Abstract: An acoustic waveguide having high-Q resonator characteristics is disclosed and a fabrication method is described. Various waveguide-based test-vehicles, implemented in single crystal silicon and transduced by thin aluminum nitride films, are demonstrated. Silicon resonators with type-I and type-II dispersion characteristics are presented to experimentally justify the analytical mode synthesis technique for realization of high quality-factor silicon Lamb wave resonators. An analytical design procedure is also presented for geometrical engineering of the waveguides to realize high-Q resonators without the need for geometrical suspension through narrow tethers or rigid anchors. The effectiveness of the dispersion engineering methodology is verified through development of experimental test-vehicles in 20 ?m-thick single-crystal silicon (SCS) waveguides with 500 nm aluminum nitride transducers.

Abstract: A nano-mechanical acoustical resonator is designed and fabricated with CMOS compatible techniques to apply to mm-wave RF front-ends and 5G wireless communication systems which have extreme small scale and integrated in 3D sensors and actuators. Thin hafnium zirconium oxide (HZO) films are engineered with atomic layer deposition (ALD) to demonstrate large piezoelectric ferroelectric properties (piezoelectric coefficient e31,HZO?23e31,AlN. Various electrical and optical characterization schemes are also used as test-vehicles to characterize ferroelectric and piezoelectric properties, including isolated 10 nm HZO- and 120 nm AlN-transduction ports. The low-temperature and truly conformal nature of ALD process of HZO offers substantial advantages over conventional magnetronsputtered/MOCVD films, including CMOS-compatibility and sidewall transducer integration.

Abstract: Data is encoded for identification and labeling using a multitude of nano-electro-mechanical structures formed on a substrate. The number of such structures, their shapes, choice of materials, the spacing therebetween and the overall distribution of the structures result in a vibrational pattern or an acoustic signature that uniquely corresponds to the encoded data. A first group of the structures is formed in conformity with the design rules of a fabrication process used to manufacture the device that includes the structures. A second group of the structures is formed so as not to conform to the design rules and thereby to undergo variability as a result of the statistical variations that is inherent in the fabrication process.

Abstract: Data is encoded for identification and labeling using a multitude of nano-electro-mechanical structures formed on a substrate. The number of such structures, their shapes, choice of materials, the spacing therebetween and the overall distribution of the structures result in a vibrational pattern or an acoustic signature that uniquely corresponds to the encoded data. A first group of the structures is formed in conformity with the design rules of a fabrication process used to manufacture the device that includes the structures. A second group of the structures is formed so as not to conform to the design rules and thereby to undergo variability as a result of the statistical variations that is inherent in the fabrication process.

Abstract: Certain implementations of the disclosed technology may include systems and methods for high-frequency resonant gyroscopes. In an example implementation, a resonator gyroscope assembly is provided. The resonator gyroscope assembly can include a square resonator body suspended adjacent to a substrate, a ground electrode attached to a side of the resonator body, a piezoelectric layer attached to a side of the ground electrode, a drive electrode in electrical communication with the piezoelectric layer, and configured to stimulate one or more vibration modes of the square resonator body; and a sense electrode in electrical communication with the piezoelectric layer, and configured to receive an output from the square or disk resonator responsive to stimulation of the one or more vibration modes.

Abstract: Certain implementations of the disclosed technology may include systems and methods for high-frequency resonant gyroscopes. In an example implementation, a resonator gyroscope assembly is provided. The resonator gyroscope assembly can include a square resonator body suspended adjacent to a substrate, a ground electrode attached to a side of the resonator body, a piezoelectric layer attached to a side of the ground electrode, a drive electrode in electrical communication with the piezoelectric layer, and configured to stimulate one or more vibration modes of the square resonator body; and a sense electrode in electrical communication with the piezoelectric layer, and configured to receive an output from the square or disk resonator responsive to stimulation of the one or more vibration modes.

Abstract: An integrated circuit device includes a multi-port piezoelectric-on-semiconductor microelectromechanical resonator, which is configured to support independent and concurrent piezoelectric transduction of multiple resonance modes. The resonator includes a semiconductor resonator body (e.g., Si body) suspended opposite an underlying recess in a substrate. Opposite ends of the semiconductor resonator body are anchored to the substrate. The resonator body may be formed so that a plan layout view of a portion of the semiconductor resonator body is dumbbell-shaped to thereby support acoustic energy trapping of multiple high-Q resonance modes.

Abstract: Microelectromechanical resonators include a resonator body having a first piezoelectric layer on a upper surface thereof, which is configured to support actuation and sensing through a transverse piezoelectric effect (e31), and a second piezoelectric layer on at least a portion of a first sidewall thereof, which is configured to support actuation and sensing through a longitudinal piezoelectric effect (e33), where e33 is greater than e31. These resonators may further include a first bottom electrode extending between the first piezoelectric layer and the upper surface of the resonator body and a second bottom electrode extending between the second piezoelectric layer and the first sidewall of the resonator body. These first and second bottom electrodes may be contiguous as a single bottom electrode and the first and second piezoelectric layers may be contiguous as a single piezoelectric layer.

Abstract: A method of forming a micromechanical resonator includes forming a resonator body anchored to a substrate by at least a first anchor. This resonator body may include a semiconductor or other first material having a negative temperature coefficient of elasticity (TCE). A two-dimensional array of spaced-apart trenches are provided in the resonator body. These trenches may be filled with an electrically insulating or other second material having a positive TCE. The array of trenches may extend uniformly across the resonator body, including regions in the body that have relatively high and low mechanical stress during resonance. This two-dimensional array (or network) of trenches can be modeled as a network of mass-spring systems with springs in parallel and/or in series with respect to a direction of a traveling acoustic wave within the resonator body during resonance.

Abstract: A method of forming a micromechanical resonator includes forming a resonator body anchored to a substrate by at least a first anchor. This resonator body may include a semiconductor or other first material having a negative temperature coefficient of elasticity (TCE). A two-dimensional array of spaced-apart trenches are provided in the resonator body. These trenches may be filled with an electrically insulating or other second material having a positive TCE. The array of trenches may extend uniformly across the resonator body, including regions in the body that have relatively high and low mechanical stress during resonance. This two-dimensional array (or network) of trenches can be modeled as a network of mass-spring systems with springs in parallel and/or in series with respect to a direction of a traveling acoustic wave within the resonator body during resonance.