Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: A cap for an optical module includes features that aid in adhesive attachment. In some examples, the cap includes a standoff configured to initiate capillary action upon contacting adhesive on a substrate to move the cap toward the substrate and an alignment feature configured to control lateral movement of the cap with respect to the substrate as the capillary action moves the cap toward the substrate. In other examples, the cap includes a standoff configured to initiate movement of an adhesive away from a substrate via surface tension and wetting upon contacting the adhesive and an alignment feature is configured to control lateral movement of the cap with respect to the substrate as the adhesive moves away from the substrate.

Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

Abstract: A power generating system is disclosed. The power generating system comprises a solar cell, a support structure coupled to the solar cell and adapted to adjust the position of the solar cell, a first thermal sensor coupled to the solar cell and adapted to detect a first temperature at a first location on the solar cell, a second thermal sensor coupled to the solar cell and adapted to detect a second temperature at a second location on the solar cell, the second location spaced apart from the first location, and a control system. The control system is adapted to receive a first signal from the first thermal sensor and a second signal from the second thermal sensor, compare information conveyed in the first and second signals, and adjust the position of the solar cell by operating the support structure in response to information conveyed in the first and second signals.

Abstract: A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface and a second member surface of the second member. An inventive assembly includes mating surfaces with at least one surface formed with a series of parallel hierarchical channels configured to control stacking of the particles during pressing together of the surfaces. The surface is substantially free of any other hierarchical channels formed thereon.

Abstract: A thermal tracking system for a concentrating photovoltaic system is disclosed. The thermal tracking system comprises a photovoltaic receiver. The photovoltaic receiver comprises a photovoltaic laminate and a heat spreader. The thermal tracking system further comprises first and second thermal sensors coupled to the photovoltaic laminate and sensing two temperatures of the laminate. The thermal tracking system also comprises third and fourth thermal sensors positioned adjacent the heat spreader and sensing two temperatures near the heat spreader.

Abstract: A power generating system is disclosed. The power generating system comprises a solar cell, a support structure coupled to the solar cell and adapted to adjust the position of the solar cell, a first thermal sensor coupled to the solar cell and adapted to detect a first temperature at a first location on the solar cell, a second thermal sensor coupled to the solar cell and adapted to detect a second temperature at a second location on the solar cell, the second location spaced apart from the first location, and a control system. The control system is adapted to receive a first signal from the first thermal sensor and a second signal from the second thermal sensor, compare information conveyed in the first and second signals, and adjust the position of the solar cell by operating the support structure in response to information conveyed in the first and second signals.

Abstract: The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for configuring of such an integrated circuit stack (1) by optimizing a configuration of the cooling layer (3).

Abstract: A power generating system is disclosed. The power generating system comprises a solar cell, a support structure coupled to the solar cell and adapted to adjust the position of the solar cell, a first thermal sensor coupled to the solar cell and adapted to detect a first temperature at a first location on the solar cell, a second thermal sensor coupled to the solar cell and adapted to detect a second temperature at a second location on the solar cell, the second location spaced apart from the first location, and a control system. The control system is adapted to receive a first signal from the first thermal sensor and a second signal from the second thermal sensor, compare information conveyed in the first and second signals, and adjust the position of the solar cell by operating the support structure in response to information conveyed in the first and second signals.

Abstract: A sag-bending system is disclosed. The sag-bending system comprises a sag-bending glass support mold and a perimeter thermal manager. The sag-bending glass support mold has a quadrilateral shape, a collective upper surface, and a periphery. The support mold comprises a plurality of rib members extending in a first direction, each of the plurality of rib members having a curved upper surface shaped to form the collective upper surface having a position and shape to support a quadrilateral-shaped sag-bent glass sheet into a desired contour, each of the rib members further having a lower surface, and a plurality of support members extending in a second direction between at least two of the plurality of rib members, the second direction traverse to the first direction.

Abstract: A sag-bending system is disclosed. The sag-bending system comprises a sag-bending glass support mold and a perimeter thermal manager. The support mold comprises a plurality of rib members extending in a first direction, each of the plurality of rib members having a curved upper surface shaped to form the collective upper surface having a position and shape to support a quadrilateral-shaped sag-bent glass sheet into a desired contour, each of the rib members further having a lower surface, and a plurality of support members extending in a second direction between at least two of the plurality of rib members, the second direction traverse to the first direction. The perimeter thermal manager is sized and positioned to surround, to extend at least partially over, and to extend at least partially under the periphery of the support mold.

Abstract: A sag-bending system is disclosed. The sag-bending system comprises a sag-bending glass support mold and a perimeter thermal manager. The support mold comprises a plurality of rib members extending in a first direction, each of the plurality of rib members having a curved upper surface shaped to form the collective upper surface having a position and shape to support a quadrilateral-shaped sag-bent glass sheet into a desired contour, each of the rib members further having a lower surface, and a plurality of support members extending in a second direction between at least two of the plurality of rib members, the second direction traverse to the first direction. The perimeter thermal manager is sized and positioned to surround, to extend at least partially over, and to extend at least partially under the periphery of the support mold.

Abstract: A thermal tracking system for a concentrating photovoltaic system is disclosed. The thermal tracking system comprises a photovoltaic receiver. The photovoltaic receiver comprises a photovoltaic laminate and a heat spreader. The thermal tracking system further comprises first and second thermal sensors coupled to the photovoltaic laminate and sensing two temperatures of the laminate. The thermal tracking system also comprises third and fourth thermal sensors positioned adjacent the heat spreader and sensing two temperatures near the heat spreader.

Abstract: The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).