Patents by Inventor Rui Huang

Rui Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11439132
    Abstract: Provided are a humanized transgenic non-human animal, especially a rodent, in particular a transgenic mouse containing a human interleukin 17A (IL-17A) gene, a human gene 17RA (IL-17RA) and/or a human TNF-alpha gene, and a preparation method therefor and the use thereof.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: September 13, 2022
    Assignee: Biocytogen Pharmaceuticals (Beijing) Co., Ltd.
    Inventors: Yuelei Shen, Chaoshe Guo, Yanan Guo, Yang Bai, Rui Huang, Lei Zhao, Xiaofei Zhou, Meiling Zhang, Jiawei Yao
  • Patent number: 11440798
    Abstract: Disclosed is a process system and a process for converting the sulfur-containing flue gas into the sulfuric acid. The process system comprises: a flue gas preheater, which for preheating the sulfur-containing flue gas to 15˜30° C. above its dew point, and the flue gas preheater has a glass tube as a heat exchange tube; a flue gas fan for boosting the pressure of the preheated acid process gas and transporting one part of which to a combustion furnace, and the other part of which to a process gas steam heater; a sulfuric acid steam condenser for condensing SO3 generated by the combined reactor into sulfuric acid. The device of the present invention can resist the fluctuation of SO2 concentration in the feed gas, and can realize considerable economic benefits and rational utilization of energy.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: September 13, 2022
    Assignees: KEYON PROCESS CO., LTD
    Inventors: Rui Huang, Dan Wang, Huayong Zhang, Yuan Zhang, Junling Qi
  • Publication number: 20220272953
    Abstract: Provided are genetically modified non-human animals that express a human or chimeric (e.g., humanized) IL33, and methods of use thereof.
    Type: Application
    Filed: July 29, 2020
    Publication date: September 1, 2022
    Inventors: Yuelei Shen, Yanan Guo, Yang Bai, Chengzhang Shang, Rui Huang, Meiling Zhang, Jiawei Yao, Chaoshe Guo
  • Publication number: 20220271185
    Abstract: An optoelectronic integrated substrate, a preparation method thereof and an optoelectronic integrated circuit. The electronic integrated substrate includes a base substrate and an electronic device and a photo-diode disposed on the base substrate, wherein the photo-diode includes an ohmic contact layer and an intrinsic amorphous silicon layer, and the ohmic contact layer and the intrinsic amorphous silicon layer are sequentially arranged along a direction parallel to the plane of the base substrate and are connected.
    Type: Application
    Filed: October 14, 2021
    Publication date: August 25, 2022
    Inventors: Rui HUANG, Haibin ZHU
  • Publication number: 20220240369
    Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 28, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Ming-Ting Chang
  • Publication number: 20220240375
    Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
    Type: Application
    Filed: October 28, 2021
    Publication date: July 28, 2022
    Inventors: Ching-Sheng CHEN, Chi-Min CHANG, Yi-Pin LIN, Jun-Rui HUANG
  • Patent number: 11396682
    Abstract: A free-cutting and non-quenched and tempered steel, comprising the following chemical elements by mass percentages: C: 0.35-0.45%, Si: 0.45-0.0.65%, Mn: 1.35-1.65%, S: 0.025-0.065%, V: 0.07-0.15%, Ti: 0.01-0.018%, N: 0.012-0.017%, Al: 0.015-0.035%, Ca: 0.0008-0.0025%, with the remaining being iron and other unavoidable impurities, wherein the S and Ca elements satisfy the relationship S/Ca=20-60. A manufacturing method of the free-cutting and non-quenched and tempered steel, comprising the following steps: (1) smelting and refining; (2) casting; (3) rolling; (4) forging; and (5) two-stage cooling.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: July 26, 2022
    Assignee: BAOSHAN IRON & STEEL CO., LTD.
    Inventors: Dajiang Yu, Xijun Jiang, Zongze Huang, Rui Huang
  • Publication number: 20220232695
    Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 21, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Jun-Rui Huang, Chih-Chiang Lu, Yi-Pin Lin, Ching-Sheng Chen
  • Publication number: 20220232694
    Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
    Type: Application
    Filed: October 8, 2021
    Publication date: July 21, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
  • Publication number: 20220230949
    Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.
    Type: Application
    Filed: October 12, 2021
    Publication date: July 21, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Hsin-Ning Liu, Jun-Rui Huang, Pei-Wei Wang, Ching Sheng Chen, Shih-Lian Cheng
  • Publication number: 20220211019
    Abstract: The present disclosure relates to genetically modified non-human animals that express a human or chimeric (e.g., humanized) CD73, and methods of use thereof.
