Patents by Inventor Rui YUan

Rui YUan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12357971
    Abstract: A preparation method of a monometallic or bimetallic nanoparticle-supported catalyst is disclosed. The synthesis of metal nanoparticles with different shapes, sizes, and atomic structures is affected by nucleation and growth rates. By changing a ratio of strong and weak reducing agents, a suitable double reducing agent is provided for metal nanoparticles with different reduction potentials, where the strong reducing agent is used for rapid nucleation and the weak reducing agent is used for the growth of metal nanoparticles. Accordingly, modulation and control of the nucleation and growth rates can be realized during the synthesis of nanoparticles. In addition, through multiple actions of a combination of reducing agents with different reduction intensities, monometallic/bimetallic nanoparticles of different sizes, shapes, and atomic structures are controllably prepared, which are then supported with a carrier to obtain the monometallic or bimetallic nanoparticle-supported catalyst.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: July 15, 2025
    Assignee: Chongqing Research Academy of Eco-Environmental Sciences
    Inventors: Wei Hu, Yaoqiang Chen, Rui Yuan, Dan Zhang
  • Patent number: 12338328
    Abstract: A reversible stress-responsive material, a preparation method, and a use thereof are provided. The reversible stress-responsive material has the property of real-time reversible force response at room temperature. When used with crosslinked plastic (high Tg) and rubber (low Tg) polymer materials, the reversible stress-responsive material can significantly enhance the mechanical strength and ductility of covalently cross-linked polymers. the triazolinedione (TAD)-indole click chemistry with the force-induced reversible property is used to construct a force-reversible crosslinked polymer material, and such a force-induced reversible crosslinking method can achieve the breakage and re-forming of covalent crosslinking points at room temperature in a solid state without any external stimuli other than the ambient temperature. This room-temperature force-induced reversible C—N covalent crosslinking can be regarded as an innovative approach to designing a high-toughness polymer material.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: June 24, 2025
    Assignees: Southwest University of Science and Technology, Sichuan Guanmusi Yang New Material Technology Co LTD
    Inventors: Guanjun Chang, Li Yang, Yewei Xu, Ying Huang, Rui Yuan, Mengqi Du
  • Patent number: 12216218
    Abstract: Embodiments of this application provide a positioning method and apparatus. The method may include setting an ambiguity adjustment parameter for a mobile device, where the ambiguity adjustment parameter is used to record an ambiguity change status used to determine a virtual station observation value for the mobile device. The method may also include adjusting an observation value of a first primary datum station based on a first ambiguity adjustment parameter of the mobile device in a first serving cell to generate a first virtual station observation value, where the first primary datum station is a primary datum station of the first serving cell, and the first virtual station observation value is used to position the mobile device in the first serving cell; and sending the first virtual station observation value to the mobile device.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: February 4, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jingsong Huang, Rui Yuan, Yangbo Lin, Yi Zhang
  • Publication number: 20240332156
    Abstract: A thickness of a signal trace on a printed circuit board (PCB) or a substrate is increased by intentionally forming a solder bridge on a surface of the signal trace during a reflow process in which a flip chip die or other computing component is mounted to the PCB or the substrate. Specifically, adjacent interconnects of the flip chip die are coupled to the same signal trace on the PCB or the substrate. During the reflow process, solder associated with each interconnect flows into a space or area defined by the adjacent interconnects and forms a solder bridge within the space, thereby increasing a thickness of the signal trace.
    Type: Application
    Filed: July 24, 2023
    Publication date: October 3, 2024
    Inventors: Rui Yuan, Zengyu Zhou, Yihao Chen, Fen Yu, Paul Qu
  • Publication number: 20240220384
    Abstract: Embodiments of the present disclosure provide an information display method, an apparatus, a device and a storage medium, in which a platform list is firstly displayed in an interface of a terminal device; then an operation and maintenance page of a first platform is displayed on the interface of the terminal device in response to a selection operation of a user on a platform identifier of the first platform, where the operation and maintenance page includes at least one of a stream-pushing page, a controlling page and a monitoring page.
