Abstract: Techniques for managing big data include retrieval using per-subject dictionaries having multiple levels of sub-classification hierarchy within the subject. Entries may include subject-determining-power (SDP) scores that provide an indication of the descriptive power of the entry term with respect to the subject of the dictionary containing the term. The same term may have entries in multiple dictionaries with different SDP scores in each of the dictionaries. A retrieval request for one or more documents containing search terms descriptive of the one or more documents can be processed by identifying a set of candidate documents tagged with subjects, i.e., identifiers of per-subject dictionaries having entries corresponding to a search term, then using affinity values to adjust the aggregate score for the terms in the dictionaries. Documents are then selected for best match to the subject based on the adjusted scores.

Abstract: Techniques for managing big data include tagging of documents and subsequent retrieval using per-subject dictionaries having entries with some entries specially designated as entities. An entity indicates that the term in the entry has special meaning, e.g., brands (trademarks/service marks), trade names, geographic identifiers or other classes of terms. A dictionary may include a non-entity entry for a term and one or more entity entries, for different entity types. The entries may also include subject-determining-power scores. The subject-determining-power scores provide an indication of the descriptive power of the term with respect to the subject of the dictionary containing the term. The same term may have entries in multiple dictionaries with different subject-determining-power scores in each of the dictionaries. The entity distinctions for a term can then be used in tagging documents and processing retrieval requests.

Abstract: In one embodiment, the invention is a method and apparatus for table-lookup-based models for yield analysis acceleration. One embodiment of a method for statistically evaluating a design of an integrated circuit includes simulating the integrated circuit and generating a lookup table for use in the simulating, the lookup table comprising one or more blocks that specify a device element for an associated bias voltage, wherein the generating comprises generating only those of the one or more blocks that specify the device element for a bias voltage that is required during the simulating.

Abstract: The present disclosure relates generally to the field of selective importance sampling. In various examples, selective importance sampling may be implemented in the form of methods and/or algorithms.

Abstract: The present disclosure relates generally to the field of selective importance sampling. In various examples, selective importance sampling may be implemented in the form of systems and/or algorithms.

Abstract: Correlated failure distribution for memory arrays having different groupings of memory cells is estimated by constructing memory unit models for the groupings based on multiple parameters, establishing failure conditions of the memory unit model using fast statistical analysis, calculating a fail boundary of the parameters for each memory unit model based on its corresponding failure conditions, and constructing memory array models characterized by the fail boundaries. Operation of a memory array model is repeatedly simulated with random values of the parameters assigned to the memory cells and peripheral logic elements to identify memory unit failures for each simulated operation. A mean and a variance is calculated for each memory array model, and an optimal architecture can thereafter be identified by selecting the grouping exhibiting the best mean and variance, subject to any other circuit requirements such as power or area.

Abstract: A mechanism is provided for reusing importance sampling for efficient cell failure rate estimation of process variations and other design considerations. First, the mechanism performs a search across circuit parameters to determine failures with respect to a set of performance variables. For a single failure region, the initial search may be a uniform sampling of the parameter space. Mixture importance sampling (MIS) efficiently may estimate the single failure region. The mechanism then finds a center of gravity for each metric and finds importance samples. Then, for each new origin corresponding to a process variation or other design consideration, the mechanism finds a suitable projection and recomputes new importance sampling (IS) ratios.

Abstract: An apparatus and method for combating the effects of bias temperature instability (BTI) and other variability in a memory cell. Bit lines connecting to a memory cell contain two alternate paths that criss-cross to connect a lower portion of a first bit line to an upper portion of a second bit line, and to connect a lower portion of the second bit line to an upper portion of the first bit line. Alternative to activating transistors on the bit lines to read and write to the memory cell, transistors on the alternative paths may be activated to read and write to the memory cell from the opposite bit line. In this fashion, the memory cell may be read through the bit lines to a sense amplifier where the bit values are latched. While the bit values remain latched in the sense amplifier, the transistors on the bit lines are deactivated and the transistors on the alternate paths are activated.

Abstract: Techniques for electronic circuit design simulation are provided. In one aspect, a method for electronic circuit design simulation includes the following steps. A model (e.g., a physics-based model) of the circuit design is created. Error tables are created containing data related to one or more regions of the circuit design. The model is modified with data from the error tables. The modified model is used to simulate the circuit design.

Abstract: An apparatus and method for combating the effects of bias temperature instability (BTI) in a memory cell. Bit lines connecting to a memory cell contain two alternate paths criss-crossing to connect a lower portion of a first bit line to an upper portion of a second bit line, and to connect a lower portion of the second bit line to an upper portion of the first bit line. Alternative to activating transistors on the bit lines to read and write to the memory cell, transistors on the alternative paths may be activated to read and write to the memory cell from the opposite bit lines. The memory cell may be read through the bit lines to a sense amplifier, the transistors on the bit lines are subsequently deactivated and the transistors on the alternate paths are activated to write transposed bit values to the memory cell, thereby reversing the biases.

Abstract: A method for analyzing circuits includes identifying one or more device zones in a full device structure. The device zones provide areas of interest to be analyzed. A partial device is generated that representatively includes the one or more device zones. Analytical meshes of the partial device are reduced by employing physical characteristics of the full device structure. The partial device is simulated, using a processor, to obtain device output information in the areas of interest that is representative of the full device structure. Systems are also disclosed.

