Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Abstract: A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Abstract: A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

Abstract: The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly. The method further includes curing the coating. Further, the integrated circuit may be a device which is available for at least one of sale, lease and license to a general public, such as a Commercial off the Shelf (COTS) device. Still further, the coating may promote corrosion resistance and reliability of the integrated circuit assembly.

Abstract: A display assembly comprises an electronic display element, a layer of material, and an alkali silicate glass material at least partially covering at least one of the electronic display element and the layer of material.

Abstract: The present disclosure includes a method for producing a multi-band waveguide reflector antenna feed. The antenna feed includes a first tube and a second tube. The first and second tubes are connected to form a concentric multi-band waveguide feed array. The first tube includes a surface(s) which is/are at least partially covered by metamaterial(s), thereby forming a first waveguide feed. The second tube also includes a surface(s) which is/are at least partially covered by metamaterial(s). A radial separation is established between the first tube and the second tube, thereby forming a second waveguide feed. The radial separation may be maintained between the first tube and the second tube by one or more of: a loading material, support structures, strings, and wires. The loading material, support columns, strings, and/or wires also structurally interconnect the first tube and the second tube.

Abstract: The present invention is a magnetic pump assembly for integration with a mechanically flexible thermal spreader. The assembly may include a casing which may be connectable to a mechanically flexible substrate of the thermal spreader. The assembly may further include a plurality of magnets which may be integrated with and enclosed by the casing. The magnets may be suitable for applying a magnetic field to an electrically-conductive liquid, and may be implemented in combination with electrodes, which may be integrated with the substrate and may be suitable for generating an electrical current flow through the liquid. The magnets and electrodes may combine to provide a pumping force for circulating the liquid within an internal channel of an electrically-conductive cooling loop of the substrate. The assembly may further include a thermally-conductive rigid metal insert integrated with the casing. The assembly may promote local thermal conductivity of the thermal spreader.

Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.

Abstract: A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

Abstract: A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

Abstract: The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes adding thermally conductive particles to a low processing temperature, at least near-hermetic, glass-based coating. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to at least one of the integrated circuit and the substrate. The method further includes curing the coating.

Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Abstract: A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Abstract: An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.

Abstract: The present invention is a system which includes an interposer. The interposer may include a mounting plate for mounting the interposer to a fuselage of an aircraft. The interposer may interface with the fuselage to form a seal for maintaining pressure within the aircraft. The system may further include an antenna module. The antenna module may include a ground plane, an aircraft antenna, and a radome. The ground plane may be connected to the aircraft antenna and may be configured for allowing the antenna module to be mounted to the interposer. The radome may be connected to the ground plane to form an enclosure for housing the antenna. The antenna module may be removably connected to the interposer. The system may further include an interconnect for electrically connecting the antenna module to electronics located within the aircraft. The antenna module may be disconnected from the interposer without breaking the seal formed between the interposer and the fuselage.

Abstract: A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board.

Abstract: The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.

Abstract: A tamper resistant semiconductor package includes a surface having flip chip electrical contacts. A flip chip semiconductor of the package also has flip chip electrical contacts. The flip chip semiconductor has a maximum temperature to which it can be exposed before being damaged. Flip chip solder joints physically couple and electrically connect the flip chip electrical contacts of the flip chip semiconductor to the flip chip electrical contacts of the surface. The flip chip solder joints are formed of an alloy having a higher melting point than the maximum temperature such that removal of the flip chip semiconductor from the surface by heating will destroy the functionality of the flip chip semiconductor.

Abstract: A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.