Abstract: The present invention is a magnetic pump assembly for integration with a mechanically flexible thermal spreader. The assembly may include a casing which may be connectable to a mechanically flexible substrate of the thermal spreader. The assembly may further include a plurality of magnets which may be integrated with and enclosed by the casing. The magnets may be suitable for applying a magnetic field to an electrically-conductive liquid, and may be implemented in combination with electrodes, which may be integrated with the substrate and may be suitable for generating an electrical current flow through the liquid. The magnets and electrodes may combine to provide a pumping force for circulating the liquid within an internal channel of an electrically-conductive cooling loop of the substrate. The assembly may further include a thermally-conductive rigid metal insert integrated with the casing. The assembly may promote local thermal conductivity of the thermal spreader.

Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.

Abstract: The present invention is a flexible liquid cooling loop for providing a thermal path between a heat source and a heat sink. The cooling loop includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality of mechanically flexible tubing sections configured for connecting the mechanically rigid sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board.

Abstract: A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

Abstract: A display assembly comprises an electronic display element, a layer of material, and an alkali silicate glass material at least partially covering at least one of the electronic display element and the layer of material.

Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Abstract: A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Abstract: Presently disclosed are a method and apparatus for predicting a failure in an electronic assembly by detecting an incremental change exhibited by a sacrificial sensor that is integrated into the electronic assembly and by monitoring environmental conditions that the electronic assembly is exposed to. A failure prediction is that made according to the detected incremental change exhibited by the sacrificial sensor and according to the monitored environmental conditions.

Abstract: The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes adding thermally conductive particles to a low processing temperature, at least near-hermetic, glass-based coating. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to at least one of the integrated circuit and the substrate. The method further includes curing the coating.

Abstract: A wafer-scale heterogeneous layered active electronically scanned array (ESA) utilizes a low-loss integrated waveguide feed. The ESA is formed from wafer-scale subarray modules each of which comprises a multilayer stack to form transmit/receive (T/R) modules. Waveguide subarray combiners feed the T/R modules. A subarray combiner is a waveguide assembly bonded to a bottom layer in the multilayer stack. The bottom layer is a ground plane forming a top waveguide broadwall of the combiner. The waveguide subarray combiner may be formed from a variety of waveguide types and feeds the T/R modules using electric field probe coupling or an aperture slot coupling. A second layer feed structure forms the subarray modules into the ESA and feeds the waveguide subarray combiners. The second layer feed structure uses waveguides to feed the waveguide subarray combiners using E-field probes or aperture slot coupling on the bottom waveguide broadwall.

Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Abstract: A mosaic display system includes a number of tiles. Each of the tiles includes a matrix of pixel elements. The pixel elements selectively provide light at a first surface of the tile in response to address signals. The pixel elements are coupled to an address circuit via conductors at a second surface. The first surface is opposite the second surface. The display system also includes a medium having a mounting surface. The tiles are attached to or above the mounting surface.