Patents by Inventor Rui Hua

Rui Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070171611
    Abstract: A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate (30) is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.
    Type: Application
    Filed: January 24, 2006
    Publication date: July 26, 2007
    Inventors: Xue-Wen Peng, Rui-Hua Chen
  • Publication number: 20060291172
    Abstract: A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together.
    Type: Application
    Filed: June 24, 2005
    Publication date: December 28, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Bing Chen, Rui-Hua Chen
  • Patent number: 7019974
    Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: March 28, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
  • Publication number: 20060012959
    Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
    Type: Application
    Filed: July 16, 2004
    Publication date: January 19, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
  • Patent number: D509806
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: September 20, 2005
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen