Abstract: A packaged semiconductor device includes: a substrate; an semiconductor die attached to a top surface of the substrate; a mold body surrounding the semiconductor die; a tiered through mold via (TMV) comprising: a first recess having a recessed surface within the mold body at a first depth, and a second recess from the recessed surface to a second depth that exposes a ground contact area on a bonding area on the top surface of the substrate, wherein the first depth is greater than the second depth; and a metal shielding layer formed on a top surface of the mold body to form a shielded mold body, wherein the metal shielding layer makes direct contact with at least one sidewall of the first recess, with at least a portion of the recessed surface, with at least one sidewall of the second recess, and with the ground contact area.

Abstract: A packaged semiconductor device includes: a substrate; an semiconductor die attached to a top surface of the substrate; a mold body surrounding the semiconductor die; a tiered through mold via (TMV) comprising: a first recess having a recessed surface within the mold body at a first depth, and a second recess from the recessed surface to a second depth that exposes a ground contact area on a bonding area on the top surface of the substrate, wherein the first depth is greater than the second depth; and a metal shielding layer formed on a top surface of the mold body to form a shielded mold body, wherein the metal shielding layer makes direct contact with at least one sidewall of the first recess, with at least a portion of the recessed surface, with at least one sidewall of the second recess, and with the ground contact area.

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

Abstract: Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.

Abstract: A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

Abstract: Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.

Abstract: A method of testing includes attaching a first and second die to first and second die sites of a lead frame and forming a plurality of wire bonds coupling a plurality of pins of the first die site to the first die and a plurality of pins of the second die site to the second die. The first and second die are encapsulated. An isolation cut is performed to isolate the plurality of pins of the first die site from the plurality of pins of the second die site, while maintaining electrical connection between the first tie bar of the first die site and the first tie bar of the second die site. The first and second die are tested while providing a first power supply source to the first and second die via the first tie bars. After testing, the dies sites are fully singulated to result in packaged IC device.

Abstract: The disclosed materials, methods, and apparatus, provide novel ultra-high temperature materials (UHTM) in fibrous forms/structures; such “fibrous materials” can take various forms, such as individual filaments, short-shaped fiber, tows, ropes, wools, textiles, lattices, nano/microstructures, mesostructured materials, and sponge-like materials. At least four important classes of UHTM materials are disclosed in this invention: (1) carbon, doped-carbon and carbon alloy materials, (2) materials within the boron-carbon-nitride-X system, (3) materials within the silicon-carbon-nitride-X system, and (4) highly-refractory materials within the tantalum-hafnium-carbon-nitride-X and tantalum-hafnium-carbon-boron-nitride-X system. All of these material classes offer compounds/mixtures that melt or sublime at temperatures above 1800° C.—and in some cases are among the highest melting point materials known (exceeding 3000° C.).

Abstract: A stand mixer is provided with wheels proximate the base. The base houses a mixing bowl capable of being placed into a locked position. When the mixing bowl is in the locked position, its handle faces outward. The mixer can be lifted with the handle to transfer the weight of the stand mixer from the feet to the wheels. The stand mixer can then be moved into a desired position.

Abstract: A method and structure that protects interior electrical components of a pressure sensor (4) from corrosive particles using a sacrificial gel dome (30) to form a vent (34) in a protective gel (32) that covers electrical components that can be corroded such as wires (16), bond pads (18), and electrical leads (14). Sacrificial gel dome (30) is dispensed over a diaphragm (28) of pressure sensor (4) to form vent (34) enabling diaphragm (28) to sense pressure variations without the influence of protective gel (32). Sacrificial gel dome (30) is removed through a water rinsing process (42) to expose vent (34).

Abstract: A stand mixer is provided with wheels proximate the base. The base houses a mixing bowl capable of being placed into a locked position. When the mixing bowl is in the locked position, its handle faces outward. The mixer can be lifted with the handle to transfer the weight of the stand mixer from the feet to the wheels. The stand mixer can then be moved into a desired position.

Abstract: A method and structure that protects interior electrical components of a pressure sensor (4) from corrosive particles using a sacrificial gel dome (30) to form a vent (34) in a protective gel (32) that covers electrical components that can be corroded such as wires (16), bond pads (18), and electrical leads (14). Sacrificial gel dome (30) is dispensed over a diaphragm (28) of pressure sensor (4) to form vent (34) enabling diaphragm (28) to sense pressure variations without the influence of protective gel (32). Sacrificial gel dome (30) is removed through a water rinsing process (42) to expose vent (34).