Patents by Inventor Rui YUan

Rui YUan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220093559
    Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 24, 2022
    Applicant: Western Digital Technologies, Inc.
    Inventors: Kevin Du, Hope Chiu, Zengyu Zhou, Alex Zhang, Vincent Jiang, Shixing Zhu, Paul Qu, Yi Su, Rui Yuan
  • Patent number: 11257706
    Abstract: Embodiments of apparatus for flipping a semiconductor device and method of using the same are disclosed. In an example, an apparatus for flipping a semiconductor device includes at least one fixture and a rotation unit connected to the at least one fixture. The at least one fixture is configured to hold the semiconductor device by simultaneously pressing a first surface and a second surface of the semiconductor device. The first surface is opposite to the second surface. The rotation unit is configured to rotate the at least one fixture to flip the semiconductor device held by the at least one fixture.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: February 22, 2022
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Mengyong Liu, Tao Tao Ding, Wu Liu, Rui Yuan Xing, Guoliang Chen
  • Publication number: 20210253805
    Abstract: A high-performance triple-crosslinked polymer and a preparation method thereof are provided. The polymer is obtained by curing and cross-linking a monomer having two epoxy groups, a cross-linking monomer and a functional monomer. The polymer contains a cross-linking network formed by covalent bonds and two types of multi-level hydrogen bonds with different strengths. The interaction strength between the covalent bonds and the two types of hydrogen bonds decreases in a gradient. The dilemma of the strength-ductility tradeoff in a high-performance polymer is overcome by forming a triple-crosslinked network with covalent bonds and multi-level hydrogen bonds with different strengths in the polymer. The dynamic and hierarchical hydrogen bonds are broken and recombined timely and continuously to concurrently maintain the complete structure of the polymer network and enable the polymer network to quickly respond to the transmission and dissipation of the external environment.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 19, 2021
    Applicants: Southwest University of Science and Technology, Sichuan Guanmusiyang New Material Technology Co., Ltd.
    Inventors: Guanjun Chang, Li Yang, Yewei Xu, Baoxuan Chang, Shien Yang, Rui Yuan
  • Patent number: 11059218
    Abstract: A method for adjusting height of a 3d printer nozzle. In an embodiment, the method uses a fully wavy line as a reference line. The method includes the following steps. Determining an initial value of a height difference between the nozzle and a bottom of a probe by using a feeler gauge. Moving the nozzle vertically to adjust the height based on the initial value, obtaining a printing height of a first line, and printing the first line. Determining whether the first line is a fully wavy line. Adjusting the height of the nozzle for N times according to a preset step value, and printing N lines with corresponding heights. Determining whether the N lines have a fully wavy line. Calculating the height difference between the nozzle and the bottom of the probe by an equation. Adjusting the height of the nozzle.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: July 13, 2021
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Xi Cao, Hua Feng, Jianzhe Li, Jinjing Zhang, Wangping Long, Xiaoyu Wu, Zhongwei Yu, Xinpeng Fan, Rui Yuan, Huan Liu
  • Publication number: 20210172734
    Abstract: Some embodiments of the disclosure provide a flatness detection device. In an embodiment, the flatness detection device includes a back plate, an electromagnet, a cross beam, a probe, and a limiting frame. The limiting frame and the electromagnet are provided side by side on the back plate. The cross beam is located above the limiting frame and the electromagnet. The probe vertically penetrates the cross beam and the limiting frame. A spring is provided between the cross beam and the electromagnet. The spring is movable in a vertical direction by a guide, the movement being at least one of compression and extension.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 10, 2021
    Inventors: Xi CAO, Hua FENG, Jianzhe LI, Jinjing ZHANG, Wangping LONG, Xiaoyu WU, Zhongwei YU, Xingpeng FAN, Rui YUAN, Huan LIU
  • Publication number: 20210130870
    Abstract: The present invention provides methods and devices for specific detection of nucleic acids using an integrated circuit of two independent enzyme-DNA nanostructures—an easily adjustable recognition element and a sensitive universal signaling element—to decouple target recognition and visual signal amplification. The recognition element comprises a DNA polymerase enzyme, a DNA polymerase enzyme-specific DNA aptamer and an inverter oligonucleotide. In the presence of a target nucleic acid, the inverter oligonucleotide binds to the target nucleic acid and releases the DNA polymerase enzyme from inhibition by the DNA aptamer.
