Abstract: The disclosure relates to the field of micro-nano structure-enhanced heat transfer surfaces and provides a 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method and product. The method includes the following steps. A micron-level and highly-precise three-dimensional structure mask is prepared through a 3D printing technology, the hollow portion of mask is matched with the target structure model. Material conversion is performed on a metal matrix fixed with the mask, and a target metal is obtained. Herein, the metal matrix is machined first, and a surface of the target metal is matched with the structure model. In the preparation method provided in the disclosed embodiment, the precision of the metal structure is improved by improving the precision of the template.

Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. In some instances, the single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Abstract: Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.

Abstract: Improving photosynthesis and light capture increases crop yield and paves a sustainable way to meet the growing global food demand. A spectral-shifting microphotonic film is provided particularly for applications to improved plant growth, for example, as a greenhouse envelope. The spectral-shifting microphotonic film can be scalable manufactured for augmented photosynthesis. By breaking the intrinsic propagation symmetry of light, the photonic microstructures provided in the film can extract 89% of the internally generated light and deliver most of that into one direction towards photosynthetic organisms. The microphotonic film augments crop production (e.g., lettuce) by more than 20% in both indoor facilities with electric lighting and in a greenhouse with natural sunlight, providing a way to increase crop production efficiency in controlled environments.

Abstract: A radiative cooling fabric comprises a flexible substrate layer and a functional layer stacked in order. The first functional layer comprises a first functional resin and a first functional filler dispersed in the first functional resin. A mass fraction of the first functional filler in the first functional layer is in a range of 1% to 20%. An emissivity of the radiative cooling fabrics in the wavelength of 7 ?m to 14 ?m is not less than 80%. A reflectivity of the radiative cooling fabrics in the wavelength of 300 nm to 2500 nm is not less than 80%. An average value of warp recovery angles of the radiative cooling fabrics is greater than or equal to 95°, and an average value of the weft recovery angles of the radiative cooling fabrics is greater than or equal to 91°.

Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. In some instances, the single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

Abstract: The present disclosure provides a solar reflecting film and a preparation method thereof. The solar reflecting film includes a substrate and a functional layer stacked on each other. The functional layer includes a first reflecting layer, a barrier layer, and a second reflecting layer stacked on the substrate in order. The barrier layer includes a first barrier layer and a second barrier layer stacked on the first barrier layer. The first barrier layer is metal fluoride, inorganic non-metallic oxide, metal oxide or a combination thereof. The second barrier layer is metal oxides, metal nitrides, semiconductor doped compounds or a combination thereof. And a material of the first barrier layer is at least partially different from that of the second barrier layer.

Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

Abstract: A radiative cooling film and a product thereof are provided. The radiative cooling film includes a carrier layer, a reflective layer and an emissive layer stacked together. A light shines on the radiative cooling film from the emissive layer. The emissive layer includes a polymer containing a C—F bond. The carrier layer includes a polymer containing at least one of a C—C bond and a C—O bond. After disposing at 120 degrees centigrade for 30 minutes, a transverse direction heat-shrinkage rate of the carrier layer is less than or equal to 2%, and a machine direction heat-shrinkage rate of the carrier layer is less than or equal to 3%. A thickness of the radiative cooling film is in a range of 50 ?m to 170 ?m, and a thickness of the emissive layer accounts for 20% to 90% of the thickness of the radiative cooling film.

Abstract: A radiative cooling film and a product thereof are provided. The radiative cooling film includes a carrier layer, a reflective layer and an emissive layer stacked together. A light shines on the radiative cooling film from the emissive layer. The emissive layer includes a polymer containing a C—F bond. The carrier layer includes a polymer containing at least one of a C—C bond and a C—O bond. After disposing at 120 degrees centigrade for 30 minutes, a transverse direction heat-shrinkage rate of the carrier layer is less than or equal to 2%, and a machine direction heat-shrinkage rate of the carrier layer is less than or equal to 3%. A thickness of the radiative cooling film is in a range of 50 m to 170 ?m, and a thickness of the emissive layer accounts for 20% to 90% of the thickness of the radiative cooling film.

Abstract: The present disclosure provides a radiative cooling metal plate, a preparation method and application thereof. The radiative cooling metal plate includes a metal substrate, a first adhesive layer and a radiative cooling functional layer stacked in order, the radiative cooling functional layer is located on a surface of the metal substrate, the first adhesive layer is arranged between the metal substrate and the radiative cooling functional layer, and an elongation at break of the radiative cooling functional layer is in a range of 1% to 300%. The radiative cooling functional layer can have sufficient ductility, and can have sufficient deformation to cope with the bending of the radiative cooling functional layer during pressing, such that the radiative cooling functional layer will not be damaged or broken, thereby ensuring the structural integrity of the radiative cooling functional layer and great radiative cooling effect of the metal substrate.

Abstract: A thermochromic film includes a substantially transparent substrate, and a polymer matrix layer coated on the substrate, the polymer matrix layer having cross-linked molecule chains generated before the coating, and the polymer matrix layer being embedded with randomly dispersed thermochromic nanoparticles before the coating.

Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures, and a cold collection system comprising a plurality of the polymer-based selective radiative cooling structures.

Abstract: A process for fabricating a thermochromic film is disclosed which includes the steps of dispersing a predetermined amount of vanadium dioxide (VO2) nanoparticles in a predetermined amount of poly(methyl methacrylate) (PMMA), stirring a mixture thereof for a first predetermined amount of time, generating cross-links to molecule chains of the PMMA in the mixture, and blade coating a predetermined thickness of the cross-linked mixture on a substrate to form the thermochromic film.

Abstract: The present disclosure provides a solar reflecting film and a preparation method thereof. The solar reflecting film includes a substrate and a functional layer stacked on each other. The functional layer includes a first reflecting layer, a barrier layer, and a second reflecting layer stacked on the substrate in order. The barrier layer includes a first barrier layer and a second barrier layer stacked on the first barrier layer. The first barrier layer is metal fluoride, inorganic non-metallic oxide, metal oxide or a combination thereof. The second barrier layer is metal oxides, metal nitrides, semiconductor doped compounds or a combination thereof. And a material of the first barrier layer is at least partially different from that of the second barrier layer.

Abstract: A radiative cooling fabric comprises a flexible substrate layer and a functional layer stacked in order. The first functional layer comprises a first functional resin and a first functional filler dispersed in the first functional resin. A mass fraction of the first functional filler in the first functional layer is in a range of 1% to 20%. An emissivity of the radiative cooling fabrics in the wavelength of 7 ?m to 14 ?m is not less than 80%. A reflectivity of the radiative cooling fabrics in the wavelength of 300 nm to 2500 nm is not less than 80%. An average value of warp recovery angles of the radiative cooling fabrics is greater than or equal to 95°, and an average value of the weft recovery angles of the radiative cooling fabrics is greater than or equal to 91°.

Abstract: The present disclosure provides a radiative cooling metal plate, a preparation method and application thereof. The radiative cooling metal plate includes a metal substrate, a first adhesive layer and a radiative cooling functional layer stacked in order, the radiative cooling functional layer is located on a surface of the metal substrate, the first adhesive layer is arranged between the metal substrate and the radiative cooling functional layer, and an elongation at break of the radiative cooling functional layer is in a range of 1% to 300%. The radiative cooling functional layer can have sufficient ductility, and can have sufficient deformation to cope with the bending of the radiative cooling functional layer during pressing, such that the radiative cooling functional layer will not be damaged or broken, thereby ensuring the structural integrity of the radiative cooling functional layer and great radiative cooling effect of the metal substrate.