Abstract: A semiconductor wafer design and process having test pads (36) reducing cracks generated during the wafer saw process from extending into and damaging adjacent die. The present invention provides a plurality of circular test pads (36) in a wafer scribe street (34) such that any cracks generated in the test pad during wafer saw self terminate in the periphery of the circular test pad. By providing a curved test pad periphery, cracks will tend to propagate along the edges of the test pads and self terminate therein. The circular test pads avoid any sharp corners as is conventional in rectangular test pads which tend to facilitate the extension of cracks from corners to extend into the adjacent wafer die (32). The present invention utilizes existing semiconductor fab processing and utilizes new reticle sets to define the curved test pads.

Abstract: A semiconductor wafer design and process having test pads (36) reducing cracks generated during the wafer saw process from extending into and damaging adjacent die. The present invention provides a plurality of circular test pads (36) in a wafer scribe street (34) such that any cracks generated in the test pad during wafer saw self terminate in the periphery of the circular test pad. By providing a curved test pad periphery, cracks will tend to propagate along the edges of the test pads and self terminate therein. The circular test pads avoid any sharp corners as is conventional in rectangular test pads which tend to facilitate the extension of cracks from corners to extend into the adjacent wafer die (32). The present invention utilizes existing semiconductor fab processing and utilizes new reticle sets to define the curved test pads.

Abstract: A semiconductor wafer design and process having test pads (36) reducing cracks generated during the wafer saw process from extending into and damaging adjacent die. The present invention provides a plurality of circular test pads (36) in a wafer scribe street (34) such that any cracks generated in the test pad during wafer saw self terminate in the periphery of the circular test pad. By providing a curved test pad periphery, cracks will tend to propagate along the edges of the test pads and self terminate therein. The circular test pads avoid any sharp corners as is conventional in rectangular test pads which tend to facilitate the extension of cracks from corners to extend into the adjacent wafer die (32). The present invention utilizes existing semiconductor fab processing and utilizes new reticle sets to define the curved test pads.

Abstract: A semiconductor assembly comprising first and second chips, each having an active surface including an integrated circuit and a plurality of input/output contact pads; an interposer of electrically insulating material having a plurality of electrically conductive paths extending through said interposer from the first surface to the second surface, forming electrical terminals on each of said surfaces; said interposer being disposed between said active surfaces of said first and second chips; connections between each of said contact pads of said first chip to selected terminals on said first interposer surface, respectively, and between each of said contact pads of said second chip to selected terminals on said second interposer surface, respectively; and said interposer further having electrical terminals for interconnecting said chips to other parts.