    Type: Application
    Filed: July 2, 2019
    Publication date: May 6, 2021
    Applicants: National University of Singapore, Agency for Science, Technology and Research
    Inventors: Huilin SHAO, Nicholas Rui Yuan HO
  • Publication number: 20210026808
    Abstract: Embodiments of the present invention relate to methods, systems, and computer program products for file management in a distributed file cache system. In some embodiments, a method is disclosed. According to the method, responsive to determining that at least one client node is obtaining a file of a first version stored at a storage node, one or more processors generate contact information indicating that the file of the first version is accessible from the storage node and the at least one client node and recorded the contact information into a distributed hash table. The storage node and the at least one client node are included in a plurality of nodes associated with the distributed hash table. Further, one or more processors generate first version information indicating that the file is of the first version and record the first version information into a blockchain associated with the plurality of nodes.
    Type: Application
    Filed: July 26, 2019
    Publication date: January 28, 2021
    Inventors: Cheng Yong Zhao, Jia Min Li, Zhong Shi Lu, Ze Rui Yuan, Yan Liang Qiao
  • Patent number: 10834660
    Abstract: Embodiments of this application disclose a method for updating a network RTK reference station network including: if there is a newly added node in a current reference station network, determining a position relationship between the newly added node and each node in the current reference station network; determining N target nodes in the current reference station network according to a preset rule based on the position relationship; determining, based on the N target nodes, M nodes connected to each of the N target nodes, where the M nodes belong to the current reference station network; and performing network construction on the M nodes and the newly added node according to a Delaunay triangulated network construction rule. According to the method for updating a network RTK reference station network, fast networking can be implemented and efficiency can be improved.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: November 10, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jingsong Huang, Rui Yuan, Yi Zhang
  • Patent number: 10790260
    Abstract: Embodiments of wafer bonding methods are disclosed. In an example, a first plasma activation treatment based on oxygen or an inert gas is performed on a front surface of a first wafer and a front surface of a second wafer. After the first plasma activation treatment, a second plasma activation treatment based on water molecules is performed on the front surface of the first wafer and the front surface of the second wafer. After the second plasma activation treatment, the first wafer and the second wafer are bonded such that the treated front surface of the first wafer is in physical contact with the treated front surface of the second wafer.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: September 29, 2020
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Mengyong Liu, Tao Tao Ding, Wu Liu, Rui Yuan Xing, Guoliang Chen
  • Patent number: 10760455
    Abstract: A poppet valve has an elongated stem that is configured to extend along a longitudinal axis. The poppet valve further includes a valve body that is disposed laterally with respect to the longitudinal axis and located in a spaced apart relation with an end of the elongated stem. The valve body has a pair of opposing faces disposed co-axial with the longitudinal axis of the elongated stem. The poppet valve also includes at least two arcuately shaped appendages depending downwardly from the end of the elongated stem and extending away from the longitudinal axis of the elongated stem. An end of each appendage is disposed in abutment with an annular region defined on one of the opposing faces of the valve body, a perimeter of the annular region being larger than a perimeter of the elongated stem measured about the longitudinal axis.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: September 1, 2020
    Assignee: Caterpillar Inc.
    Inventors: Mark D. Veliz, Rong Qu, Arun Lal Gain, Walter Sherman Isenberg, Rui Yuan, Thierry Andre Marchione
  • Publication number: 20200273706
    Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 27, 2020
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Shuai GUO, Jia Wen WANG, Tao Tao DING, Rui Yuan XING, Xiao Jin WANG, Jia You WANG, Chun Long LI
  • Publication number: 20200212004
    Abstract: Embodiments of wafer bonding methods are disclosed. In an example, a first plasma activation treatment based on oxygen or an inert gas is performed on a front surface of a first wafer and a front surface of a second wafer. After the first plasma activation treatment, a second plasma activation treatment based on water molecules is performed on the front surface of the first wafer and the front surface of the second wafer. After the second plasma activation treatment, the first wafer and the second wafer are bonded such that the treated front surface of the first wafer is in physical contact with the treated front surface of the second wafer.
