Patents by Inventor Ronggui Yang

Ronggui Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11598594
    Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: March 7, 2023
    Assignee: THE REGENTS OF THE UNIVERSITY OF COLORADO
    Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
  • Publication number: 20220357116
    Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
    Type: Application
    Filed: June 24, 2022
    Publication date: November 10, 2022
    Applicants: The Regents of the University of Colorado, A Body Corporate, University of Wyoming
    Inventors: Ronggui YANG, Xiaobo YIN, Gang TAN, Dongliang ZHAO, Yaoguang MA, Yao ZHAI
  • Publication number: 20220221233
    Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.
    Type: Application
    Filed: March 8, 2022
    Publication date: July 14, 2022
    Inventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
  • Patent number: 11359434
    Abstract: A retrofitted window is disclosed which includes a substantially transparent aerogel film laminated on a glass windowpane, the aerogel film being embedded with randomly dispersed nanoparticles of vanadium dioxide (VO2) core and silicon dioxide (SiO2) shell, wherein the vanadium dioxide (VO2) core transitions between an insulator phase and a metal phase at a predetermined phase-transition temperature, and a volume fraction of the nanoparticles in the aerogel film is approximately between 0.001% and 0.05%.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: June 14, 2022
    Inventor: Ronggui Yang
  • Patent number: 11353269
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: June 7, 2022
    Assignee: Kelvin Thermal Technologies, Inc.
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Publication number: 20220163268
    Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 26, 2022
    Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
  • Patent number: 11306983
    Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: April 19, 2022
    Assignee: The Regents of the University of Colorado, a body corporate
    Inventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
  • Publication number: 20220090443
    Abstract: A retrofitted window is disclosed which includes a substantially transparent aerogel film laminated on a glass windowpane, the aerogel film being embedded with randomly dispersed nanoparticles of vanadium dioxide (VO2) core and silicon dioxide (SiO2) shell, wherein the vanadium dioxide (VO2) core transitions between an insulator phase and a metal phase at a predetermined phase-transition temperature, and a volume fraction of the nanoparticles in the aerogel film is approximately between 0.001% and 0.05%.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 24, 2022
    Inventor: Ronggui Yang
  • Publication number: 20220089835
    Abstract: A process for fabricating a thermochromic film is disclosed which includes the steps of dispersing a predetermined amount of vanadium dioxide (VO2) nanoparticles in a predetermined amount of poly(methyl methacrylate) (PMMA), stirring a mixture thereof for a first predetermined amount of time, generating cross-links to molecule chains of the PMMA in the mixture, and blade coating a predetermined thickness of the cross-linked mixture on a substrate to form the thermochromic film.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 24, 2022
    Inventor: Ronggui Yang
  • Publication number: 20220074673
    Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 10, 2022
    Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
  • Publication number: 20210131753
    Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.
    Type: Application
    Filed: June 11, 2019
    Publication date: May 6, 2021
    Inventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
  • Publication number: 20210010764
    Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 14, 2021
    Applicants: The Regents of the University of Colorado, A Body Corporate, University of Wyoming
    Inventors: Ronggui YANG, Xiaobo YIN, Gang TAN, Dongliang ZHAO, Yaoguang MA, Yao ZHAI
  • Publication number: 20200300563
    Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
    Type: Application
    Filed: May 12, 2020
    Publication date: September 24, 2020
    Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
  • Patent number: 10731925
    Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: August 4, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
    Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
  • Patent number: 10724809
    Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: July 28, 2020
    Assignees: The Regents of the University of Colorado, a Body Corporate, University of Wyoming
    Inventors: Ronggui Yang, Xiaobo Yin, Gang Tan, Dongliang Zhao, Yaoguang Ma, Yao Zhai
  • Patent number: 10724804
    Abstract: A thermal ground plane with hybrid structures that include nanowires is disclosed. The thermal ground plane includes a first casing having an exterior surface and an interior surface, the interior surface includes plurality of microstructures with a plurality of nanowires; a second casing, wherein the first casing and the second casing are sealed to an interior space that includes a working fluid; and a wicking layer disposed within the interior space.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: July 28, 2020
    Assignee: Kelvin Thermal Technologies, Inc.
    Inventors: Ryan John Lewis, Ronggui Yang, Yung-Cheng Lee
  • Publication number: 20200191495
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Application
    Filed: November 11, 2019
    Publication date: June 18, 2020
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Patent number: 10571200
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: February 25, 2020
    Assignee: KELVIN THERMAL TECHNOLOGIES, INC.
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Patent number: 10527358
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: January 7, 2020
    Assignee: KELVIN THERMAL TECHNOLOGIES, INC.
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Patent number: 10502505
    Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: December 10, 2019
    Assignees: The Regents of the Univeristy of Colorado, a Body Corporate, University of Wyoming
    Inventors: Ronggui Yang, Xiaobo Yin, Gang Tan, Dongliang Zhao, Yaoguang Ma, Yao Zhai