    Type: Application
    Filed: March 3, 2022
    Publication date: July 4, 2024
    Inventors: Mingkun XIA, Kai LI, Rui YUAN, Ke CHEN
  • Patent number: 12021061
    Abstract: A memory device includes a substrate, a controller die, a flip chip die, first and second silicon dies, and bond wires. The controller and flip chip dies are attached to the substrate using connection balls and in electrical communication with each other. The first and second silicon dies include respective first and second contact pad surfaces. The bond wires electrically connect the contact pad surfaces to the substrate so the first and second silicon dies communicate with the controller die. The flip chip die and first and second silicon dies are NAND dies, the flip chip die is configured as SLC memory, and the silicon dies are configured as one of MLC memory, TLC memory, or QLC memory.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: June 25, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Rui Yuan, Hope Chiu, Paul Qu, Kevin Du, Zengyu Zhou, Yi Su, Shixing Zhu
  • Patent number: 12021060
    Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: June 25, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kevin Du, Hope Chiu, Zengyu Zhou, Alex Zhang, Vincent Jiang, Shixing Zhu, Paul Qu, Yi Su, Rui Yuan
  • Publication number: 20240109246
    Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes a build material deposition device to form a plastically deformable three-dimensional (3D) object by depositing layers of a thermoplastic build material to form a body of the plastically deformable 3D object. The additive manufacturing system also includes a heat channel forming device to form heat channels within the plastically deformable 3D object which heat channels, responsive to an applied stimulus, are to soften adjacent regions of the body. The additive manufacturing system also includes a fusing system to selectively harden layers of thermoplastic build material to form the plastically deformable 3D object.
    Type: Application
    Filed: February 19, 2021
    Publication date: April 4, 2024
    Inventors: Juha SONG, Kiesar Sideeq BHAT, Qian SHI, Muhammad Aidil BIN JUHARI, Aravind Kumar JAYASANKAR, Rui Yuan HAN, Rafael BALLAGAS, Michael John REGAN
  • Publication number: 20230391963
    Abstract: A reversible stress-responsive material, a preparation method, and a use thereof are provided. The reversible stress-responsive material prepared by the present disclosure has the property of real-time reversible force response at room temperature. When used with crosslinked plastic (high Tg) and rubber (low Tg) polymer materials, the reversible stress-responsive material can significantly enhance the mechanical strength and ductility of covalently cross-linked polymers. In the present disclosure, the triazolinedione (TAD)-indole click chemistry with the force-induced reversible property is used to construct a force-reversible crosslinked polymer material, and such a force-induced reversible crosslinking method can achieve the breakage and re-forming of covalent crosslinking points at room temperature in a solid state without any external stimuli other than the ambient temperature.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 7, 2023
    Applicants: Southwest University of Science and Technology, Sichuan Guanmusi Yang New Material Technology Co LTD
    Inventors: Guanjun CHANG, Li YANG, Yewei XU, Ying HUANG, Rui YUAN, Mengqi DU
  • Publication number: 20230358010
    Abstract: Disclosed is a method for preventing sudden subsidence of an open caisson in a soft foundation, which includes the following steps: a position of the open caisson is determined; grouting is carried out to reinforce a foundation of the open caisson; an open caisson manufacturing site is leveled; sections of the open caisson are manufactured and installed; the step of sections of the open caisson are manufactured and installed is repeated until all the sections are manufactured and the open caisson subsides in place as a whole. The application is suitable for construction on soft soil, loss caused by the phenomenon of sudden subsidence may be avoided, and personal safety of constructors may be guaranteed.
    Type: Application
    Filed: July 5, 2023
    Publication date: November 9, 2023
    Applicants: CHINA TIESIJU CIVIL ENGINEERING GROUP CO., LTD., THE THIRD CONSTRUCTION CO., LTD. OF CTCE GROUP
    Inventors: Rui YUAN, Lin QIN, Gang HUANG, Qianchao YIN, Hao HONG, Jianlong YAN
  • Publication number: 20230357857
    Abstract: The present invention relates to catalytic, nucleic acid nanostmctures that enable versatile detection of RNAs, their use, and devices comprising same. The nanostructure comprises a DNA polymerase enzyme, a DNA aptamer and an inverter oligonucleotide, wherein the DNA aptamer comprising (i) a conserved sequence region for binding to the DNA polymerase enzyme, wherein the binding inactivates the polymerase activity, (ii) a variable sequence region for binding to the inverter oligonucleotide, and (iii) a duplex stabilizer region that lies between the conserved sequence region and the variable sequence region. The present invention also relates to the use of the nanostructure in a method of detection of nucleic acid for diagnosing a disease in a subject.
