Abstract: A disposable dual chamber dispenser that contains separate products until a time of use. The disposable dual chamber dispenser includes an outer dispenser encapsulating an inner dispenser, where the outer dispenser is compliant and the inner dispenser is substantially less compliant than the outer dispenser and configured to break at a failure zone. The outer dispenser may be formed of a single material that is suitable for a blow-fill-seal process and the inner dispenser may be formed of another single material, different than the single material forming the outer dispenser, that is also suitable for a blow-fill-seal process.

Abstract: A system, method and apparatus for tracking the parking behavior of a vehicle. In one embodiment, the apparatus may comprise a circuit located within the vehicle, the circuit comprising a processor, movement detection means, location identification means, a memory, a transceiver, and a timer operably coupled together; wherein for each occurrence in which the movement detection means detects that the vehicle has entered into the parked state, the circuit is configured to: (1) measure at duration that the vehicle remains in the parked state; (2) identify the geographic location of the vehicle; (3) detect whether the vehicle transitions into the non-parked state from the parked state; (4) upon the duration exceeding a predetermined minimum time threshold, storing parking information data relating to the occurrence in the memory as a parking instance; and (5) upon the duration failing to exceed the predetermined minimum time threshold, discarding the parking information data.

Abstract: A disposable dual chamber dispenser that contains separate products until a time of use. The disposable dual chamber dispenser includes an outer dispenser encapsulating an inner dispenser, where the outer dispenser is compliant and the inner dispenser is substantially less compliant than the outer dispenser and configured to break at a failure zone. The outer dispenser may be formed of a single material that is suitable for a blow-fill-seal process and the inner dispenser may be formed of another single material, different than the single material forming the outer dispenser, that is also suitable for a blow-fill-seal process.

Abstract: A method for integrating a resource in a network includes receiving at a first adapter a command associated with a function to be performed by a resource. The method also includes receiving a first script associated with the command, and interpreting the first script to produce one or more first byte codes. The method further includes causing a second adapter to receive a second script. The second adapter is operable to interpret the second script into one or more second byte codes. In addition, the method includes executing the one or more first byte codes, and invoking execution of the one or more second byte codes at the second adapter. The execution of the byte codes at the first and second adapters is operable to invoke the function in and facilitate communication with the resource.

Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.

Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.

Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.