Abstract: A back-support board including a leg assembly, a support assembly and an assistance assembly is disclosed. The leg assembly includes adjustable legs which have insertable pegs within for reinforcing the strength of the legs to be able to support weight thereon in a stable and safe manner. The support assembly includes a base having a reinforcing layer atop and further having a top layer thereon. The top layer being of a carpet or rubber material. Once a user needs to work underneath a tight space such as under a sink, the back-support board is adjusted to a proper height and allows for the user to lay down on the back-support board to comfortably work on the necessary task with their body supported on the back-support board. The back-support board is adjustable to allow fitting under different tight spaces for completing different tasks in a more comfortable manner.

Abstract: Apparatus is for vehicle wheel rim having outer peripheral rim edge surrounding an outer-facing zone. Vehicle wheel rim is configured to provide a connection with vehicle tire of vehicle. Apparatus includes rim-cover assembly having outer peripheral edge. Rim-cover assembly is configured to cover, at least in part, outer-facing zone of vehicle wheel rim for case where rim-cover assembly is positioned relative to outer-facing zone of vehicle wheel rim. Resilient clips are each positionable at spaced-apart positions located on outer peripheral edge of rim-cover assembly. Resilient clips are configured to resiliently clip the outer peripheral edge of rim-cover assembly at spaced-apart positions to outer peripheral rim edge, for case where rim-cover assembly is positioned relative to outer-facing zone of vehicle wheel rim.

Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

Abstract: The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers.

Abstract: Treatment of muscle or bone ailments to relieve pain by topical application of fluid polyalkylene glycol.

Abstract: A method for treating skin ailments comprising applying polyethylene glycol or other lower polyalkylene glycol to the ailing portion of the skin.