Abstract: In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.

Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.

Abstract: Various aspects of this disclosure describe measuring timing slack using an endpoint criticality sensor on a chip. A sensor circuit is attached to sensitive endpoints on the chip (e.g., logical gates in a timing critical path) so that the sensor circuit receives the endpoint's data signal and clock signal. The sensor circuit introduces skew between the data signal and the clock signal by delaying the data signal more than the clock signal, and compares skewed data signals to determine if an error occurs because of the induced skew. By delaying the data signal with different delay amounts and monitoring what delays cause errors, an amount of timing slack in the data signal and clock signal (e.g., margin to criticality) is measured during operation of the chip for relevant circuitry to the system implemented on the chip, compared to test circuitry operating while the chip is in a test mode.

Abstract: Aspects of an integrated circuit are disclosed. The integrated circuit includes a first circuit configured to be powered by a first voltage source, a second circuit configured to be powered by a second voltage source, a decoupling capacitor, and a controller configured to switch the decoupling capacitor between the first and second voltage source.

Abstract: A method of setting a supply voltage in a device is disclosed. The method includes receiving a first plurality of inputs from a plurality of sensors that are representative of a gate delay of a signal path on the device, and receiving a second plurality of inputs from a plurality of temperature sensors. The method further includes estimating a plurality of interconnect delays for the signal path based on the second plurality of inputs, and determining the supply voltage for the signal path based on the first plurality of inputs and the plurality of interconnect delays.

Abstract: Techniques for estimating state-dependent capacitance of a circuit are described herein. In one embodiment, a method for determining a circuit state for a circuit comprises determining a capacitance of the circuit for each one of a plurality of circuit states, and selecting one of the circuit states based on the determined capacitances.

Abstract: In one embodiment, an apparatus comprises a capacitor and a die. The die comprises a resistor switch coupled between a power line and the capacitor, wherein the resistor switch has an adjustable resistance, and the power line and the capacitor are both external to the die. The die also comprises a circuit configured to receive power from the power line, and a controller configured to open the resistor switch if the power line is powered down.

Abstract: In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.

Abstract: A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane.

Abstract: Systems and methods for controlling a frequency of a clock signal by selectively swallowing pulses in the clock signal are described herein. In one embodiment, a method for adjusting a frequency of a clock signal comprises receiving the clock signal, and swallowing pulses in the clock signal according to a repeating clock-swallowing pattern, wherein the pattern is defined by a sequence of numbers.

Abstract: A method of setting a supply voltage in a device is disclosed. The method includes receiving a first plurality of inputs from a plurality of sensors that are representative of a gate delay of a signal path on the device, and receiving a second plurality of inputs from a plurality of temperature sensors. The method further includes estimating a plurality of interconnect delays for the signal path based on the second plurality of inputs, and determining the supply voltage for the signal path based on the first plurality of inputs and the plurality of interconnect delays.

Abstract: Circuits and methods for reducing leakage are provided. In one example, a system includes circuitry to reset a particular logic circuit to a state of reduced leakage. The state of reduced leakage would be known beforehand for the logic circuit. In this example, the logic circuit includes the combinational logic as well as flip flops that output a state to the combinational logic. Some of the flip flops are “SET” flip flops (assuming a 1 output value when a reset input is asserted) and some of the flip flops are “RESET” flip flops (assuming a 0 value when a reset input is asserted). The flip flops are chosen as inputs to the combinational logic so that the particular combination of zeros and ones output to the combinational logic puts the logic circuit in a state that is correlated with a desired level of leakage.

Abstract: In one embodiment, an apparatus comprises a capacitor and a die. The die comprises a resistor switch coupled between a power line and the capacitor, wherein the resistor switch has an adjustable resistance, and the power line and the capacitor are both external to the die. The die also comprises a circuit configured to receive power from the power line, and a controller configured to open the resistor switch if the power line is powered down.

Abstract: Techniques for determining the voltage-dependent capacitance of a circuit are described herein. In one embodiment, a method for determining voltage-dependent capacitance of a circuit comprises measuring a parameter of the circuit at each one of a plurality of voltages, and, for each voltage, determining a capacitance of the circuit at the voltage by fitting a resistor-capacitor (RC) model of the circuit to the measured parameter of the circuit at the voltage.

Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.

Abstract: In one embodiment, an apparatus comprises a capacitor and a die. The die comprises a resistor switch coupled between a power line and the capacitor, wherein the resistor switch has an adjustable resistance, and the power line and the capacitor are both external to the die. The die also comprises a circuit configured to receive power from the power line.

Abstract: A method for powering up a circuit comprising a plurality of sections of progressively increasing size is described. The method comprises receiving a signal for powering up the circuit, and, in response to the signal, sequentially powering up the plurality of sections in an order of increasing size.

Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.

Abstract: Circuits and methods for reducing leakage are provided. In one example, a system includes circuitry to reset a particular logic circuit to a state of reduced leakage. The state of reduced leakage would be known beforehand for the logic circuit. In this example, the logic circuit includes the combinational logic as well as flip flops that output a state to the combinational logic. Some of the flip flops are “SET” flip flops (assuming a 1 output value when a reset input is asserted) and some of the flip flops are “RESET” flip flops (assuming a 0 value when a reset input is asserted). The flip flops are chosen as inputs to the combinational logic so that the particular combination of zeros and ones output to the combinational logic puts the logic circuit in a state that is correlated with a desired level of leakage.

Abstract: Systems and methods for controlling a frequency of a clock signal by selectively swallowing pulses in the clock signal are described herein. In one embodiment, a method for adjusting a frequency of a clock signal comprises receiving the clock signal, and swallowing pulses in the clock signal according to a repeating clock-swallowing pattern, wherein the pattern is defined by a sequence of numbers.