Abstract: Embodiments of an interconnect apparatus advantageously useful in handling Big Data Graph Analytics enable improved signal integrity, even at high clock rates, increased bandwidth, and lower latency. In an interconnect apparatus for core arrays a sending processing core can send data to a receiving core by forming a packet whose header indicates the location of the receiving core and whose pay load is the data to be sent. The packet is sent to a Data Vortex switch described herein and in the patents incorporated herein. The Data Vortex switch is on the same chip as an array of processing cores and routes the packet to the receiving core first by routing the packet to the processing core array containing the receiving processing core. The Data Vortex switch then routes the packet to the receiving processor core in a processor core array.

Abstract: Embodiments of an interconnect apparatus enable improved signal integrity, even at high clock rates, increased bandwidth, and lower latency. In an interconnect apparatus for core arrays a sending processing core can send data to a receiving core by forming a packet whose header indicates the location of the receiving core and whose pay load is the data to be sent. The packet is sent to a Data Vortex switch described herein and in the patents incorporated herein. The Data Vortex switch is on the same chip as an array of processing cores and routes the packet to the receiving core first by routing the packet to the processing core array containing the receiving processing core. The Data Vortex switch then routes the packet to the receiving processor core in a processor core array. Since the Data Vortex switches are not crossbar switches, there is no need to globally set and reset the Data Vortex switches as different groups of packets enter the switches.

Abstract: Embodiments of an interconnect apparatus enable improved signal integrity, even at high clock rates, increased bandwidth, and lower latency. In an interconnect apparatus for core arrays a sending processing core can send data to a receiving core by forming a packet whose header indicates the location of the receiving core and whose pay load is the data to be sent. The packet is sent to a Data Vortex switch described herein and in the patents incorporated herein. The Data Vortex switch is on the same chip as an array of processing cores and routes the packet to the receiving core first by routing the packet to the processing core array containing the receiving processing core. The Data Vortex switch then routes the packet to the receiving processor core in a processor core array. Since the Data Vortex switches are not crossbar switches, there is no need to globally set and reset the Data Vortex switches as different groups of packets enter the switches.

Abstract: Techniques are disclosed relating to parallel computing. In some embodiments, fine-grained data communication facilitates operations on large data sets such as multiplication of a sparse matrix by a vector. In this example, a first data set (the matrix) and a second data set (the vector) are distributed across multiple processing nodes. Performance of the overall multiplication operation may require communication of data among the processing nodes. In various embodiments, fine-grained communication of this data may reduce processing times and/or power consumption by avoiding congestion.

Abstract: Techniques are disclosed relating to performing Fast Fourier Transforms (FFTs) using distributed processing. In some embodiments, results of local transforms that are performed in parallel by networked processing nodes are scattered across processing nodes in the network and then aggregated. This may transpose the local transforms and store data in the correct placement for performing further local transforms to generate a final FFT result. The disclosed techniques may allow latency of the scattering and aggregating to be hidden behind processing time, in various embodiments, which may greatly reduce the time taken to perform FFT operations on large input data sets.

Abstract: Techniques are disclosed relating to parallel computing. In some embodiments, fine-grained data communication facilitates operations on large data sets such as multiplication of a sparse matrix by a vector. In this example, a first data set (the matrix) and a second data set (the vector) are distributed across multiple processing nodes. Performance of the overall multiplication operation may require communication of data among the processing nodes. In various embodiments, fine-grained communication of this data may reduce processing times and/or power consumption by avoiding congestion.

Abstract: A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.

Abstract: A method for retrieving and managing addresses is provided. The steps may include of receiving, at a first buffer of m buffers, a request for an address; obtaining the address from a corresponding first register of the m registers; sending the address, received by said obtaining, to a destination; storing the address, received by the obtaining, in the first buffer; and clearing the contents of a second buffer of the m buffers, in response to any of said receiving, obtaining or storing, without clearing the contents of said first buffer, wherein m is a positive integer.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract: A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.

Abstract: A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.

Abstract: A method of and architecture for controlling board elements in an orthogonal system architecture is provided. The method and architecture preferably utilize an internal bus architecture between control boards, such that a first control board can access board elements in its stack via I/O on a second control board and the second control board can access board elements in its stack via I/O on the first control board. Most preferably the internal bus architecture is a HyperTransport bus architecture.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract: A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract: A method for retrieving and managing addresses is provided. The steps may include of receiving, at a first buffer of m buffers, a request for an address; obtaining the address from a corresponding first register of the m registers; sending the address, received by said obtaining, to a destination; storing the address, received by the obtaining, in the first buffer; and clearing the contents of a second buffer of the m buffers, in response to any of said receiving, obtaining or storing, without clearing the contents of said first buffer, wherein m is a positive integer.

Abstract: A method of and architecture for controlling board elements in an orthogonal system architecture is provided. The method and architecture preferably utilize an internal bus architecture between control boards, such that a first control board can access board elements in its stack via I/O on a second control board and the second control board can access board elements in its stack via I/O on the first control board. Most preferably the internal bus architecture is a HyperTransport bus architecture.

Abstract: The present invention is for laminated and interconnected multiple substrates forming a multilayer package or other circuit component. A solder bump may be situated on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates pressed together via the adhesive films are mechanically bonded. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.