Patents by Inventor Roy Magnuson

Roy Magnuson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10064283
    Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: August 28, 2018
    Assignee: The Research Foundation for the State University of New York
    Inventors: Junghyun Cho, Bahgat Sammakia, Mark D. Poliks, Roy Magnuson, Biplab Kumar Roy
  • Publication number: 20170013721
    Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
    Type: Application
    Filed: November 10, 2014
    Publication date: January 12, 2017
    Inventors: Junghyun Cho, Bahgat Sammakia, Mark D. Poliks, Roy Magnuson, Biplab Kumar Roy
  • Publication number: 20160135303
    Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
    Type: Application
    Filed: November 10, 2014
    Publication date: May 12, 2016
    Inventors: Junghyun Cho, Bahgat Sammakia, Mark D. Poliks, Roy Magnuson, Biplab Kumar Roy
  • Patent number: 8882983
    Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: November 11, 2014
    Assignee: The Research Foundation for The State University of New York
    Inventors: Junghyun Cho, Bahgat Sammakia, Mark D. Poliks, Roy Magnuson, Biplab Kumar Roy
  • Publication number: 20090301770
    Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 10, 2009
    Inventors: Junghyun Cho, Bahgat Sammakia, Mark D. Poliks, Roy Magnuson, Biplab Kumar Roy
  • Publication number: 20070007033
    Abstract: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.
    Type: Application
    Filed: October 6, 2005
    Publication date: January 11, 2007
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra Das, John Lauffer, Roy Magnuson, Voya Markovich
  • Publication number: 20060255009
    Abstract: A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.
    Type: Application
    Filed: May 13, 2005
    Publication date: November 16, 2006
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Norman Card, Robert Edwards, John Konrad, Roy Magnuson, Timothy Wells, Michael Wozniak
  • Publication number: 20060214010
    Abstract: A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.
    Type: Application
    Filed: April 11, 2006
    Publication date: September 28, 2006
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Benson Chan, Frank Egitto, Roy Magnuson, Voya Markovich, David Thomas
  • Publication number: 20060121722
    Abstract: A method of making a printed circuit board in which openings of different length are formed using a cover atop one of the openings to prevent dielectric material from an interim layer of heat-deformable dielectric material from entering the opening when the sub-composite having the opening therein is bonded to a second sub-composite. The bonded sub-composites are then provided with a second opening which extends there-through, this second opening being longer than the first. Pins of an electrical component may then be inserted within the first and second openings of different length.
    Type: Application
    Filed: January 19, 2006
    Publication date: June 8, 2006
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Norman Card, Benson Chan, Richard Day, John Lauffer, Roy Magnuson, Voya Markovich
  • Publication number: 20060005383
    Abstract: A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
    Type: Application
    Filed: September 12, 2005
    Publication date: January 12, 2006
    Applicant: International Business Machines Corporation
    Inventors: Kenneth Fallon, Miguel Jimarez, Ross Keesler, John Lauffer, Roy Magnuson, Voya Markovich, Irv Memis, Jim Paoletti, Marybeth Perrino, John Welsh, William Wilson
  • Publication number: 20050230839
    Abstract: A method for protecting a material of a microstructure comprising the material and a noble metal layer against undesired galvanic etching during manufacture, the method comprises forming on the structure a sacrificial metal layer having a lower redox potential than the material, the sacrificial metal layer being electrically connected to the noble metal layer.
    Type: Application
    Filed: June 10, 2005
    Publication date: October 20, 2005
    Inventors: Michel Despont, Roy Magnuson, Ute Drechsler
  • Publication number: 20050042383
    Abstract: A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.
    Type: Application
    Filed: September 13, 2004
    Publication date: February 24, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Raymond Galasco, Roy Magnuson, Voya Markovich, Thomas Miller, Anita Sargent, William Wilson