Patents by Inventor Ryan Hooper
Ryan Hooper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11823968Abstract: A semiconductor device package having stress isolation is provided. The semiconductor device package includes a package substrate and a sensor attached to the package substrate. A first isolation material is formed around a perimeter of the sensor. An encapsulant encapsulates at least a portion of the first isolation material and the package substrate.Type: GrantFiled: August 27, 2020Date of Patent: November 21, 2023Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Scott M. Hayes, Stephen Ryan Hooper
-
Publication number: 20230343683Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.Type: ApplicationFiled: April 26, 2022Publication date: October 26, 2023Inventors: Stephen Ryan Hooper, Chanon Suwankasab, Chayathorn Saklang, Crispulo Estira Lictao, JR., Amornthep Saiyajitara, Dominic (PohMeng) Koey
-
Patent number: 11760623Abstract: A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.Type: GrantFiled: October 11, 2022Date of Patent: September 19, 2023Assignee: NXP USA, INC.Inventors: Stephen Ryan Hooper, Mark Edward Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry
-
Publication number: 20230059566Abstract: A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.Type: ApplicationFiled: October 11, 2022Publication date: February 23, 2023Inventors: Stephen Ryan Hooper, Mark Edward Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry
-
Patent number: 11498829Abstract: A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.Type: GrantFiled: January 16, 2020Date of Patent: November 15, 2022Assignee: NXP USA, INC.Inventors: Stephen Ryan Hooper, Mark Edward Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry
-
Publication number: 20220348456Abstract: A device package includes a die that includes a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface. A trench extends entirely through the substrate between the first and second surfaces, in which the trench at least partially surrounds the sensor region. An isolation material, formed at the first surface, may extend across the trench A ring structure is coupled to the first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench. A molded compound body may abut an outer wall of the ring structure. The molded compound body has a second cavity that is concentric with the first cavity to enable fluid communication between the sensor and an environment external to the device package.Type: ApplicationFiled: May 3, 2021Publication date: November 3, 2022Inventors: Chad Dawson, Mark Edward Schlarmann, Stephen Ryan Hooper, Colin Bryant Stevens
-
Patent number: 11482478Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.Type: GrantFiled: July 23, 2020Date of Patent: October 25, 2022Assignee: NXP B.V.Inventors: Crispulo Estira Lictao, Jr., Chayathorn Saklang, Amornthep Saiyajitara, Chanon Suwankasab, Stephen Ryan Hooper, Bernd Offermann
-
Patent number: 11335652Abstract: A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.Type: GrantFiled: July 29, 2019Date of Patent: May 17, 2022Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Stephen Ryan Hooper
-
Publication number: 20220068738Abstract: A semiconductor device package having stress isolation is provided. The semiconductor device package includes a package substrate and a sensor attached to the package substrate. A first isolation material is formed around a perimeter of the sensor. An encapsulant encapsulates at least a portion of the first isolation material and the package substrate.Type: ApplicationFiled: August 27, 2020Publication date: March 3, 2022Inventors: Michael B. Vincent, Scott M. Hayes, Stephen Ryan Hooper
-
Publication number: 20220033999Abstract: The disclosed materials, methods, and apparatus, provide novel ultra-high temperature materials (UHTM) in fibrous forms/structures; such “fibrous materials” can take various forms, such as individual filaments, short-shaped fiber, tows, ropes, wools, textiles, lattices, nano/microstructures, mesostructured materials, and sponge-like materials. At least four important classes of UHTM materials are disclosed in this invention: (1) carbon, doped-carbon and carbon alloy materials, (2) materials within the boron-carbon-nitride-X system, (3) materials within the silicon-carbon-nitride-X system, and (4) highly-refractory materials within the tantalum-hafnium-carbon-nitride-X and tantalum-hafnium-carbon-boron-nitride-X system. All of these material classes offer compounds/mixtures that melt or sublime at temperatures above 1800° C.—and in some cases are among the highest melting point materials known (exceeding 3000° C.).Type: ApplicationFiled: October 19, 2021Publication date: February 3, 2022Inventors: James L. Maxwell, Nicholas Webb, Ryan Hooper, James Allen
-
Publication number: 20220028766Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.Type: ApplicationFiled: July 23, 2020Publication date: January 27, 2022Inventors: Crispulo Estira Lictao, JR., Chayathorn Saklang, Amornthep Saiyajitara, Chanon Suwankasab, Stephen Ryan Hooper, Bernd Offermann
-
Patent number: 11127645Abstract: A semiconductor device includes a substrate, an IC die mounted on the substrate, packaging encapsulant on the substrate, a cavity in the packaging encapsulant, a conductive lid attached to the packaging encapsulant over the IC die, an electrical ground path in the substrate, and a first conductive structure in the cavity. The first conductive structure includes a first end electrically coupled to the conductive lid and a second end electrically coupled to the electrical ground path.Type: GrantFiled: June 19, 2019Date of Patent: September 21, 2021Assignee: NXP USA, Inc.Inventors: Dwight Lee Daniels, Stephen Ryan Hooper, Michael B. Vincent
-
Publication number: 20210221671Abstract: A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.Type: ApplicationFiled: January 16, 2020Publication date: July 22, 2021Inventors: Stephen Ryan Hooper, Mark Edward Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry
-
Patent number: 11031681Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.Type: GrantFiled: June 20, 2019Date of Patent: June 8, 2021Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Stephen Ryan Hooper, Pascal Oberndorff, Walter Parmon
-
Publication number: 20210035927Abstract: A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.Type: ApplicationFiled: July 29, 2019Publication date: February 4, 2021Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Stephen Ryan Hooper
-
Patent number: 10892229Abstract: Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.Type: GrantFiled: April 5, 2019Date of Patent: January 12, 2021Assignee: NXP USA, INC.Inventors: Stephen Ryan Hooper, Dwight Lee Daniels, Thomas Cobb Speight, Gary Carl Johnson
-
Publication number: 20200402878Abstract: A semiconductor device includes a substrate, an IC die mounted on the substrate, packaging encapsulant on the substrate, a cavity in the packaging encapsulant, a conductive lid attached to the packaging encapsulant over the IC die, an electrical ground path in the substrate, and a first conductive structure in the cavity. The first conductive structure includes a first end electrically coupled to the conductive lid and a second end electrically coupled to the electrical ground path.Type: ApplicationFiled: June 19, 2019Publication date: December 24, 2020Inventors: Dwight Lee DANIELS, Stephen Ryan HOOPER, Michael B. VINCENT
-
Publication number: 20200403298Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.Type: ApplicationFiled: June 20, 2019Publication date: December 24, 2020Inventors: Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Stephen Ryan Hooper, Pascal Oberndorff, Walter Parmon
-
Publication number: 20200321286Abstract: Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.Type: ApplicationFiled: April 5, 2019Publication date: October 8, 2020Inventors: Stephen Ryan Hooper, Dwight Lee Daniels, Thomas Cobb Speight, Gary Carl Johnson
-
Patent number: 10790220Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.Type: GrantFiled: October 18, 2018Date of Patent: September 29, 2020Assignee: NXP B.V.Inventors: Chayathorn Saklang, Stephen Ryan Hooper, Chanon Suwankasab, Amornthep Saiyajitara, Bernd Offermann, James Lee Grothe, Russell Joseph Lynch