    Type: Application
    Filed: September 23, 2021
    Publication date: November 9, 2023
    Applicant: National University of Singapore
    Inventors: Huilin Shao, Yuan Chen, Rui Yuan Nicholas Ho
  • Patent number: 11810896
    Abstract: A method and apparatus for substrate component layout and bonding for increased package capacity. According to certain embodiments, a wire-bonding finger strip is disposed between a flip-chip die and a NAND die stack to reduce a keep out zone (KOZ) required for an underfill material dispensed beneath the flip-chip die. To further inhibit the flow of the underfill material and further reduce the KOZ, a solder mask may be placed adjacent to the flip-chip. According to certain embodiments, there may be at least three sides of the flip-chip that may have such an adjacent solder mask placement. The three sides of the flip-chip according to such embodiments may be those non-adjacent to the wire-bonding finger strip.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: November 7, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jiandi Du, Zengyu Zhou, Rui Yuan, Fen Yu, Hope Chiu
  • Publication number: 20230299034
    Abstract: A semiconductor device package includes a semiconductor die including bond pads and an underfill inlet side, a substrate including a first metal layer and lower metal layers underneath the first metal layer, a plurality of metal contacts and trace segment lines disposed in the first metal layer, and a plurality of solder bump rows. Each of the solder bump rows is oriented substantially parallel to the inlet side of the semiconductor die and electrically connects bond pads of the semiconductor die with corresponding metal contacts in the first metal layer of the substrate. Each of the trace segment lines is oriented substantially parallel to the inlet side of the semiconductor die, is electrically coupled to a respective solder bump row of the plurality of solder bump rows, and includes trace segments disposed in the first metal layer and trace segments disposed in one or more of the lower metal layers.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Applicant: Western Digital Technologies, Inc.
    Inventors: Yihao Chen, Tim Huang, Zengyu Zhou, Rui Yuan, Fen Yu, Hope Chiu
  • Publication number: 20230159990
    Abstract: The present invention relates to signalling catalytic nucleic acid nanostructures that are responsive to polymerase activity, methods of their use, devices and kits comprising the same. More specifically, the present invention provides a catalytic signalling nanostructure comprising a DNAzyme/RNAzyme, such as G-quadruplex hemin, and a polymerase—responsive element. Polymerase elongation of the polymerase-responsive element eliminates catalytic activity of the DNAzyme/RNAzyme. The catalytic nucleic acid nanostructure can be used alone or paired with a target recognition nanostructure which can transduce molecular signals into polymerase activity, in an integrated circuit.
