of proximity connectors. The misalignment is then determined using the spatial beat frequency.

Abstract: A method and apparatus for performing on-chip voltage sampling of a weakly-driven node of a semiconductor device are disclosed. In some embodiments, the node is a floating node or is capacitively-driven. In some embodiments, it is involved in proximity-based communication. Sampling the node may include isolating the signal to be sampled using a source-follower amplifier before passing it to the sampling circuit. Sampling the node may include biasing the node to a desired voltage using a leaky transistor or other biasing circuit. In some embodiments, the biasing circuit may also be used to calibrate the sampler by coupling one or more calibration voltages to the node in place of a biasing voltage and measuring the sampler output. The sampler may be suitable for sub-sampling high frequency signals to produce a time-expanded, lower frequency version of the signals. The output of the sampler may be a current communicated off-chip for testing.

Abstract: A system that fabricates a semiconductor chip. The system places patterns for components which require fine line-widths within a high resolution region of a reticle, wherein the high resolution region provides sharp focus for a given wavelength of light used by the lithography system. At the same time, the system places patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle, thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region. Note that the coarseness for components placed outside of the high resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high resolution region.

Abstract: A system that dynamically refreshes the inputs of a differential receiver. During operation, while a differential transmitter is not transmitting data, the system applies substantially equal voltages to the outputs of the differential transmitter so that the differential voltage on the outputs of the differential transmitter is substantially zero. The system then refreshes the inputs of an associated differential receiver by applying substantially equal voltages to the inputs of the differential receiver so that the differential voltage on the inputs of the differential receiver is substantially zero. The differential transmitter is coupled to the differential receiver through a DC blocking mechanism, which prevents a DC voltage on the differential transmitter from reaching the differential receiver.

Abstract: One embodiment of the present invention provides a system that facilitates capacitive inter-chip communication. During operation, the system first determines an alignment between a first semiconductor die and a second semiconductor die. Next, electrical signals are selectively routed to at least one interconnect pad in a plurality of interconnect pads based on the alignment thereby facilitating communication between the first semiconductor die and the second semiconductor die. The plurality of interconnect pads can include transmitting pads, receiving pads, and transmitting and receiving pads. The alignment may be determined continuously or at times separated by an interval, where the interval is fixed or variable. Several variations on this embodiment are provided.