    Type: Application
    Filed: November 20, 2019
    Publication date: July 7, 2022
    Inventors: Yuelei Shen, Yanan Guo, Yang Bai, Rui Huang, Chengzhang Shang, Meiling Zhang, Jiawei Yao, Chaoshe Guo
  • Patent number: 11372075
    Abstract: Provided are a positioning method, apparatus and system, a layout method for a positioning system and a storage medium. A plurality of labels is laid with preset positioning precision in an area to be positioned, where each label among the plurality of labels carries label information, where the label information corresponds to position information of a position of the each label. A position acquisition device reads first label information on a label at a distance not greater than the preset positioning precision from the position acquisition device; and the position acquisition device determines first position information of the position acquisition device according to the first label information.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 28, 2022
    Inventors: Dandan Guo, Wenyuan Cheng, Xiong Tang, Rui Huang
  • Publication number: 20220201563
    Abstract: Methods, systems, apparatus, and computer programs, for implementing dual-connectivity handover. In one aspect, a method includes determining, by user equipment (UE), whether the UE is capable of simultaneous communication with a source cell and a target cell, generating, by the UE, a handover indicator, the handover indicator having one or more fields structuring data that indicates that the UE is capable of simultaneous communication with the source cell and the target cell, transmitting, by the UE, the handover indicator to an access node, and receiving, by the UE and from the access node based on receipt by the access node of the handover indicator, a command to perform handover.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 23, 2022
    Inventors: Qiming LI, Jie Cui, Yang Tang, Hua LI, Rui Huang
  • Publication number: 20220201519
    Abstract: An approach is described for a user equipment (UE), wherein the UE includes radio front end circuitry and processor circuitry coupled to the radio front end circuitry. The processor circuitry receives a reference signal from a source device via a radio link, wherein the reference signal is one of the synchronization signal block (SSB) signal or channel state information reference signal (CSI-RS). The processor circuitry measures a quality of the reference signal, and measures an evaluation time of the reference signal. The processor circuitry determines a first indicator of the radio link based on the quality of the reference signal, and determine a second indicator of the radio link based on the evaluation time of the reference signal. The processor circuitry then determines a status of a connection of the radio link based on the first indicator and the second indicator of the radio link, and generate a message based the status of the connection.
    Type: Application
    Filed: March 30, 2020
    Publication date: June 23, 2022
    Applicant: Apple Inc.
    Inventors: Rui HUANG, Qiming LI, Jie CUI, Zhibin YU, Yang TANG, Hua LI
  • Patent number: 11367427
    Abstract: A design method for feedforward active noise control system is disclosed. Based on a target signal and a reference signal, a first adaptive system identifying unit is enabled to complete a first system identification process for producing a first adaptive filter, and then a second adaptive system identifying unit is enabled to complete a second system identification process for producing a second adaptive filter. After the second adaptive filter is converted to a digitally-controlled filter by using a system identification tool, the digitally-controlled filter is implemented into a DSP chip of a feedforward active noise control system. As a result, it is able to find that not only the computing loading of the DSP chip is significantly lowered while an adaptive algorithm executes an active noise control computing, but also the feedforward active noise control system exhibits a broad frequency bandwidth noise cancelling ability.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: June 21, 2022
    Assignee: Chung Yuan Christian University
    Inventors: Cheng-Yuan Chang, Sen-Maw Kuo, Chong-Rui Huang
  • Publication number: 20220191762
    Abstract: The present application relates to wireless devices and components including apparatus, systems, and methods for two-stage cell reselection in New Radio (NR) systems operating on unlicensed spectrum. In some embodiments, a user equipment may be perform a pre-check of a public land mobile network associated with a target cell prior to cell reselection.
    Type: Application
    Filed: July 15, 2020
    Publication date: June 16, 2022
    Applicant: Apple Inc.
    Inventors: Rui Huang, Zhibin Yu, Jie Cui
  • Publication number: 20220182208
    Abstract: Techniques are provided for mitigating inter-carrier interference (ICI) due to frequency multiplexed downlink channels with mixed numerologies. For example, a base station allocates, for a user equipment (UE), a first downlink (DL) channel and a second DL channel that are frequency multiplexed in a same bandwidth part (BWP) and have different channel numerologies The base station determines a guard band interval between the first DL channel and the second DL channel based on one or more characteristics of the different channel numerologies, transmits DL transmissions to the UE, over the first DL channel and the second DL channel, using the guard band interval between the first DL channel and the second DL channel.
    Type: Application
    Filed: March 9, 2020
    Publication date: June 9, 2022
    Applicant: Apple Inc.
    Inventors: Zhibin YU, Rui HUANG, Jie CUI, Yang TANG, Hua LI
  • Publication number: 20220177725
    Abstract: The present application relates to a solvent-free matt polyurea coating which is obtained by carrying out a reaction through reacting at least following components: a) a polyisocyanate prepolymer; b) a polyether amine; c) a main chain extender, wherein the coating further comprises ground carbon fibers as a matting agent. The carbon fibers have an average fiber length greater than or equal to 50 ?m and less than or equal to 150 ?m, a weight fraction greater than or equal to 4.5% and less than or equal to 25%. The present application also relates to a kit of parts for producing a solvent-free matt polyurea coating.
    Type: Application
    Filed: February 23, 2022
    Publication date: June 9, 2022
    Inventors: Jan Dietrich, Tiantian Chi, Wusong Li, Ping Li, Rui Huang
  • Publication number: 20220182951
    Abstract: This disclosure provides techniques for activation of a secondary cell by a user equipment (UE) operating in a wireless network. For example, a UE receives a command to activate a secondary cell of the wireless network for wireless communication, and determines whether timing information is known by the UE for the secondary cell. Based on the determination, the UE performs a first secondary cell activation within first time period based on the timing information being known, or performs a second secondary cell activation within a second time period based on the timing information being unknown. After which, the UE wirelessly communicate data over the wireless network using the secondary cell, based on the secondary cell being activated.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 9, 2022
    Applicant: Apple Inc.
    Inventors: Yuhan ZHOU, Qiming LI, Shuang TIAN, Jie CUI, Rui HUANG, Yang TANG
  • Patent number: D955390
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: June 21, 2022
    Assignee: INTERMEC IP CORPORATION
    Inventors: Yinlei Zhang, Yijing Hou, Jia Rui Huang, Shuming Li, Tiecheng Qu, Zhao Xia Jin