Abstract: A photonic device comprising a base plate, a photonic laser coupled to the base plate, wherein the photonic laser is configured to generate a light, a lens coupled to the base plate, wherein the lens is configured to receive the light from the photonic laser, form a focused light, and pass the focused light to a reflector, and the reflector incorporated with the base plate such that the lens is positioned between the photonic laser and the reflector, wherein the reflector is configured to receive the focused light, and wherein the reflector is configured to steer a first portion of the focused light through the base plate using total internal reflection.

Abstract: Approaches to Compact External Grating PBS/PBC Coupling are described according to embodiments of the present invention. In one embodiment, a YVO4 crystal is used to split a beam or combine multiple beams into a single beam. A lens is used to convert a mode of the light to match a mode of a grating port. A glass wedge is designed to bend the light from horizontal to a nearly vertical orientation to match an exit angle of a grating port. When a source or a receiver utilizes an optical fiber, a fiber holder may be used to bond the fiber to the source or receiver. The PBS/PBC described has much less insertion loss compared to existing 2D grating coupler techniques, and has a wider spectral bandwidth due to flexibility in mode matching compared to existing 2D grating couplers.

Abstract: A free space coupling system comprising a waveguide horizontally positioned on an integrated circuit, and a silicon housing coupled to the waveguide, wherein the silicon housing comprises a reflective surface, a first port, wherein the first port is configured to receive light from an optic source positioned substantially parallel to the waveguide at a coupling point, and a second port, wherein the second port is oriented at about ninety degrees with respect to the first port, and wherein the second port is aligned with a grating port on the waveguide.

Abstract: An optical apparatus, comprising a polarization beam splitter (PBS) comprising a birefringent crystal having a front-end and a back-end, and an optical rotator positioned on the back-end of the birefringent crystal. Included is an optical apparatus comprising a PBS comprising a birefringent crystal and an optical rotator, wherein the PBS is configured to receive a multiplexed optical signal comprising a first polarized optical signal and a second polarized optical signal, wherein the second polarized optical signal is orthogonal to the first polarized optical signal, separate the first polarized optical signal from the second polarized optical signal using the birefringent crystal, and rotate the second polarized optical signal using the optical rotator such that the rotated second polarized optical signal is parallel to the first polarized optical signal. The PBS may further comprise only one lens, wherein the lens is positioned on the front-end of the birefringent crystal.

Abstract: A photonic device comprising a base plate, a photonic laser coupled to the base plate, wherein the photonic laser is configured to generate a light, a lens coupled to the base plate, wherein the lens is configured to receive the light from the photonic laser, form a focused light, and pass the focused light to a reflector, and the reflector incorporated with the base plate such that the lens is positioned between the photonic laser and the reflector, wherein the reflector is configured to receive the focused light, and wherein the reflector is configured to steer a first portion of the focused light through the base plate using total internal reflection.

Abstract: A BOSA package comprising only one cylindrical TO package comprising a ROSA and a TOSA, and an optical port in optical communication with the ROSA and the TOSA. Also disclosed is a TO package comprising a TOSA for transmitting a first optical signal, a ROSA for receiving a second optical signal, an optical communication window, and a TFF positioned such that the first optical signal transmitted from the TOSA is reflected by the TFF toward the optical communication window and the second optical signal received from the optical communication window passes through the TFF and to the ROSA.

Abstract: An optical apparatus, comprising a polarization beam splitter (PBS) comprising a birefringent crystal having a front-end and a back-end, and an optical rotator positioned on the back-end of the birefringent crystal. Included is an optical apparatus comprising a PBS comprising a birefringent crystal and an optical rotator, wherein the PBS is configured to receive a multiplexed optical signal comprising a first polarized optical signal and a second polarized optical signal, wherein the second polarized optical signal is orthogonal to the first polarized optical signal, separate the first polarized optical signal from the second polarized optical signal using the birefringent crystal, and rotate the second polarized optical signal using the optical rotator such that the rotated second polarized optical signal is parallel to the first polarized optical signal. The PBS may further comprise only one lens, wherein the lens is positioned on the front-end of the birefringent crystal.

Abstract: A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.

Abstract: An adapted semiconductor laser package that may convert a first type of package pin-out arrangement to a desired pin-out arrangement. The laser package may include a laser package including a laser, an isolator, a lens, a fiber sleeve, and a pin-out arrangement. The isolator and the fiber sleeve may be jointly arranged away from the laser. The laser package may also include an adapter with a first section with a plurality of holes geometrically arranged and mated with the package pin-out arrangement, a second section with an adapter pin-out arrangement with two rows of pins extending along opposite sides of the package, and electrical connections between the plurality of holes and the pins.

Abstract: An apparatus comprising a header comprising a platform for attaching opto-electronic components, an optical element, a laser diode (LD) configured to emit an optical signal that passes through the optical element, and a cap affixed to the header such that the cap is coaxially aligned with the header, wherein the cap and header encase the optical element and the LD.