Abstract: A method for analyzing circuits includes identifying one or more device zones in a full device structure. The device zones provide areas of interest to be analyzed. A partial device is generated that representatively includes the one or more device zones. Analytical meshes of the partial device are reduced by employing physical characteristics of the full device structure. The partial device is simulated, using a processor, to obtain device output information in the areas of interest that is representative of the full device structure. Systems are also disclosed.

Abstract: An apparatus and method for combating the effects of bias temperature instability (BTI) and other variability in a memory cell. Bit lines connecting to a memory cell contain two alternate paths that criss-cross to connect a lower portion of a first bit line to an upper portion of a second bit line, and to connect a lower portion of the second bit line to an upper portion of the first bit line. Alternative to activating transistors on the bit lines to read and write to the memory cell, transistors on the alternative paths may be activated to read and write to the memory cell from the opposite bit line. In this fashion, the memory cell may be read through the bit lines to a sense amplifier where the bit values are latched. While the bit values remain latched in the sense amplifier, the transistors on the bit lines are deactivated and the transistors on the alternate paths are activated.

Abstract: A single finite element mesh is generated for predicting performance of an integrated circuit design. A plurality of sample points are identified for conducting a variability study on at least one parameter associated with the integrated circuit design. The sample points are selected to predict performance of the integrated circuit design when subject to variations in the at least one parameter due to variations in manufacturing processes to be used to manufacture the integrated circuit design. A parameterized netlist is generated corresponding to each of the sample points. A technology computer aided design (TCAD) simulation is run for each of the parameterized netlists, using the single finite element mesh for each of the parameterized netlists, until convergence is achieved, to obtain, for each of the parameterized netlists, at least one metric indicative of the performance of the integrated circuit design. A predicted design yield is developed for the integrated circuit design.

Abstract: A single finite element mesh is generated for predicting performance of an integrated circuit design. A plurality of sample points are identified for conducting a variability study on at least one parameter associated with the integrated circuit design. The sample points are selected to predict performance of the integrated circuit design when subject to variations in the at least one parameter due to variations in manufacturing processes to be used to manufacture the integrated circuit design. A parameterized netlist is generated corresponding to each of the sample points. A technology computer aided design (TCAD, e.g., finite element) simulation is run for each of the parameterized netlists, using the single finite element mesh for each of the parameterized netlists, until convergence is achieved, to obtain, for each of the parameterized netlists, at least one metric indicative of the performance of the integrated circuit design.

Abstract: Correlated failure distribution for memory arrays having different groupings of memory cells is estimated by constructing memory unit models for the groupings based on multiple parameters, establishing failure conditions of the memory unit model using fast statistical analysis, calculating a fail boundary of the parameters for each memory unit model based on its corresponding failure conditions, and constructing memory array models characterized by the fail boundaries. Operation of a memory array model is repeatedly simulated with random values of the parameters assigned to the memory cells and peripheral logic elements to identify memory unit failures for each simulated operation. A mean and a variance is calculated for each memory array model, and an optimal architecture can thereafter be identified by selecting the grouping exhibiting the best mean and variance, subject to any other circuit requirements such as power or area.

Abstract: Systems and methods for determining optimal memory device precharge voltages are provided herein. In addition, systems and methods for providing localized sense amplification and circuit assist circuitry are described herein. Embodiments provide for determining precharge multipliers that may be used to determine the optimal precharge voltage based on a precharge source voltage. According to embodiments, the precharge source voltage may be Vdd or Vcs. Optimizing the precharge voltage maximizes memory device performance and functional characteristics, including, but not limited to, stability, efficiency, power, writability, and reliability.

Abstract: An apparatus and method for combating the effects of bias temperature instability (BTI) in a memory cell. Bit lines connecting to a memory cell contain two alternate paths criss-crossing to connect a lower portion of a first bit line to an upper portion of a second bit line, and to connect a lower portion of the second bit line to an upper portion of the first bit line. Alternative to activating transistors on the bit lines to read and write to the memory cell, transistors on the alternative paths may be activated to read and write to the memory cell from the opposite bit lines. The memory cell may be read through the bit lines to a sense amplifier, the transistors on the bit lines are subsequently deactivated and the transistors on the alternate paths are activated to write transposed bit values to the memory cell, thereby reversing the biases.

Abstract: A single finite element mesh is generated for predicting performance of an integrated circuit design. A plurality of sample points are identified for conducting a variability study on at least one parameter associated with the integrated circuit design. The sample points are selected to predict performance of the integrated circuit design when subject to variations in the at least one parameter due to variations in manufacturing processes to be used to manufacture the integrated circuit design. A parameterized netlist is generated corresponding to each of the sample points. A technology computer aided design (TCAD) simulation is run for each of the parameterized netlists, using the single finite element mesh for each of the parameterized netlists, until convergence is achieved, to obtain, for each of the parameterized netlists, at least one metric indicative of the performance of the integrated circuit design. A predicted design yield is developed for the integrated circuit design.

Abstract: A failure probability for a system having multi-fail regions is computed by generating failure directions in a space whose dimensions are the system parameters under consideration. The failure directions are preferably uniform, forming radial slices. The failure directions may be weighted. The radial slices have fail boundaries defining fail regions comparable to broken shells. The distribution of the system parameters is integrated across the broken shell regions to derive a failure contribution for each failure direction. The failure probability is the sum of products of each failure contribution and its weight. Failure contributions are computed using equivalent expressions dependent on the number of dimensions, which can be used to build lookup tables for normalized fail boundary radii. The entire process can be iteratively repeated with successively increasing failure directions until the failure probability converges.