    Type: Application
    Filed: April 7, 2021
    Publication date: May 25, 2023
    Applicants: National University of Singapore, Agency for Science, Technology and Research
    Inventors: Huilin Shao, Yuan Chen, Noah Riandiputra Sundah, Rui Yuan Nicholas Ho
  • Patent number: 11645233
    Abstract: Embodiments of the present invention relate to methods, systems, and computer program products for file management in a distributed file cache system. In some embodiments, a method is disclosed. According to the method, responsive to determining that at least one client node is obtaining a file of a first version stored at a storage node, one or more processors generate contact information indicating that the file of the first version is accessible from the storage node and the at least one client node and recorded the contact information into a distributed hash table. The storage node and the at least one client node are included in a plurality of nodes associated with the distributed hash table. Further, one or more processors generate first version information indicating that the file is of the first version and record the first version information into a blockchain associated with the plurality of nodes.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 9, 2023
    Assignee: International Business Machines Corporation
    Inventors: Cheng Yong Zhao, Jia Min Li, Zhong Shi Lu, Ze Rui Yuan, Yan Liang Qiao
  • Publication number: 20230100948
    Abstract: The present disclosure provides a preparation method of a monometallic or bimetallic nanoparticle-supported catalyst. The synthesis of metal nanoparticles with different shapes, sizes, and atomic structures is affected by nucleation and growth rates. In the present disclosure, by changing a ratio of strong and weak reducing agents, a suitable double reducing agent is provided for metal nanoparticles with different reduction potentials, where the strong reducing agent is used for rapid nucleation and the weak reducing agent is used for the growth of metal nanoparticles. Accordingly, modulation and control of the nucleation and growth rates can be realized during the synthesis of nanoparticles.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 30, 2023
    Inventors: Wei HU, Yaoqiang CHEN, Rui YUAN, Dan ZHANG
  • Patent number: 11566112
    Abstract: A high-performance triple-crosslinked polymer and a preparation method thereof are provided. The polymer is obtained by curing and cross-linking a monomer having two epoxy groups, a cross-linking monomer and a functional monomer. The polymer contains a cross-linking network formed by covalent bonds and two types of multi-level hydrogen bonds with different strengths. The interaction strength between the covalent bonds and the two types of hydrogen bonds decreases in a gradient. The dilemma of the strength-ductility tradeoff in a high-performance polymer is overcome by forming a triple-crosslinked network with covalent bonds and multi-level hydrogen bonds with different strengths in the polymer. The dynamic and hierarchical hydrogen bonds are broken and recombined timely and continuously to concurrently maintain the complete structure of the polymer network and enable the polymer network to quickly respond to the transmission and dissipation of the external environment.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: January 31, 2023
    Assignees: Southwest University of Science and Technology, Sichuan Guanmusiyang New Material Technology Co., Ltd.
    Inventors: Guanjun Chang, Li Yang, Yewei Xu, Baoxuan Chang, Shien Yang, Rui Yuan
  • Publication number: 20220375896
    Abstract: A method and apparatus for substrate component layout and bonding for increased package capacity. According to certain embodiments, a wire-bonding finger strip is disposed between a flip-chip die and a NAND die stack to reduce a keep out zone (KOZ) required for an underfill material dispensed beneath the flip-chip die. To further inhibit the flow of the underfill material and further reduce the KOZ, a solder mask may be placed adjacent to the flip-chip. According to certain embodiments, there may be at least three sides of the flip-chip that may have such an adjacent solder mask placement. The three sides of the flip-chip according to such embodiments may be those non-adjacent to the wire-bonding finger strip.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 24, 2022
    Inventors: Jiandi DU, Zengyu ZHOU, Rui YUAN, Fen YU, Hope CHIU
  • Patent number: 11493333
    Abstract: Some embodiments of the disclosure provide a flatness detection device. In an embodiment, the flatness detection device includes a back plate, an electromagnet, a cross beam, a probe, and a limiting frame. The limiting frame and the electromagnet are provided side by side on the back plate. The cross beam is located above the limiting frame and the electromagnet. The probe vertically penetrates the cross beam and the limiting frame. A spring is provided between the cross beam and the electromagnet. The spring is movable in a vertical direction by a guide, the movement being at least one of compression and extension.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: November 8, 2022
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Xi Cao, Hua Feng, Jianzhe Li, Jinjing Zhang, Wangping Long, Xiaoyu Wu, Zhongwei Yu, Xingpeng Fan, Rui Yuan, Huan Liu
  • Publication number: 20220350035
    Abstract: Embodiments of this application provide a positioning method and apparatus. The method may include setting an ambiguity adjustment parameter for a mobile device, where the ambiguity adjustment parameter is used to record an ambiguity change status used to determine a virtual station observation value for the mobile device. The method may also include adjusting an observation value of a first primary datum station based on a first ambiguity adjustment parameter of the mobile device in a first serving cell to generate a first virtual station observation value, where the first primary datum station is a primary datum station of the first serving cell, and the first virtual station observation value is used to position the mobile device in the first serving cell; and sending the first virtual station observation value to the mobile device.
    Type: Application
    Filed: June 10, 2022
    Publication date: November 3, 2022
    Inventors: Jingsong Huang, Rui Yuan, Yangbo Lin, Yi Zhang