Abstract: Various embodiments disclosed relate to a method of structured analysis management using a data drive software tool.

Abstract: Various embodiments disclosed relate to an automated dynamic reminder tool for project management. The present disclosure includes a method of receiving an indication of a task to be worked on, the task to be worked on associated with a deadline, a party responsible for the deadline, and a cost associated with the deadline, wherein the cost is related to an expense incurred for extending the deadline; determining, based on the task and the deadline, at least one or more reminders associated with the task to be worked on; prioritizing the one or more reminders associated with the task to be worked on based on one or more of the deadline, the party responsible, and the cost associated with the task to be worked on; displaying, on a user interface at least one of the one or more prioritized reminders; and dynamically updating the one or more reminders based on the party responsible for the deadline and the cost associated with the deadline.

Abstract: A system is described that a geospatial coordinate component arranged to identify a set of geospatial coordinates from a geospatial dataset. A temporal coordinate component is arranged to identify a set of temporal coordinates from a temporal dataset. The system includes an article query component that is arranged to determine a set of articles based on the set of geospatial coordinates and the set of temporal coordinates. A presentation component is arranged to present a representation of a member of the set of articles. The geospatial coordinate component can receive a user selected geographical area and intersect the geospatial dataset with the geographical area.

Abstract: A system is described that a geospatial coordinate component arranged to identify a set of geospatial coordinates from a geospatial dataset. A temporal coordinate component is arranged to identify a set of temporal coordinates from a temporal dataset. The system includes an article query component that is arranged to determine a set of articles based on the set of geospatial coordinates and the set of temporal coordinates. A presentation component is arranged to present a representation of a member of the set of articles. The geospatial coordinate component can receive a user selected geographical area and intersect the geospatial dataset with the geographical area.

Abstract: A system is described that a geospatial coordinate component arranged to identify a set of geospatial coordinates from a geospatial dataset. A temporal coordinate component is arranged to identify a set of temporal coordinates from a temporal dataset. The system includes an article query component that is arranged to determine a set of articles based on the set of geospatial coordinates and the set of temporal coordinates. A presentation component is arranged to present a representation of a member of the set of articles. The geospatial coordinate component can receive a user selected geographical area and intersect the geospatial dataset with the geographical area.

Abstract: A system is described that a geospatial coordinate component arranged to identify a set of geospatial coordinates from a geospatial dataset. A temporal coordinate component is arranged to identify a set of temporal coordinates from a temporal dataset. The system includes an article query component that is arranged to determine a set of articles based on the set of geospatial coordinates and the set of temporal coordinates. A presentation component is arranged to present a representation of a member of the set of articles. The geospatial coordinate component can receive a user selected geographical area and intersect the geospatial dataset with the geographical area.

Abstract: Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.

Abstract: Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.

Abstract: Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.

Abstract: Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.

Abstract: Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.

Abstract: A patent application management system maintains a database of references for numerous patent applications. The system copies reference information from an originating application to related patent applications. To reduce the possibility that references are not properly cited to a patent office, the system automatically enters a docket entry to schedule a review of the references and prepare a citation document. The docket is then viewable by a patent practitioner to provide a reminder of the pending task.

Abstract: A video game system is described which includes a wireless game controller which stores information about the user of the controller. The controller includes a memory for storing the information. The information is communicated through wireless transmissions to a processor which can operate a video game. The personalized information can include, for example, the user's name, skill level, preferred characters, handicaps, limitations, and/or historical game scores. The game controllers can include a wireless receiver for receiving communications from the processor to update information stored in the controller. Several different communication operations and protocols are described, including storing a user identification code in the controller with corresponding detailed information stored in the processor, or storing detailed information in the hand held controller and down loading the information to the processor.