Abstract: An optoelectronic device includes a header having a plurality of pins extending therethrough, a thermo-electric cooling device mounted adjacent to a side of the header and an optoelectronic assembly mounted on the thermo-electric cooling device. The optoelectronic assembly includes a light emitting device operable to emit an optical signal in response to an electric signal received by at least one of the plurality of pins, and a lens assembly operable to receive at least some of the light emitted by the light emitting device, the lens assembly having a lens. A cap substantially encloses the thermo-electric cooling device and the optoelectronic assembly. The cap has a window operable to transmit light emitted by the optoelectronic assembly. The lens is the only optical component in the lens assembly.

Abstract: An adapted semiconductor laser package that may convert a first type of package pin-out arrangement to a desired pin-out arrangement. The laser package may include a laser package including a laser, an isolator, a lens, a fiber sleeve, and a pin-out arrangement. The isolator and the fiber sleeve may be jointly arranged away from the laser. The laser package may also include an adapter with a first section with a plurality of holes geometrically arranged and mated with the package pin-out arrangement, a second section with an adapter pin-out arrangement with two rows of pins extending along opposite sides of the package, and electrical connections between the plurality of holes and the pins.

Abstract: A laser module including a first housing which encloses a semiconductor laser device, a support, a fiber sleeve for holding an optical fiber, a lens, and an isolator. The isolator and the fiber sleeve are jointly arranged within a second housing which is an integral holder holding both the isolator and the fiber sleeve.

Abstract: The present invention discloses an adaptor suitable for use in optoelectronic circuit board. The adaptor according the present invention serves to adapt a package pin-out arrangement to a desired pin-out arrangement on a printed circuit board. The adaptor comprises a pin-in arrangement that electrically couples with the package pin-out arrangement. The adaptor further comprises an adaptor pin-out arrangement that is geometrically identical to the desired pin-out, and a flex-circuit that provides a plurality of electrical paths to connect the pin-in arrangement with the adaptor pin-out arrangement. In various embodiments, the adaptor further comprises a clamshell for holding the adaptor pin-out and the flex-circuit together in a single flat format.

Abstract: An opto-electric module adapted to be coupled with an optical fiber on a first side and a plurality of electrical conductors on a second side. The opto-electric module includes a header with a plurality of pins extending through the header a thermo-electric cooler with a hot plate of the thermo-electric cooler disposed against a second, opposing side of the header and a plurality of active and passive optical components adapted to convert between an optical signal format within the optical fiber and an electrical signal format within at least one conductor of the plurality of conductors, said plurality of active and passive optical components all being in thermal contact with a cold plate of the thermo-electric cooler.

Abstract: An optical fiber bonding scheme provides improved bonding properties and improved lifetime for non-hermetic fiber optic packages such as OSAs. The bonding scheme includes an optical fiber bonded to a substrate surface with an epoxy and a diffusion retarding plate covering the epoxy. The diffusion retarding plate prevents moisture absorption by the top surface of the epoxy and the large footprint of the epoxy provides a long diffusion path which produces a lower water concentration gradient within the epoxy, restricts lateral diffusion of absorbed water molecules within the epoxy, and produces an extremely saturation resistant epoxy. The diffusion retarding plate may further include legs that bound opposed sides of the epoxy providing further saturation resistance.

Abstract: An opto-electric module in TO form factor adapted to be coupled with an optical fiber on a first side and a plurality of electrical conductors on a second side. The opto-electric module includes a header with a plurality of pins extending through the header, each pin of the plurality of pins extending through the header and each pin of the plurality of pins being adapted to engage a respective conductor of the plurality of conductors on a first side of the header, a thermo-electric cooler with a hot plate of the thermo-electric cooler disposed against a second, opposing side of the header and a plurality of active and passive optical components adapted to convert between an optical signal format within the optical fiber and an electrical signal format within at least one conductor of the plurality of conductors, said plurality of active and passive optical components all being in thermal contact with a cold plate of the thermo-electric cooler.

Abstract: An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refractive index of photodetector upon which the optical matching coating is disposed. Silicone may advantageously be formed as the optical thick film coating on the photodetector.

Abstract: An optical fiber bonding scheme provides improved bonding properties and improved lifetime for non-hermetic fiber optic packages such as OSAs. The bonding scheme includes an optical fiber bonded to a substrate surface with an epoxy and a diffusion retarding plate covering the epoxy. The diffusion retarding plate prevents moisture absorption by the top surface of the epoxy and the large footprint of the epoxy provides a long diffusion path which produces a lower water concentration gradient within the epoxy, restricts lateral diffusion of absorbed water molecules within the epoxy, and produces an extremely saturation resistant epoxy. The diffusion retarding plate may further include legs that bound opposed sides of the epoxy providing further saturation resistance.

Abstract: An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refractive index of photodetector upon which the optical matching coating is disposed. Silicone may advantageously be formed as the optical thick film coating on the photodetector.