Abstract: An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: By mapping leaf nodes of a spatial index to processing elements, efficient distribution of workload in an image processing system may be achieved. In addition, processing elements may use a thread table to redistribute workload from processing elements which are experiencing an increased workload to processing elements which may be idle. Furthermore, the workload experienced by processing elements may be monitored in order to determine if workload is balanced. Periodically the leaf nodes for which processing elements are responsible may be remapped in response to a detected imbalance in workload. By monitoring the workload experienced by the processing elements and remapping leaf nodes to different processing elements in response to unbalanced workload, efficient distribution of workload may be maintained. Efficient distribution of workload may improve the performance of the image processing system.

Abstract: A circuit arrangement, program product and circuit arrangement render stereoscopic images in a multithreaded rendering software pipeline using first and second rendering channels respectively configured to render left and right views for the stereoscopic image. Separate transformations are applied to received vertex data to generate transformed vertex data for use by each of the first and second rendering channels in rendering the left and right views for the stereoscopic image.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: A method and apparatus for processing vector data is provided. A processing core may have a data cache and a relatively smaller vector data cache. The vector data cache may be optimally sized to store vector data structures that are smaller than full data cache lines.

Abstract: A circuit arrangement and method in one aspect utilize thermal-only through vias, extending between the opposing faces of stacked semiconductor dies, to increase the thermal conductivity of a multi-layer semiconductor stack. The thermal vias are provided in addition to data-carrying through vias, which communicate data signals between circuit layers, and power-carrying through vias, which are coupled to a power distribution network for the circuit layers, such that the thermal conductivity is increased above that which may be provided by the data-carrying and power-carrying through vias in the stack. A circuit arrangement and method in another aspect organize the circuit layers in a multi-layer semiconductor stack based upon current density so as to reduce power distribution losses in the stack.

Abstract: An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: A circuit arrangement and method utilize a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: According to embodiments of the invention, a data structure may be created which may be used by both a ray tracing unit and by a rendering engine. The data structure may have an initial or upper portion representing bounding volumes which partition a three-dimensional scene and a second or lower portion representing objects within the three-dimensional scene. The integrated acceleration data structure may be used by a rendering engine to render a two-dimensional image from a three-dimensional scene, and by a ray tracing unit to perform intersection tests.

Abstract: According to one embodiment of the invention, by increasing the number of rays issued through adjacent pixels with colors of high contrast while maintaining the number of rays issued through adjacent pixels which do not have colors of high contrast, a ray tracing image processing system may render an anti-aliased image while minimizing the increase in workload experienced by the image processing system. Additionally, according to another embodiment of the invention, by maintaining the number of rays issued through adjacent pixels which have colors of low contrast while increasing the number of rays issued through adjacent pixels which do not have colors of low contrast, the image processing system may reduce workload experienced while performing ray tracing while maintaining the quality of the rendered image.

Abstract: According to one embodiment of the invention, by increasing the number of rays issued through adjacent pixels with colors of high contrast while maintaining the number of rays issued through adjacent pixels which do not have colors of high contrast, a ray tracing image processing system may render an anti-aliased image while minimizing the increase in workload experienced by the image processing system. Additionally, according to another embodiment of the invention, by maintaining the number of rays issued through adjacent pixels which have colors of low contrast while increasing the number of rays issued through adjacent pixels which do not have colors of low contrast, the image processing system may reduce workload experienced while performing ray tracing while maintaining the quality of the rendered image.

Abstract: According to embodiments of the invention, secondary rays may be pooled after they are generated by a vector throughput engine. After pooling the secondary rays, they may be reordered according to similarities in trajectory and originating location. The secondary rays may be sent in the new order to a workload manager for spatial index traversal. The reordering of the secondary rays may cause rays which traverse similar portions of the spatial index to be traversed immediately following (or shortly thereafter) one another. Consequently, the necessary portions of the spatial index may remain within the workload manager's memory cache, thereby reducing the number of cache misses and the amount of time necessary to traverse secondary rays through the spatial index. The reduction in time necessary to traverse the secondary rays through the spatial index may improve the overall performance of the image processing system.

Abstract: An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: According to embodiments of the invention, a normally recursive ray tracing algorithm may be partitioned to form an iterative ray tracing algorithm. The resulting portions of the iterative ray tracing algorithm may be executed by a plurality of processing elements. Furthermore, according to embodiments of the invention, a network of inboxes may be used to transfer information which defines original rays and secondary rays (information unlikely to be reused for subsequently issued rays and subsequently rendered frames) between processing elements, and a shared memory cache may store information relating to a three dimensional scene (information likely to be reused for subsequently issued rays and subsequently rendered frames). Using a plurality of processing elements to perform ray tracing and storing information in the shared memory cache which is likely to be reused for subsequent rays and subsequent frames, the performance of a ray tracing image processing system may be improved.

Abstract: According to embodiments of the invention, rays may be stochastically culled before they are issued into the three-dimensional scene. Stochastically culling rays may reduce the number of rays which need to be traced by the image processing system. Furthermore, by stochastically culling rays before they are issued into the three-dimensional scene, minor imperfections may be added to the final rendered image, thereby improving the realism of the rendered image. Therefore, stochastic culling of rays may improve the performance of the image processing system by reducing workload imposed on the image processing system and improving the realism of the images rendered by the image processing system. According to another embodiment of the invention, the realism of images rendered by the image processing system may also be improved by stochastically adding secondary rays after ray-primitive intersections have occurred.

Abstract: According to embodiments of the invention, rays may be stochastically culled before they are issued into the three-dimensional scene. Stochastically culling rays may reduce the number of rays which need to be traced by the image processing system. Furthermore, by stochastically culling rays before they are issued into the three-dimensional scene, minor imperfections may be added to the final rendered image, thereby improving the realism of the rendered image. Therefore, stochastic culling of rays may improve the performance of the image processing system by reducing workload imposed on the image processing system and improving the realism of the images rendered by the image processing system. According to another embodiment of the invention, the realism of images rendered by the image processing system may also be improved by stochastically adding secondary rays after ray-primitive intersections have occurred.