Patents by Inventor Rui Hua
Rui Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090080161Abstract: A heat dissipation device for dissipating heat generated by an electronic component mounted on an add-on card includes a first heat dissipation unit, a second heat dissipation unit, a third heat dissipation unit and a heat pipe. The heat pipe has an evaporating portion thermally connecting with the electronic component via the first dissipation unit, and two oppositely extending condensing portions extending through and thermally connecting with the second and third heat dissipation units. The second and third heat dissipation units are positioned at a common lengthwise side of the graphics card and separated from each other. The second and third heat dissipation units each have an L-shaped configuration. The heat pipe has two connection portions connecting the evaporating portion with the condensing portions, respectively. The connecting portions together with the evaporating portion form a U-shaped configuration.Type: ApplicationFiled: September 26, 2007Publication date: March 26, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20090059538Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.Type: ApplicationFiled: August 29, 2007Publication date: March 5, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Patent number: 7495923Abstract: A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure.Type: GrantFiled: July 23, 2007Date of Patent: February 24, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7492596Abstract: A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.Type: GrantFiled: August 9, 2007Date of Patent: February 17, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20090040725Abstract: A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.Type: ApplicationFiled: August 9, 2007Publication date: February 12, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20090027855Abstract: A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure.Type: ApplicationFiled: July 23, 2007Publication date: January 29, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Patent number: 7443672Abstract: A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.Type: GrantFiled: October 3, 2006Date of Patent: October 28, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7443680Abstract: A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base.Type: GrantFiled: April 4, 2007Date of Patent: October 28, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., lts., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20080247136Abstract: A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base.Type: ApplicationFiled: April 4, 2007Publication date: October 9, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20080156459Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.Type: ApplicationFiled: April 2, 2007Publication date: July 3, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20080158820Abstract: A heat dissipation device (100) is mounted on a heat-generating device (12) of a graphics card (10) and comprises a heat sink (20), a fan (30), a cover (40) and a heat pipe (50). The heat sink (20) has a base (22) and a plurality of fins (24) on the base (22). The fan (30) is mounted on the base (22) of the heat sink (20) beside the fins (24). The cover (40) covers the heat sink (20) and the fan (30). The heat pipe (50) is embedded in a bottom surface of the base (22) of the heat sink (20) in direct contact with the heat-generating device (12). The heat pipe (50) has a bottom face coplanar with the bottom surface of the base (22). The base (22) and the fins (24) are integrally formed as a monolithic piece by aluminum extrusion.Type: ApplicationFiled: March 2, 2007Publication date: July 3, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Patent number: 7382618Abstract: A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes four pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.Type: GrantFiled: October 13, 2006Date of Patent: June 3, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7382621Abstract: A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate (30) is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.Type: GrantFiled: January 24, 2006Date of Patent: June 3, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7369412Abstract: A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.Type: GrantFiled: May 2, 2006Date of Patent: May 6, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7365989Abstract: A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.Type: GrantFiled: March 8, 2006Date of Patent: April 29, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen, Jun-Hai Li
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Publication number: 20080089026Abstract: A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes fours pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.Type: ApplicationFiled: October 13, 2006Publication date: April 17, 2008Applicant: Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20080080143Abstract: A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.Type: ApplicationFiled: October 3, 2006Publication date: April 3, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7327576Abstract: A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together.Type: GrantFiled: June 24, 2005Date of Patent: February 5, 2008Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Bing Chen, Rui-Hua Chen
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Publication number: 20070258218Abstract: A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.Type: ApplicationFiled: May 2, 2006Publication date: November 8, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20070211432Abstract: A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.Type: ApplicationFiled: March 8, 2006Publication date: September 13, 2007Applicant: FOXCONN TECHNOLOGY CO.,LTD.Inventors: Xue-Wen Peng, Rui-Hua Chen, Jun-Hai Li