    Type: Application
    Filed: March 15, 2019
    Publication date: July 2, 2020
    Inventors: Mengyong Liu, Tao Tao Ding, Wu Liu, Rui Yuan Xing, Guoliang Chen
  • Patent number: 10679854
    Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: June 9, 2020
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Shuai Guo, Jia Wen Wang, Tao Tao Ding, Rui Yuan Xing, Xiao Jin Wang, Jia You Wang, Chun Long Li
  • Publication number: 20200126838
    Abstract: Embodiments of apparatus for flipping a semiconductor device and method of using the same are disclosed. In an example, an apparatus for flipping a semiconductor device includes at least one fixture and a rotation unit connected to the at least one fixture. The at least one fixture is configured to hold the semiconductor device by simultaneously pressing a first surface and a second surface of the semiconductor device. The first surface is opposite to the second surface. The rotation unit is configured to rotate the at least one fixture to flip the semiconductor device held by the at least one fixture.
    Type: Application
    Filed: December 5, 2018
    Publication date: April 23, 2020
    Inventors: Mengyong Liu, Tao Tao Ding, Wu Liu, Rui Yuan Xing, Guoliang Chen
  • Publication number: 20190324155
    Abstract: Embodiments of this application provide a positioning method and apparatus. The method may include setting an ambiguity adjustment parameter for a mobile device, where the ambiguity adjustment parameter is used to record an ambiguity change status used to determine a virtual station observation value for the mobile device. The method may also include adjusting an observation value of a first primary datum station based on a first ambiguity adjustment parameter of the mobile device in a first serving cell to generate a first virtual station observation value, where the first primary datum station is a primary datum station of the first serving cell, and the first virtual station observation value is used to position the mobile device in the first serving cell; and sending the first virtual station observation value to the mobile device.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 24, 2019
    Inventors: Jingsong HUANG, Rui YUAN, Yangbo LIN, Yi ZHANG
  • Publication number: 20190166542
    Abstract: Embodiments of this application disclose a method for updating a network RTK reference station network including: if there is a newly added node in a current reference station network, determining a position relationship between the newly added node and each node in the current reference station network; determining N target nodes in the current reference station network according to a preset rule based on the position relationship; determining, based on the N target nodes, M nodes connected to each of the N target nodes, where the M nodes belong to the current reference station network; and performing network construction on the M nodes and the newly added node according to a Delaunay triangulated network construction rule. According to the method for updating a network RTK reference station network, fast networking can be implemented and efficiency can be improved.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jinsong HUANG, Rui YUAN, Yi ZHANG
  • Publication number: 20190051524
    Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 14, 2019
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Shuai GUO, Jia Wen WANG, Tao Tao DING, Rui Yuan XING, Xiao Jin WANG, Jia You WANG, Chun Long LI
  • Publication number: 20180171837
    Abstract: A poppet valve has an elongated stem that is configured to extend along a longitudinal axis. The poppet valve further includes a valve body that is disposed laterally with respect to the longitudinal axis and located in a spaced apart relation with an end of the elongated stem. The valve body has a pair of opposing faces disposed co-axial with the longitudinal axis of the elongated stem. The poppet valve also includes at least two arcuately shaped appendages depending downwardly from the end of the elongated stem and extending away from the longitudinal axis of the elongated stem. An end of each appendage is disposed in abutment with an annular region defined on one of the opposing faces of the valve body, a perimeter of the annular region being larger than a perimeter of the elongated stem measured about the longitudinal axis.
    Type: Application
    Filed: December 20, 2016
    Publication date: June 21, 2018
    Applicant: Caterpillar Inc.
    Inventors: Mark D. Veliz, Rong Qu, Arun Lai Gain, Walter Sherman Isenberg, Rui YUan, Thierry Andre Marchione
  • Patent number: D706387
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: June 3, 2014
    Assignee: Dart Industries Inc.
    Inventors: Rui Yuan Chen, Alexander Muspratt-Williams
  • Patent number: D736346
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: August 11, 2015
    Assignee: Dart Industries Inc.
    Inventors: Rui Yuan Chen, Alexander Muspratt-Williams