Patents by Inventor Ryan J. Linderman
Ryan J. Linderman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120331433Abstract: The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).Type: ApplicationFiled: August 7, 2012Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Hugo E. Rothuizen
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Publication number: 20120273183Abstract: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michel Bruno, Thomas Brunschwiler, Urs Kloter, Ryan J. Linderman, Erich Ruetsche
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Patent number: 8107234Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.Type: GrantFiled: June 4, 2010Date of Patent: January 31, 2012Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Patent number: 8004832Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.Type: GrantFiled: June 4, 2010Date of Patent: August 23, 2011Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Patent number: 7872867Abstract: An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.Type: GrantFiled: September 2, 2008Date of Patent: January 18, 2011Assignee: International Business Machines CorporationInventors: Thomas Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen, Reto Waelchli
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Patent number: 7866173Abstract: Disclosed herein is a server system having a plurality of computer systems and a liquid cooling system. The computer systems are capable of operating in a first mode of operation at a first operating speed and a first temperature. The computer systems are further capable of operating in a second mode of operation at a second operating speed and a second temperature. The server system switches from the second mode and the first mode in response to a request for processing services rising above a first threshold. The server system further uses a cold battery to store coolant during times of low demand and releases coolant from said cold battery when the system switches to the first mode.Type: GrantFiled: February 28, 2008Date of Patent: January 11, 2011Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Patent number: 7808780Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.Type: GrantFiled: February 28, 2008Date of Patent: October 5, 2010Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Publication number: 20100246117Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.Type: ApplicationFiled: June 4, 2010Publication date: September 30, 2010Applicant: INTERNATIONAL BUSINESS MACHINES COPORATIONInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Publication number: 20100241278Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.Type: ApplicationFiled: June 4, 2010Publication date: September 23, 2010Applicant: INTERNATIONAL BUSINESS MACHINES COPORATIONInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Publication number: 20100053890Abstract: An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.Type: ApplicationFiled: September 2, 2008Publication date: March 4, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen, Reto Waelchli
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Publication number: 20100044005Abstract: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michel Bruno, Thomas Brunschwiler, Urs Kloter, Ryan J. Linderman, Erich Ruetsche
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Publication number: 20090234705Abstract: Disclosed herein is a server system having a plurality of computer systems and a liquid cooling system. The computer systems are capable of operating in a first mode of operation at a first operating speed and a first temperature. The computer systems are further capable of operating in a second mode of operation at a second operating speed and a second temperature. The server system switches from the second mode and the first mode in response to a request for processing services rising above a first threshold. The server system further uses a cold battery to store coolant during times of low demand and releases coolant from said cold battery when the system switches to the first mode.Type: ApplicationFiled: February 28, 2008Publication date: September 17, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Publication number: 20090218078Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.Type: ApplicationFiled: February 28, 2008Publication date: September 3, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
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Publication number: 20090154107Abstract: A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface and a second member surface of the second member. An inventive assembly includes mating surfaces with at least one surface formed with a series of parallel hierarchical channels configured to control stacking of the particles during pressing together of the surfaces. The surface is substantially free of any other hierarchical channels formed thereon.Type: ApplicationFiled: December 17, 2007Publication date: June 18, 2009Applicant: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Ryan J. Linderman, Erich M. Ruetsche
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Patent number: 7532475Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.Type: GrantFiled: March 30, 2006Date of Patent: May 12, 2009Assignee: International Business Machines CorporationInventors: Bruno Michel, Thomas J. Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen, Urs Kloter